SE376905B - - Google Patents

Info

Publication number
SE376905B
SE376905B SE7112585A SE1258571A SE376905B SE 376905 B SE376905 B SE 376905B SE 7112585 A SE7112585 A SE 7112585A SE 1258571 A SE1258571 A SE 1258571A SE 376905 B SE376905 B SE 376905B
Authority
SE
Sweden
Application number
SE7112585A
Inventor
M J Pryor
J M Poppelwell
Original Assignee
Olin Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Olin Corp filed Critical Olin Corp
Publication of SE376905B publication Critical patent/SE376905B/xx

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23D—ENAMELLING OF, OR APPLYING A VITREOUS LAYER TO, METALS
    • C23D5/00—Coating with enamels or vitreous layers
    • A—HUMAN NECESSITIES
    • A47—FURNITURE; DOMESTIC ARTICLES OR APPLIANCES; COFFEE MILLS; SPICE MILLS; SUCTION CLEANERS IN GENERAL
    • A47J—KITCHEN EQUIPMENT; COFFEE MILLS; SPICE MILLS; APPARATUS FOR MAKING BEVERAGES
    • A47J36/00—Parts, details or accessories of cooking-vessels
    • A47J36/02—Selection of specific materials, e.g. heavy bottoms with copper inlay or with insulating inlay
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
    • B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C27/00—Joining pieces of glass to pieces of other inorganic material; Joining glass to glass other than by fusing
    • C03C27/02—Joining pieces of glass to pieces of other inorganic material; Joining glass to glass other than by fusing by fusing glass directly to metal
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23D—ENAMELLING OF, OR APPLYING A VITREOUS LAYER TO, METALS
    • C23D3/00—Chemical treatment of the metal surfaces prior to coating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y10T428/12861—Group VIII or IB metal-base component
    • Y10T428/12903—Cu-base component

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Food Science & Technology (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Joining Of Glass To Other Materials (AREA)
  • Ceramic Products (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
  • Glass Compositions (AREA)
SE7112585A 1970-10-07 1971-10-05 SE376905B (cs)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US7889970A 1970-10-07 1970-10-07

Publications (1)

Publication Number Publication Date
SE376905B true SE376905B (cs) 1975-06-16

Family

ID=22146889

Family Applications (1)

Application Number Title Priority Date Filing Date
SE7112585A SE376905B (cs) 1970-10-07 1971-10-05

Country Status (8)

Country Link
US (1) US3676292A (cs)
JP (1) JPS5523779B1 (cs)
BR (1) BR7105933D0 (cs)
CA (1) CA962063A (cs)
FR (1) FR2110284B1 (cs)
GB (1) GB1342270A (cs)
IT (1) IT944690B (cs)
SE (1) SE376905B (cs)

