IT944690B - Composito di vetro o ceramica con metallo e procedimento per formare lo stesso - Google Patents
Composito di vetro o ceramica con metallo e procedimento per formare lo stessoInfo
- Publication number
- IT944690B IT944690B IT52642/71A IT5264271A IT944690B IT 944690 B IT944690 B IT 944690B IT 52642/71 A IT52642/71 A IT 52642/71A IT 5264271 A IT5264271 A IT 5264271A IT 944690 B IT944690 B IT 944690B
- Authority
- IT
- Italy
- Prior art keywords
- ceramic
- composite
- procedure
- glass
- metal
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23D—ENAMELLING OF, OR APPLYING A VITREOUS LAYER TO, METALS
- C23D5/00—Coating with enamels or vitreous layers
-
- A—HUMAN NECESSITIES
- A47—FURNITURE; DOMESTIC ARTICLES OR APPLIANCES; COFFEE MILLS; SPICE MILLS; SUCTION CLEANERS IN GENERAL
- A47J—KITCHEN EQUIPMENT; COFFEE MILLS; SPICE MILLS; APPARATUS FOR MAKING BEVERAGES
- A47J36/00—Parts, details or accessories of cooking-vessels
- A47J36/02—Selection of specific materials, e.g. heavy bottoms with copper inlay or with insulating inlay
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
- B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C27/00—Joining pieces of glass to pieces of other inorganic material; Joining glass to glass other than by fusing
- C03C27/02—Joining pieces of glass to pieces of other inorganic material; Joining glass to glass other than by fusing by fusing glass directly to metal
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23D—ENAMELLING OF, OR APPLYING A VITREOUS LAYER TO, METALS
- C23D3/00—Chemical treatment of the metal surfaces prior to coating
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12771—Transition metal-base component
- Y10T428/12861—Group VIII or IB metal-base component
- Y10T428/12903—Cu-base component
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Life Sciences & Earth Sciences (AREA)
- Ceramic Engineering (AREA)
- Food Science & Technology (AREA)
- Geochemistry & Mineralogy (AREA)
- Joining Of Glass To Other Materials (AREA)
- Glass Compositions (AREA)
- Other Surface Treatments For Metallic Materials (AREA)
- Ceramic Products (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US7889970A | 1970-10-07 | 1970-10-07 |
Publications (1)
Publication Number | Publication Date |
---|---|
IT944690B true IT944690B (it) | 1973-04-20 |
Family
ID=22146889
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IT52642/71A IT944690B (it) | 1970-10-07 | 1971-09-02 | Composito di vetro o ceramica con metallo e procedimento per formare lo stesso |
Country Status (8)
Country | Link |
---|---|
US (1) | US3676292A (it) |
JP (1) | JPS5523779B1 (it) |
BR (1) | BR7105933D0 (it) |
CA (1) | CA962063A (it) |
FR (1) | FR2110284B1 (it) |
GB (1) | GB1342270A (it) |
IT (1) | IT944690B (it) |
SE (1) | SE376905B (it) |
Families Citing this family (62)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3852148A (en) * | 1970-10-07 | 1974-12-03 | Olin Corp | Architectural products formed of glass or ceramic-to-metal composites |
US3766634A (en) * | 1972-04-20 | 1973-10-23 | Gen Electric | Method of direct bonding metals to non-metallic substrates |
US3871881A (en) * | 1973-02-12 | 1975-03-18 | Minnesota Mining & Mfg | Coated aluminum substrates having a binder of aluminum hydroxyoxide |
US3993411A (en) * | 1973-06-01 | 1976-11-23 | General Electric Company | Bonds between metal and a non-metallic substrate |
US4055451A (en) * | 1973-08-31 | 1977-10-25 | Alan Gray Cockbain | Composite materials |
US4149910A (en) * | 1975-05-27 | 1979-04-17 | Olin Corporation | Glass or ceramic-to-metal composites or seals involving iron base alloys |
