SE363700B - - Google Patents

Info

Publication number
SE363700B
SE363700B SE1625669A SE1625669A SE363700B SE 363700 B SE363700 B SE 363700B SE 1625669 A SE1625669 A SE 1625669A SE 1625669 A SE1625669 A SE 1625669A SE 363700 B SE363700 B SE 363700B
Authority
SE
Sweden
Application number
SE1625669A
Inventor
A Gieles
Original Assignee
Philips Nv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Nv filed Critical Philips Nv
Publication of SE363700B publication Critical patent/SE363700B/xx

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/14—Housings
    • G01L19/148—Details about the circuit board integration, e.g. integrated with the diaphragm surface or encapsulation
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/0061—Electrical connection means
    • G01L19/0084—Electrical connection means to the outside of the housing
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/14—Housings
    • G01L19/147—Details about the mounting of the sensor to support or covering means
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
    • G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
    • G01L9/0042—Constructional details associated with semiconductive diaphragm sensors, e.g. etching, or constructional details of non-semiconductive diaphragms
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
    • G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
    • G01L9/0051—Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance
    • G01L9/0052—Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance of piezoresistive elements
    • G01L9/0054—Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance of piezoresistive elements integral with a semiconducting diaphragm
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R21/00—Variable-resistance transducers
    • H04R21/02—Microphones
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R7/00—Diaphragms for electromechanical transducers; Cones
    • H04R7/02—Diaphragms for electromechanical transducers; Cones characterised by the construction
    • H04R7/04—Plane diaphragms
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R7/00—Diaphragms for electromechanical transducers; Cones
    • H04R7/16—Mounting or tensioning of diaphragms or cones
    • H04R7/18—Mounting or tensioning of diaphragms or cones at the periphery
    • H04R7/22—Clamping rim of diaphragm or cone against seating
SE1625669A 1968-11-29 1969-11-26 SE363700B (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL6817089A NL162254B (nl) 1968-11-29 1968-11-29 Halfgeleiderinrichting voor het omzetten van mechanische spanningen in elektrische signalen en werkwijze voor het vervaardigen daarvan.

Publications (1)

Publication Number Publication Date
SE363700B true SE363700B (fr) 1974-01-28

Family

ID=19805282

Family Applications (2)

Application Number Title Priority Date Filing Date
SE223173A SE384437B (sv) 1968-11-29 1969-11-26 Halvledaranordning for omvandling av mekaniska pakenningar till elektriska signaler
SE1625669A SE363700B (fr) 1968-11-29 1969-11-26

Family Applications Before (1)

Application Number Title Priority Date Filing Date
SE223173A SE384437B (sv) 1968-11-29 1969-11-26 Halvledaranordning for omvandling av mekaniska pakenningar till elektriska signaler

Country Status (10)

Country Link
AT (1) AT316894B (fr)
BE (1) BE742331A (fr)
BR (1) BR6914557D0 (fr)
CH (1) CH518006A (fr)
DE (1) DE1959527C3 (fr)
ES (2) ES373779A1 (fr)
FR (1) FR2024961A1 (fr)
GB (1) GB1295650A (fr)
NL (1) NL162254B (fr)
SE (2) SE384437B (fr)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4071838A (en) 1976-02-09 1978-01-31 Diax Corporation Solid state force transducer and method of making same
US4191057A (en) * 1978-06-28 1980-03-04 Gould Inc. Inversion layer sprain gauge
DE2841312C2 (de) * 1978-09-22 1985-06-05 Robert Bosch Gmbh, 7000 Stuttgart Monolithischer Halbleiter-Drucksensor und Verfahren zu dessen Herstellung
JPS5550668A (en) * 1978-10-06 1980-04-12 Hitachi Ltd Semiconductor pressure converter
IT1212404B (it) * 1979-02-22 1989-11-22 Rca Corp Metodo comportante un singolo attacco per la formazione di un mesa presentante una parete a piu'gradini.
DE3874884T2 (de) * 1988-04-21 1993-04-29 Marelli Autronica Elektrischer kraft- und/oder verformungsmessfuehler, insbesondere zum gebrauch als druckmessfuehler.
US4904978A (en) * 1988-04-29 1990-02-27 Solartron Electronics, Inc. Mechanical sensor for high temperature environments
JP2719448B2 (ja) * 1991-01-24 1998-02-25 三菱電機株式会社 半導体圧力検出装置
DE212005000047U1 (de) * 2004-08-20 2007-08-02 Semitool, Inc., Kalispell System zum Dünnen eines Halbleiter-Werkstücks
CN113555346B (zh) * 2020-08-21 2023-05-23 友达光电股份有限公司 电路基板以及电路基板的应变量的测量方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3270554A (en) * 1961-01-04 1966-09-06 Bell Telephone Labor Inc Diffused layer transducers
US3277698A (en) * 1963-11-15 1966-10-11 Bell Telephone Labor Inc Stress sensing semiconductive devices
NL6703014A (fr) * 1967-02-25 1968-08-26
BE711537A (fr) * 1968-03-01 1968-09-02

Also Published As

Publication number Publication date
BE742331A (fr) 1970-05-27
DE1959527A1 (de) 1970-06-11
ES400839A1 (es) 1975-02-01
DE1959527C3 (de) 1981-12-10
BR6914557D0 (pt) 1973-01-02
NL6817089A (fr) 1970-06-02
CH518006A (de) 1972-01-15
AT316894B (de) 1974-07-25
DE1959527B2 (de) 1981-03-19
FR2024961A1 (fr) 1970-09-04
NL162254B (nl) 1979-11-15
ES373779A1 (es) 1972-05-16
SE384437B (sv) 1976-05-03
GB1295650A (fr) 1972-11-08

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