Families Citing this family (62)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3852148A (en) * 1970-10-07 1974-12-03 Olin Corp Architectural products formed of glass or ceramic-to-metal composites
US3766634A (en) * 1972-04-20 1973-10-23 Gen Electric Method of direct bonding metals to non-metallic substrates
US3871881A (en) * 1973-02-12 1975-03-18 Minnesota Mining & Mfg Coated aluminum substrates having a binder of aluminum hydroxyoxide
US3993411A (en) * 1973-06-01 1976-11-23 General Electric Company Bonds between metal and a non-metallic substrate
US4055451A (en) * 1973-08-31 1977-10-25 Alan Gray Cockbain Composite materials
US4149910A (en) * 1975-05-27 1979-04-17 Olin Corporation Glass or ceramic-to-metal composites or seals involving iron base alloys
US4109054A (en) * 1976-05-19 1978-08-22 Ferro Corporation Composites of glass-ceramic-to-metal, seals and method of making same
CH633391A5 (de) * 1978-11-22 1982-11-30 Bbc Brown Boveri & Cie Scheibenrotor fuer eine elektrische maschine.
US4393438A (en) * 1980-03-24 1983-07-12 Rca Corporation Porcelain coated metal boards having interconnections between the face and reverse surfaces thereof
US4461924A (en) * 1982-01-21 1984-07-24 Olin Corporation Semiconductor casing
US4410927A (en) * 1982-01-21 1983-10-18 Olin Corporation Casing for an electrical component having improved strength and heat transfer characteristics
US4500383A (en) * 1982-02-18 1985-02-19 Kabushiki Kaisha Meidensha Process for bonding copper or copper-chromium alloy to ceramics, and bonded articles of ceramics and copper or copper-chromium alloy
JPS58176182A (ja) * 1982-04-10 1983-10-15 日本特殊陶業株式会社 金属・セラミツクス接合体
US4570337A (en) * 1982-04-19 1986-02-18 Olin Corporation Method of assembling a chip carrier
US4866571A (en) * 1982-06-21 1989-09-12 Olin Corporation Semiconductor package
US4851615A (en) * 1982-04-19 1989-07-25 Olin Corporation Printed circuit board
EP0092019A3 (en) * 1982-04-19 1985-12-27 Olin Corporation Improved semiconductor package
US5014159A (en) * 1982-04-19 1991-05-07 Olin Corporation Semiconductor package
US4491622A (en) * 1982-04-19 1985-01-01 Olin Corporation Composites of glass-ceramic to metal seals and method of making the same
US4594770A (en) * 1982-07-15 1986-06-17 Olin Corporation Method of making semiconductor casing
US4480262A (en) * 1982-07-15 1984-10-30 Olin Corporation Semiconductor casing
US4656499A (en) * 1982-08-05 1987-04-07 Olin Corporation Hermetically sealed semiconductor casing
US4682414A (en) * 1982-08-30 1987-07-28 Olin Corporation Multi-layer circuitry
US4827377A (en) * 1982-08-30 1989-05-02 Olin Corporation Multi-layer circuitry
US4524238A (en) * 1982-12-29 1985-06-18 Olin Corporation Semiconductor packages
US4500605A (en) * 1983-02-17 1985-02-19 Olin Corporation Electrical component forming process
USRE32942E (en) * 1983-10-06 1989-06-06 Olin Corporation Low thermal expansivity and high thermal conductivity substrate
US4607276A (en) * 1984-03-08 1986-08-19 Olin Corporation Tape packages
US4736236A (en) * 1984-03-08 1988-04-05 Olin Corporation Tape bonding material and structure for electronic circuit fabrication
US4862323A (en) * 1984-04-12 1989-08-29 Olin Corporation Chip carrier
GB2157315A (en) * 1984-04-12 1985-10-23 Bruno Nutini Aluminium bronze alloy containing silicon
US4805009A (en) * 1985-03-11 1989-02-14 Olin Corporation Hermetically sealed semiconductor package
US4752521A (en) * 1984-09-19 1988-06-21 Olin Corporation Sealing glass composite
US4775647A (en) * 1984-09-19 1988-10-04 Olin Corporation Sealing glass composite
US4542259A (en) * 1984-09-19 1985-09-17 Olin Corporation High density packages
US4801488A (en) * 1984-09-19 1989-01-31 Olin Corporation Sealing glass composite
US4853491A (en) * 1984-10-03 1989-08-01 Olin Corporation Chip carrier
US4840654A (en) * 1985-03-04 1989-06-20 Olin Corporation Method for making multi-layer and pin grid arrays
US4906311A (en) * 1985-09-24 1990-03-06 John Fluke Co., Inc. Method of making a hermetically sealed electronic component
US4821151A (en) * 1985-12-20 1989-04-11 Olin Corporation Hermetically sealed package
US4771537A (en) * 1985-12-20 1988-09-20 Olin Corporation Method of joining metallic components
US4743299A (en) * 1986-03-12 1988-05-10 Olin Corporation Cermet substrate with spinel adhesion component
US4793967A (en) * 1986-03-12 1988-12-27 Olin Corporation Cermet substrate with spinel adhesion component
US4769345A (en) * 1987-03-12 1988-09-06 Olin Corporation Process for producing a hermetically sealed package for an electrical component containing a low amount of oxygen and water vapor
US4839716A (en) * 1987-06-01 1989-06-13 Olin Corporation Semiconductor packaging
US4796083A (en) * 1987-07-02 1989-01-03 Olin Corporation Semiconductor casing
DE3736843A1 (de) * 1987-10-30 1989-05-11 Asea Brown Boveri Verfahren zum verbinden von metallischen und keramischen werkstoffen
US4888449A (en) * 1988-01-04 1989-12-19 Olin Corporation Semiconductor package
US5103292A (en) * 1989-11-29 1992-04-07 Olin Corporation Metal pin grid array package
US5215610A (en) * 1991-04-04 1993-06-01 International Business Machines Corporation Method for fabricating superconductor packages
FR2708077B1 (fr) * 1993-07-23 1995-09-22 Pont A Mousson Insert de verrouillage électriquement isolant pour garniture d'étanchéité, garniture d'étanchéité correspondante, et procédé de fabrication de tels inserts.
US6323549B1 (en) 1996-08-29 2001-11-27 L. Pierre deRochemont Ceramic composite wiring structures for semiconductor devices and method of manufacture
CA2275972A1 (en) * 1996-12-30 1998-07-09 Peter H. Farmer Ceramic composite wiring structures for semiconductor devices and method of manufacture
US6037539A (en) * 1998-03-20 2000-03-14 Sandia Corporation Hermetic aluminum radio frequency interconnection and method for making
US7569933B2 (en) * 2004-08-27 2009-08-04 Electro Ceramic Industries Housing for accommodating microwave devices having an insulating cup member
CN100475100C (zh) * 2005-05-15 2009-04-08 范圣太 无机非金属抗裂处理方法及器皿
US20100288525A1 (en) * 2009-05-12 2010-11-18 Alcatel-Lucent Usa, Incorporated Electronic package and method of manufacture
US8358003B2 (en) * 2009-06-01 2013-01-22 Electro Ceramic Industries Surface mount electronic device packaging assembly
CN102185580A (zh) * 2010-01-18 2011-09-14 精工爱普生株式会社 电子装置、基板的制造方法以及电子装置的制造方法
DE102013215149A1 (de) 2013-08-01 2015-02-19 Conti Temic Microelectronic Gmbh Mehrstufiges Dichtsystem zum Einsatz in einem Kraftfahrzeugsteuergerät
JP6548731B2 (ja) 2014-12-22 2019-07-24 ショット アクチエンゲゼルシャフトＳｃｈｏｔｔ ＡＧ 改善された熱荷重耐久性を示すフィードスルーエレメントまたは接続エレメント
RU2623386C1 (ru) * 2016-04-13 2017-06-26 Акционерное общество "Научно-исследовательский институт "Полюс" им. М.Ф. Стельмаха" (АО НИИ "Полюс" им. М.Ф. Стельмаха) Способ герметичного соединения стеклокерамики с металлической деталью

Also Published As

Publication number Publication date
AU3312471A (en) 1973-03-15
DE2150092B2 (de) 1975-11-20
FR2110284B1 (cs) 1976-06-04
JPS5523779B1 (cs) 1980-06-25
IT944690B (it) 1973-04-20
GB1342270A (en) 1974-01-03
US3676292A (en) 1972-07-11
CA962063A (en) 1975-02-04
DE2150092A1 (de) 1972-04-13
BR7105933D0 (pt) 1973-03-29
FR2110284A1 (cs) 1972-06-02

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