US4109054A (en) * | 1976-05-19 | 1978-08-22 | Ferro Corporation | Composites of glass-ceramic-to-metal, seals and method of making same |
CH633391A5 (de) * | 1978-11-22 | 1982-11-30 | Bbc Brown Boveri & Cie | Scheibenrotor fuer eine elektrische maschine. |
US4393438A (en) * | 1980-03-24 | 1983-07-12 | Rca Corporation | Porcelain coated metal boards having interconnections between the face and reverse surfaces thereof |
US4461924A (en) * | 1982-01-21 | 1984-07-24 | Olin Corporation | Semiconductor casing |
US4410927A (en) * | 1982-01-21 | 1983-10-18 | Olin Corporation | Casing for an electrical component having improved strength and heat transfer characteristics |
US4500383A (en) * | 1982-02-18 | 1985-02-19 | Kabushiki Kaisha Meidensha | Process for bonding copper or copper-chromium alloy to ceramics, and bonded articles of ceramics and copper or copper-chromium alloy |
JPS58176182A (ja) * | 1982-04-10 | 1983-10-15 | 日本特殊陶業株式会社 | 金属・セラミツクス接合体 |
CA1212484A (en) * | 1982-04-19 | 1986-10-07 | Sheldon H. Butt | Semiconductor package |
US4851615A (en) * | 1982-04-19 | 1989-07-25 | Olin Corporation | Printed circuit board |
US4570337A (en) * | 1982-04-19 | 1986-02-18 | Olin Corporation | Method of assembling a chip carrier |
US5014159A (en) * | 1982-04-19 | 1991-05-07 | Olin Corporation | Semiconductor package |
US4866571A (en) * | 1982-06-21 | 1989-09-12 | Olin Corporation | Semiconductor package |
US4491622A (en) * | 1982-04-19 | 1985-01-01 | Olin Corporation | Composites of glass-ceramic to metal seals and method of making the same |
US4594770A (en) * | 1982-07-15 | 1986-06-17 | Olin Corporation | Method of making semiconductor casing |
US4480262A (en) * | 1982-07-15 | 1984-10-30 | Olin Corporation | Semiconductor casing |
US4656499A (en) * | 1982-08-05 | 1987-04-07 | Olin Corporation | Hermetically sealed semiconductor casing |
US4827377A (en) * | 1982-08-30 | 1989-05-02 | Olin Corporation | Multi-layer circuitry |
US4682414A (en) * | 1982-08-30 | 1987-07-28 | Olin Corporation | Multi-layer circuitry |
US4524238A (en) * | 1982-12-29 | 1985-06-18 | Olin Corporation | Semiconductor packages |
US4500605A (en) * | 1983-02-17 | 1985-02-19 | Olin Corporation | Electrical component forming process |
USRE32942E (en) * | 1983-10-06 | 1989-06-06 | Olin Corporation | Low thermal expansivity and high thermal conductivity substrate |
US4607276A (en) * | 1984-03-08 | 1986-08-19 | Olin Corporation | Tape packages |
US4736236A (en) * | 1984-03-08 | 1988-04-05 | Olin Corporation | Tape bonding material and structure for electronic circuit fabrication |
GB2157315A (en) * | 1984-04-12 | 1985-10-23 | Bruno Nutini | Aluminium bronze alloy containing silicon |
US4862323A (en) * | 1984-04-12 | 1989-08-29 | Olin Corporation | Chip carrier |
US4775647A (en) * | 1984-09-19 | 1988-10-04 | Olin Corporation | Sealing glass composite |
US4752521A (en) * | 1984-09-19 | 1988-06-21 | Olin Corporation | Sealing glass composite |
US4801488A (en) * | 1984-09-19 | 1989-01-31 | Olin Corporation | Sealing glass composite |
US4542259A (en) * | 1984-09-19 | 1985-09-17 | Olin Corporation | High density packages |
US4805009A (en) * | 1985-03-11 | 1989-02-14 | Olin Corporation | Hermetically sealed semiconductor package |
US4853491A (en) * | 1984-10-03 | 1989-08-01 | Olin Corporation | Chip carrier |
US4840654A (en) * | 1985-03-04 | 1989-06-20 | Olin Corporation | Method for making multi-layer and pin grid arrays |
US4906311A (en) * | 1985-09-24 | 1990-03-06 | John Fluke Co., Inc. | Method of making a hermetically sealed electronic component |
US4821151A (en) * | 1985-12-20 | 1989-04-11 | Olin Corporation | Hermetically sealed package |
US4771537A (en) * | 1985-12-20 | 1988-09-20 | Olin Corporation | Method of joining metallic components |
