SE352480B - - Google Patents

Info

Publication number
SE352480B
SE352480B SE14114/68A SE1411468A SE352480B SE 352480 B SE352480 B SE 352480B SE 14114/68 A SE14114/68 A SE 14114/68A SE 1411468 A SE1411468 A SE 1411468A SE 352480 B SE352480 B SE 352480B
Authority
SE
Sweden
Application number
SE14114/68A
Inventor
Velde T Te
A Schmitz
Original Assignee
Philips Nv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Nv filed Critical Philips Nv
Publication of SE352480B publication Critical patent/SE352480B/xx

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93—Batch processes
    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/96—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being encapsulated in a common layer, e.g. neo-wafer or pseudo-wafer, said common layer being separable into individual assemblies after connecting
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    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
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    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H01L23/5389—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates the chips being integrally enclosed by the interconnect and support structures
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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Luminescent Compositions (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Wire Bonding (AREA)
SE14114/68A 1967-10-21 1968-10-18 SE352480B (ko)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL6714336A NL6714336A (ko) 1967-10-21 1967-10-21

Publications (1)

Publication Number Publication Date
SE352480B true SE352480B (ko) 1972-12-27

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ID=19801524

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Application Number Title Priority Date Filing Date
SE14114/68A SE352480B (ko) 1967-10-21 1968-10-18

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US (1) US3579056A (ko)
BE (1) BE722669A (ko)
BR (1) BR6803288D0 (ko)
CH (1) CH496322A (ko)
DE (1) DE1803138A1 (ko)
ES (1) ES359345A1 (ko)
FR (1) FR1591647A (ko)
GB (1) GB1250815A (ko)
NL (1) NL6714336A (ko)
SE (1) SE352480B (ko)

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US3777220A (en) * 1972-06-30 1973-12-04 Ibm Circuit panel and method of construction
JPS51150068A (en) * 1975-06-19 1976-12-23 Citizen Watch Co Ltd Electronic circuit block
JPS54158669A (en) * 1978-06-05 1979-12-14 Matsushita Electric Ind Co Ltd Printed circuit board
DE3019207A1 (de) * 1980-05-20 1981-11-26 GAO Gesellschaft für Automation und Organisation mbH, 8000 München Traegerelement fuer einen ic-chip
US5344795A (en) * 1992-09-22 1994-09-06 Microelectronics And Computer Technology Corporation Method for encapsulating an integrated circuit using a removable heatsink support block
DE20117575U1 (de) * 2001-10-26 2002-03-28 Moser, Helmut, Dipl.-Volkswirt, 76646 Bruchsal Sandwichplatte mit beidseitigen Leuchtfeldern
DE10164800B4 (de) 2001-11-02 2005-03-31 Infineon Technologies Ag Verfahren zur Herstellung eines elektronischen Bauelements mit mehreren übereinander gestapelten und miteinander kontaktierten Chips
DE10153609C2 (de) * 2001-11-02 2003-10-16 Infineon Technologies Ag Verfahren zur Herstellung eines elektronischen Bauelements mit mehreren übereinander gestapelten und miteinander kontaktierten Chips
DE10250621B4 (de) * 2002-10-30 2004-09-02 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren zum Erzeugen verkapselter Chips und zum Erzeugen eines Stapels aus den verkapselten Chips
TW200507131A (en) * 2003-07-02 2005-02-16 North Corp Multi-layer circuit board for electronic device
US7768117B2 (en) * 2007-05-30 2010-08-03 Tessera, Inc. Microelectronic package having interconnected redistribution paths
US8237259B2 (en) 2007-06-13 2012-08-07 Infineon Technologies Ag Embedded chip package
US7968378B2 (en) * 2008-02-06 2011-06-28 Infineon Technologies Ag Electronic device
DE102010039156A1 (de) 2010-08-10 2012-02-16 Robert Bosch Gmbh Verfahren zum Herstellen einer elektrischen Schaltung und elektrische Schaltung
DE102010040704A1 (de) 2010-09-14 2012-03-15 Robert Bosch Gmbh Verfahren zum Aufbauen einer elektrischen Schaltung und elektrische Schaltung
DE102012005192A1 (de) * 2011-12-19 2013-06-20 Inoviscoat Gmbh Leuchtbild
DE112012005313A5 (de) 2011-12-19 2015-04-23 Inoviscoat Gmbh Leuchtbild
US9301367B2 (en) 2011-12-19 2016-03-29 Inoviscoat Gmbh Luminous elements with an electroluminescent arrangement and method for producing a luminous element
US9129959B2 (en) 2012-08-21 2015-09-08 Infineon Technologies Ag Method for manufacturing an electronic module and an electronic module
RU2642170C2 (ru) 2013-12-19 2018-01-24 Интел Корпорейшн Гибко оборачиваемый кристалл интегральной схемы

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3040416A (en) * 1959-05-13 1962-06-26 Hoffman Electronics Corp Method of making a large area solar cell panel
US3121177A (en) * 1962-01-23 1964-02-11 Robert H Davis Active thin-film devices controlling current by modulation of a quantum mechanical potential barrier
DE1514460A1 (de) * 1965-05-11 1969-05-22 Siemens Ag Verfahren zum Herstellen von Halbleiterschaltungen
US3411050A (en) * 1966-04-28 1968-11-12 Air Force Usa Flexible storable solar cell array
US3402331A (en) * 1966-08-02 1968-09-17 Philips Corp Solid-state active electronic device and microcircuits containing same
US3483038A (en) * 1967-01-05 1969-12-09 Rca Corp Integrated array of thin-film photovoltaic cells and method of making same
US3433677A (en) * 1967-04-05 1969-03-18 Cornell Aeronautical Labor Inc Flexible sheet thin-film photovoltaic generator

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CH496322A (de) 1970-09-15
GB1250815A (ko) 1971-10-20
FR1591647A (ko) 1970-05-04
BE722669A (ko) 1969-04-21
US3579056A (en) 1971-05-18
BR6803288D0 (pt) 1973-01-04
ES359345A1 (es) 1970-08-16
DE1803138A1 (de) 1969-06-04
NL6714336A (ko) 1969-04-23

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