SE405812B - Forfarande for tillverkning av hallarelement av kisel eller kiselkarbid - Google Patents

Forfarande for tillverkning av hallarelement av kisel eller kiselkarbid

Info

Publication number
SE405812B
SE405812B SE7412432A SE7412432A SE405812B SE 405812 B SE405812 B SE 405812B SE 7412432 A SE7412432 A SE 7412432A SE 7412432 A SE7412432 A SE 7412432A SE 405812 B SE405812 B SE 405812B
Authority
SE
Sweden
Prior art keywords
silicel
hallere
carbid
silicone
procedure
Prior art date
Application number
SE7412432A
Other languages
English (en)
Other versions
SE7412432L (sv
Inventor
W Dietze
G Bachmann
Original Assignee
Siemens Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Ag filed Critical Siemens Ag
Publication of SE7412432L publication Critical patent/SE7412432L/xx
Publication of SE405812B publication Critical patent/SE405812B/sv

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67303Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements
    • H01L21/67306Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements characterized by a material, a roughness, a coating or the like
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/22Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B31/00Diffusion or doping processes for single crystals or homogeneous polycrystalline material with defined structure; Apparatus therefor
    • C30B31/06Diffusion or doping processes for single crystals or homogeneous polycrystalline material with defined structure; Apparatus therefor by contacting with diffusion material in the gaseous state
    • C30B31/14Substrate holders or susceptors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67313Horizontal boat type carrier whereby the substrates are vertically supported, e.g. comprising rod-shaped elements
    • H01L21/67316Horizontal boat type carrier whereby the substrates are vertically supported, e.g. comprising rod-shaped elements characterized by a material, a roughness, a coating or the like

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Materials Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Inorganic Chemistry (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Chemical Vapour Deposition (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Silicon Compounds (AREA)
SE7412432A 1973-10-02 1974-10-02 Forfarande for tillverkning av hallarelement av kisel eller kiselkarbid SE405812B (sv)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2349512A DE2349512C3 (de) 1973-10-02 1973-10-02 Verfahren zum Herstellen von Halterungen aus Silicium oder Siliciumcarbid für Diffusions- und Temperprozesse

Publications (2)

Publication Number Publication Date
SE7412432L SE7412432L (sv) 1975-04-03
SE405812B true SE405812B (sv) 1979-01-08

Family

ID=5894341

Family Applications (1)

Application Number Title Priority Date Filing Date
SE7412432A SE405812B (sv) 1973-10-02 1974-10-02 Forfarande for tillverkning av hallarelement av kisel eller kiselkarbid

Country Status (9)

Country Link
US (1) US4203940A (sv)
JP (1) JPS5428261B2 (sv)
BE (1) BE816507A (sv)
CA (1) CA1035209A (sv)
CH (1) CH606477A5 (sv)
DE (1) DE2349512C3 (sv)
FR (1) FR2245573B1 (sv)
GB (1) GB1438877A (sv)
SE (1) SE405812B (sv)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5226173A (en) * 1975-08-22 1977-02-26 Hitachi Ltd Manufacturing method of disc wafer casing jig
JPS5263363U (sv) * 1975-11-05 1977-05-10
JPS5529518U (sv) * 1978-08-17 1980-02-26
JPS60138914A (ja) * 1983-12-26 1985-07-23 Toshiba Ceramics Co Ltd 半導体拡散炉管の製造方法
EP0309272A3 (en) * 1987-09-25 1990-03-07 Southtech, Inc. Apparatus and method for sample holders and wafer cages fabricated from silicon carbide for processing semiconductor materials
JP2701615B2 (ja) * 1991-09-27 1998-01-21 三井造船株式会社 半導体拡散炉用ウェハボートの製造方法
US5538230A (en) * 1994-08-08 1996-07-23 Sibley; Thomas Silicon carbide carrier for wafer processing
US5443649A (en) * 1994-11-22 1995-08-22 Sibley; Thomas Silicon carbide carrier for wafer processing in vertical furnaces
WO1996035228A1 (en) * 1995-05-05 1996-11-07 Saint-Gobain Industrial Ceramics, Inc. Slip free vertical rack design
US5817179A (en) * 1997-01-23 1998-10-06 Samsung Electronics Co., Ltd. GaAs anneal boat design and method for use
DE19856468C1 (de) * 1998-11-30 2000-06-15 Sico Jena Gmbh Quarzschmelze Verfahren zur Herstellung einer Haltevorrichtung für Halbleiterscheiben
US6673198B1 (en) 1999-12-22 2004-01-06 Lam Research Corporation Semiconductor processing equipment having improved process drift control
US6563215B1 (en) 2000-01-10 2003-05-13 Micron Technology, Inc. Silicon carbide interconnect for semiconductor components and method of fabrication
US6975030B1 (en) 2000-01-10 2005-12-13 Micron Technology, Inc. Silicon carbide contact for semiconductor components
US7033920B1 (en) 2000-01-10 2006-04-25 Micron Technology, Inc. Method for fabricating a silicon carbide interconnect for semiconductor components
US20040173948A1 (en) * 2002-09-19 2004-09-09 Pandelisev Kiril A. Process and apparatus for silicon boat, silicon tubing and other silicon based member fabrication
CN1152422C (zh) * 2002-04-25 2004-06-02 张彩根 制造晶片用的碳化硅舟的切割制造方法
WO2021157722A1 (ja) * 2020-02-07 2021-08-12 京セラ株式会社 ウェハーボート

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AT180726B (de) * 1952-12-19 1955-01-10 Victor Fuchs Verfahren zur Herstellung von gefüllten Behältern, Tuben od. dgl.
DE1137807B (de) * 1961-06-09 1962-10-11 Siemens Ag Verfahren zur Herstellung von Halbleiteranordnungen durch einkristalline Abscheidung von Halbleitermaterial aus der Gasphase
US3480151A (en) * 1967-04-05 1969-11-25 Heraeus Schott Quarzschmelze Supporting rack of quartz
US3534862A (en) * 1968-09-13 1970-10-20 Rca Corp Semiconductor wafer transporting jig
US3850296A (en) * 1971-07-21 1974-11-26 Shinetsu Handotai Kk Device and method for accommodating semiconductor wafers

Also Published As

Publication number Publication date
JPS5062579A (sv) 1975-05-28
FR2245573A1 (sv) 1975-04-25
DE2349512C3 (de) 1978-06-08
BE816507A (fr) 1974-10-16
DE2349512B2 (de) 1977-10-13
FR2245573B1 (sv) 1978-03-31
GB1438877A (en) 1976-06-09
US4203940A (en) 1980-05-20
CH606477A5 (sv) 1978-10-31
JPS5428261B2 (sv) 1979-09-14
SE7412432L (sv) 1975-04-03
CA1035209A (en) 1978-07-25
DE2349512A1 (de) 1975-04-24

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