SE407307B - Forfarande for etsning av en massa av kisel - Google Patents
Forfarande for etsning av en massa av kiselInfo
- Publication number
- SE407307B SE407307B SE7504757A SE7504757A SE407307B SE 407307 B SE407307 B SE 407307B SE 7504757 A SE7504757 A SE 7504757A SE 7504757 A SE7504757 A SE 7504757A SE 407307 B SE407307 B SE 407307B
- Authority
- SE
- Sweden
- Prior art keywords
- silicone
- corrosion
- procedure
- mass
- Prior art date
Links
- 238000005260 corrosion Methods 0.000 title 1
- 230000007797 corrosion Effects 0.000 title 1
- 238000000034 method Methods 0.000 title 1
- 229920001296 polysiloxane Polymers 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
- H01L21/321—After treatment
- H01L21/3213—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer
- H01L21/32133—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer by chemical means only
- H01L21/32134—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer by chemical means only by liquid etching only
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S148/00—Metal treatment
- Y10S148/043—Dual dielectric
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S148/00—Metal treatment
- Y10S148/051—Etching
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S148/00—Metal treatment
- Y10S148/053—Field effect transistors fets
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S148/00—Metal treatment
- Y10S148/118—Oxide films
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S148/00—Metal treatment
- Y10S148/122—Polycrystalline
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S148/00—Metal treatment
- Y10S148/151—Simultaneous diffusion
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S438/00—Semiconductor device manufacturing: process
- Y10S438/914—Doping
- Y10S438/924—To facilitate selective etching
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S438/00—Semiconductor device manufacturing: process
- Y10S438/978—Semiconductor device manufacturing: process forming tapered edges on substrate or adjacent layers
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Ceramic Engineering (AREA)
- Electrodes Of Semiconductors (AREA)
- Weting (AREA)
- Photovoltaic Devices (AREA)
- Semiconductor Integrated Circuits (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB18165/74A GB1501114A (en) | 1974-04-25 | 1974-04-25 | Method of making a semiconductor device |
Publications (2)
Publication Number | Publication Date |
---|---|
SE7504757L SE7504757L (sv) | 1975-10-27 |
SE407307B true SE407307B (sv) | 1979-03-19 |
Family
ID=10107783
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SE7504757A SE407307B (sv) | 1974-04-25 | 1975-04-24 | Forfarande for etsning av en massa av kisel |
Country Status (10)
Families Citing this family (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4026733A (en) * | 1975-10-29 | 1977-05-31 | Intel Corporation | Process for defining polycrystalline silicon patterns |
NL7612883A (nl) * | 1976-11-19 | 1978-05-23 | Philips Nv | Halfgeleiderinrichting, en werkwijze ter ver- vaardiging daarvan. |
DE2751481C2 (de) * | 1976-11-22 | 1986-10-23 | Mostek Corp. (n.d.Ges.d.Staates Delaware), Carrollton, Tex. | Lastimpedanz für eine statische Halbleiterspeicherzelle |
US4125854A (en) * | 1976-12-02 | 1978-11-14 | Mostek Corporation | Symmetrical cell layout for static RAM |
US4050967A (en) * | 1976-12-09 | 1977-09-27 | Rca Corporation | Method of selective aluminum diffusion |
US4239559A (en) * | 1978-04-21 | 1980-12-16 | Hitachi, Ltd. | Method for fabricating a semiconductor device by controlled diffusion between adjacent layers |
US4201603A (en) * | 1978-12-04 | 1980-05-06 | Rca Corporation | Method of fabricating improved short channel MOS devices utilizing selective etching and counterdoping of polycrystalline silicon |
US4249968A (en) * | 1978-12-29 | 1981-02-10 | International Business Machines Corporation | Method of manufacturing a metal-insulator-semiconductor utilizing a multiple stage deposition of polycrystalline layers |
US4354309A (en) * | 1978-12-29 | 1982-10-19 | International Business Machines Corp. | Method of manufacturing a metal-insulator-semiconductor device utilizing a graded deposition of polycrystalline silicon |
