SE394344B - Anordning for kylning av halvledarkomponenter - Google Patents

Anordning for kylning av halvledarkomponenter

Info

Publication number
SE394344B
SE394344B SE7317603A SE7317603A SE394344B SE 394344 B SE394344 B SE 394344B SE 7317603 A SE7317603 A SE 7317603A SE 7317603 A SE7317603 A SE 7317603A SE 394344 B SE394344 B SE 394344B
Authority
SE
Sweden
Prior art keywords
cooling
semiconductor components
semiconductor
components
Prior art date
Application number
SE7317603A
Other languages
English (en)
Swedish (sv)
Inventor
B Voboril
P Reichel
P Kafunek
Original Assignee
Ckd Praha
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ckd Praha filed Critical Ckd Praha
Publication of SE394344B publication Critical patent/SE394344B/xx

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427Cooling by change of state, e.g. use of heat pipes
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F13/003Arrangements for modifying heat-transfer, e.g. increasing, decreasing by using permeable mass, perforated or porous materials
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Thermal Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Dispersion Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Details Of Measuring And Other Instruments (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
SE7317603A 1972-12-28 1973-12-28 Anordning for kylning av halvledarkomponenter SE394344B (sv)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CS9004A CS159563B1 (US07413550-20080819-C00001.png) 1972-12-28 1972-12-28

Publications (1)

Publication Number Publication Date
SE394344B true SE394344B (sv) 1977-06-20

Family

ID=5441334

Family Applications (1)

Application Number Title Priority Date Filing Date
SE7317603A SE394344B (sv) 1972-12-28 1973-12-28 Anordning for kylning av halvledarkomponenter

Country Status (9)

Country Link
US (1) US3952797A (US07413550-20080819-C00001.png)
JP (1) JPS5422875B2 (US07413550-20080819-C00001.png)
CH (1) CH565453A5 (US07413550-20080819-C00001.png)
CS (1) CS159563B1 (US07413550-20080819-C00001.png)
DD (1) DD108173A5 (US07413550-20080819-C00001.png)
DE (1) DE2364773C2 (US07413550-20080819-C00001.png)
FR (1) FR2327640A1 (US07413550-20080819-C00001.png)
GB (1) GB1413922A (US07413550-20080819-C00001.png)
SE (1) SE394344B (US07413550-20080819-C00001.png)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5239849A (en) * 1975-09-25 1977-03-28 Meidensha Electric Mfg Co Ltd Cooling apparatus
GB2066487B (en) * 1979-12-18 1983-11-23 Philips Electronic Associated Alignment of exposure masks
US4694119A (en) * 1983-09-07 1987-09-15 Sundstrand Data Control, Inc. Heat shielded memory unit for an aircraft flight data recorder
GB2151769B (en) * 1983-12-21 1987-11-04 Marconi Electronic Devices Heat sink arrangement
DE3642723A1 (de) * 1986-12-13 1988-06-23 Grundfos Int Statischer frequenzumrichter, insbesondere frequenzumrichter zur steuerung und/oder regelung von leistungsgroessen eines elektromotors
DE3642729C3 (de) * 1986-12-13 1997-05-07 Grundfos Int Pumpenaggregat zur Förderung von Flüssigkeiten oder Gasen
DE3642726A1 (de) * 1986-12-13 1988-06-23 Grundfos Int Drehzahlgeregeltes pumpenaggregat
DE3642727A1 (de) * 1986-12-13 1988-06-23 Grundfos Int Unterwasser-motorpumpe
US5308920A (en) * 1992-07-31 1994-05-03 Itoh Research & Development Laboratory Co., Ltd. Heat radiating device
US5289694A (en) * 1993-02-26 1994-03-01 At&T Bell Laboratories Circuit card mounting assembly
US5472043A (en) * 1994-03-22 1995-12-05 Aavid Laboratories, Inc. Two-phase component cooler with radioactive initiator
US20040011509A1 (en) * 2002-05-15 2004-01-22 Wing Ming Siu Vapor augmented heatsink with multi-wick structure
GB2404009B (en) * 2003-07-17 2005-06-15 Enfis Ltd Cooling method and apparatus
US7353860B2 (en) * 2004-06-16 2008-04-08 Intel Corporation Heat dissipating device with enhanced boiling/condensation structure
US20060196640A1 (en) * 2004-12-01 2006-09-07 Convergence Technologies Limited Vapor chamber with boiling-enhanced multi-wick structure
US8176972B2 (en) * 2006-08-31 2012-05-15 International Business Machines Corporation Compliant vapor chamber chip packaging
TW200848683A (en) * 2007-03-08 2008-12-16 Convergence Technologies Ltd Heat transfer device
RU2566679C1 (ru) * 2014-07-29 2015-10-27 Частное образовательное учреждение дополнительного профессионального образования "Саранский Дом науки и техники Российского Союза научных и инженерных общественных организаций" (ЧОУ ДПО "Саранский Дом науки и техники РСНИИОО") Система жидкостного охлаждения силового полупроводникового прибора
CN113513934B (zh) * 2021-06-30 2022-05-06 西安交通大学 一种基于双动力驱动强化传热的重力热管

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1714910U (de) * 1953-10-19 1956-01-12 Licentia Gmbh Elektrisch unsymmetrisch leitendes system.
US3298427A (en) * 1964-12-24 1967-01-17 Robert A Erb Method and apparatus for dropwise condensation
CA926033A (en) * 1969-04-01 1973-05-08 Sebastian W. Kessler, Jr. Device transcalent assembly
SE354943B (US07413550-20080819-C00001.png) * 1970-02-24 1973-03-26 Asea Ab
SE350874B (US07413550-20080819-C00001.png) * 1970-03-05 1972-11-06 Asea Ab
US3673306A (en) * 1970-11-02 1972-06-27 Trw Inc Fluid heat transfer method and apparatus for semi-conducting devices
US3834454A (en) * 1971-02-13 1974-09-10 Bbc Brown Boveri & Cie Cooling arrangement for thyristor discs
CH528817A (de) * 1971-03-11 1972-09-30 Bbc Brown Boveri & Cie Halter für mindestens ein scheibenförmiges Halbleiterelement
US3739235A (en) * 1972-01-31 1973-06-12 Rca Corp Transcalent semiconductor device

Also Published As

Publication number Publication date
DE2364773C2 (de) 1982-06-24
FR2327640B1 (US07413550-20080819-C00001.png) 1978-03-24
DD108173A5 (US07413550-20080819-C00001.png) 1974-09-05
GB1413922A (en) 1975-11-12
CH565453A5 (US07413550-20080819-C00001.png) 1975-08-15
JPS5422875B2 (US07413550-20080819-C00001.png) 1979-08-09
CS159563B1 (US07413550-20080819-C00001.png) 1975-01-31
US3952797A (en) 1976-04-27
FR2327640A1 (fr) 1977-05-06
JPS4998584A (US07413550-20080819-C00001.png) 1974-09-18
DE2364773A1 (de) 1974-07-11

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