US4793967A (en) * | 1986-03-12 | 1988-12-27 | Olin Corporation | Cermet substrate with spinel adhesion component |
US4743299A (en) * | 1986-03-12 | 1988-05-10 | Olin Corporation | Cermet substrate with spinel adhesion component |
US4769345A (en) * | 1987-03-12 | 1988-09-06 | Olin Corporation | Process for producing a hermetically sealed package for an electrical component containing a low amount of oxygen and water vapor |
US4839716A (en) * | 1987-06-01 | 1989-06-13 | Olin Corporation | Semiconductor packaging |
US4796083A (en) * | 1987-07-02 | 1989-01-03 | Olin Corporation | Semiconductor casing |
DE3736843A1 (de) * | 1987-10-30 | 1989-05-11 | Asea Brown Boveri | Verfahren zum verbinden von metallischen und keramischen werkstoffen |
US4888449A (en) * | 1988-01-04 | 1989-12-19 | Olin Corporation | Semiconductor package |
US5103292A (en) * | 1989-11-29 | 1992-04-07 | Olin Corporation | Metal pin grid array package |
US5215610A (en) * | 1991-04-04 | 1993-06-01 | International Business Machines Corporation | Method for fabricating superconductor packages |
FR2708077B1 (fr) * | 1993-07-23 | 1995-09-22 | Pont A Mousson | Insert de verrouillage électriquement isolant pour garniture d'étanchéité, garniture d'étanchéité correspondante, et procédé de fabrication de tels inserts. |
US6323549B1 (en) | 1996-08-29 | 2001-11-27 | L. Pierre deRochemont | Ceramic composite wiring structures for semiconductor devices and method of manufacture |
JP2001507867A (ja) * | 1996-12-30 | 2001-06-12 | デロシェモント,エル.ピエール | 半導体装置用セラミックコンポジットワイヤ構造体及び製造方法 |
US6037539A (en) * | 1998-03-20 | 2000-03-14 | Sandia Corporation | Hermetic aluminum radio frequency interconnection and method for making |
WO2006033772A2 (en) * | 2004-08-27 | 2006-03-30 | Electro Ceramic Industries | Housing for accommodating microwave devices |
CN100475100C (zh) * | 2005-05-15 | 2009-04-08 | 范圣太 | 无机非金属抗裂处理方法及器皿 |
US20100288525A1 (en) * | 2009-05-12 | 2010-11-18 | Alcatel-Lucent Usa, Incorporated | Electronic package and method of manufacture |
US8358003B2 (en) * | 2009-06-01 | 2013-01-22 | Electro Ceramic Industries | Surface mount electronic device packaging assembly |
CN102185580A (zh) * | 2010-01-18 | 2011-09-14 | 精工爱普生株式会社 | 电子装置、基板的制造方法以及电子装置的制造方法 |
DE102013215149A1 (de) | 2013-08-01 | 2015-02-19 | Conti Temic Microelectronic Gmbh | Mehrstufiges Dichtsystem zum Einsatz in einem Kraftfahrzeugsteuergerät |
CN107223117B (zh) | 2014-12-22 | 2020-08-18 | 肖特股份有限公司 | 具有改善的热负荷能力的馈通或连接元件 |
RU2623386C1 (ru) * | 2016-04-13 | 2017-06-26 | Акционерное общество "Научно-исследовательский институт "Полюс" им. М.Ф. Стельмаха" (АО НИИ "Полюс" им. М.Ф. Стельмаха) | Способ герметичного соединения стеклокерамики с металлической деталью |
-
1970
- 1970-10-07 US US78899A patent/US3676292A/en not_active Expired - Lifetime
-
1971
- 1971-08-12 CA CA120,482A patent/CA962063A/en not_active Expired
- 1971-09-02 IT IT52642/71A patent/IT944690B/it active
- 1971-09-09 BR BR5933/71A patent/BR7105933D0/pt unknown
- 1971-09-19 GB GB3905171A patent/GB1342270A/en not_active Expired
- 1971-10-01 JP JP7700671A patent/JPS5523779B1/ja active Pending
- 1971-10-05 SE SE7112585A patent/SE376905B/xx unknown
- 1971-10-07 FR FR7136172A patent/FR2110284B1/fr not_active Expired
Also Published As
Publication number | Publication date |
---|---|
FR2110284A1 (it) | 1972-06-02 |
AU3312471A (en) | 1973-03-15 |
CA962063A (en) | 1975-02-04 |
DE2150092B2 (de) | 1975-11-20 |
SE376905B (it) | 1975-06-16 |
JPS5523779B1 (it) | 1980-06-25 |
FR2110284B1 (it) | 1976-06-04 |
GB1342270A (en) | 1974-01-03 |
DE2150092A1 (de) | 1972-04-13 |
BR7105933D0 (pt) | 1973-03-29 |
US3676292A (en) | 1972-07-11 |
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