FR2472268A1 (fr) * | 1979-12-21 | 1981-06-26 | Thomson Csf | Procede de formation de caisson dans des circuits integres |
US4285761A (en) * | 1980-06-30 | 1981-08-25 | International Business Machines Corporation | Process for selectively forming refractory metal silicide layers on semiconductor devices |
US4372803A (en) * | 1980-09-26 | 1983-02-08 | The United States Of America As Represented By The Secretary Of The Navy | Method for etch thinning silicon devices |
US4438556A (en) * | 1981-01-12 | 1984-03-27 | Tokyo Shibaura Denki Kabushiki Kaisha | Method of forming doped polycrystalline silicon pattern by selective implantation and plasma etching of undoped regions |
FR2515427A1 (fr) * | 1981-10-27 | 1983-04-29 | Efcis | Procede de fabrication de resistances de forte valeur pour circuits integres |
US4868631A (en) * | 1985-11-18 | 1989-09-19 | Texas Instruments Incorporated | Bipolar transistor with shallow junctions and capable of high packing density |
JPS63184364A (ja) * | 1987-01-27 | 1988-07-29 | Toshiba Corp | 半導体装置の製造方法 |
KR900005871B1 (ko) * | 1987-09-21 | 1990-08-13 | 삼성전자 주식회사 | 반도체 메모리소자의 제조방법 |
US5136344A (en) * | 1988-11-02 | 1992-08-04 | Universal Energy Systems, Inc. | High energy ion implanted silicon on insulator structure |
DE68903951T2 (de) * | 1989-08-16 | 1993-07-08 | Ibm | Verfahren fuer die herstellung mikromechanischer messfuehler fuer afm/stm-profilometrie und mikromechanischer messfuehlerkopf. |
KR0167271B1 (ko) * | 1995-11-30 | 1998-12-15 | 문정환 | 비균등 도우프 채널 구조를 갖는 반도체소자의 제조방법 |
US5869399A (en) * | 1997-08-07 | 1999-02-09 | Mosel Vitelic Inc. | Method for increasing utilizable surface of rugged polysilicon layer in semiconductor device |
US7247578B2 (en) * | 2003-12-30 | 2007-07-24 | Intel Corporation | Method of varying etch selectivities of a film |
WO2017007554A2 (en) * | 2015-06-09 | 2017-01-12 | Georgia Tech Research Corporation | Devices with organic semiconductor layers electrically-doped over a controlled depth |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3160539A (en) * | 1958-09-08 | 1964-12-08 | Trw Semiconductors Inc | Surface treatment of silicon |
US3675319A (en) * | 1970-06-29 | 1972-07-11 | Bell Telephone Labor Inc | Interconnection of electrical devices |
US3738880A (en) * | 1971-06-23 | 1973-06-12 | Rca Corp | Method of making a semiconductor device |
JPS498181A (US06633600-20031014-M00021.png) * | 1972-05-10 | 1974-01-24 | ||
US3846198A (en) * | 1972-10-02 | 1974-11-05 | Rca Corp | Method of making semiconductor devices having thin active regions of the semiconductor material |
US3847687A (en) * | 1972-11-15 | 1974-11-12 | Motorola Inc | Methods of forming self aligned transistor structure having polycrystalline contacts |
US3830665A (en) * | 1972-12-07 | 1974-08-20 | Motorola Inc | Method for delineating semiconductor junctions |
-
1974
- 1974-04-25 GB GB18165/74A patent/GB1501114A/en not_active Expired
-
1975
- 1975-04-16 IN IN762/CAL/75A patent/IN144756B/en unknown
- 1975-04-21 FR FR7512360A patent/FR2269199A1/fr not_active Withdrawn
- 1975-04-21 IT IT22591/75A patent/IT1037558B/it active
- 1975-04-21 BE BE155617A patent/BE828188A/xx unknown
- 1975-04-22 DE DE2517690A patent/DE2517690B2/de not_active Withdrawn
- 1975-04-24 JP JP50050586A patent/JPS50145081A/ja active Pending
- 1975-04-24 SE SE7504757A patent/SE407307B/xx unknown
- 1975-04-24 US US05/571,106 patent/US3980507A/en not_active Expired - Lifetime
- 1975-04-25 CA CA225,450A patent/CA1050866A/en not_active Expired
Also Published As
Publication number | Publication date |
---|---|
GB1501114A (en) | 1978-02-15 |
FR2269199A1 (US06633600-20031014-M00021.png) | 1975-11-21 |
IT1037558B (it) | 1979-11-20 |
CA1050866A (en) | 1979-03-20 |
DE2517690B2 (de) | 1979-05-17 |
US3980507A (en) | 1976-09-14 |
BE828188A (fr) | 1975-08-18 |
JPS50145081A (US06633600-20031014-M00021.png) | 1975-11-21 |
DE2517690A1 (de) | 1975-11-13 |
SE7504757L (sv) | 1975-10-27 |
IN144756B (US06633600-20031014-M00021.png) | 1978-07-01 |
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