SE350874B - - Google Patents

Info

Publication number
SE350874B
SE350874B SE02909/70A SE290970A SE350874B SE 350874 B SE350874 B SE 350874B SE 02909/70 A SE02909/70 A SE 02909/70A SE 290970 A SE290970 A SE 290970A SE 350874 B SE350874 B SE 350874B
Authority
SE
Sweden
Application number
SE02909/70A
Inventor
N Andersson
T Farkas
Original Assignee
Asea Ab
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asea Ab filed Critical Asea Ab
Priority to SE02909/70A priority Critical patent/SE350874B/xx
Priority to US115289A priority patent/US3649738A/en
Priority to SU1630418A priority patent/SU503563A3/ru
Priority to DE2109116A priority patent/DE2109116C3/de
Priority to GB2306071*A priority patent/GB1333190A/en
Publication of SE350874B publication Critical patent/SE350874B/xx

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/049—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body the other leads being perpendicular to the base
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/051—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Die Bonding (AREA)
SE02909/70A 1970-03-05 1970-03-05 SE350874B (ko)

Priority Applications (5)

Application Number Priority Date Filing Date Title
SE02909/70A SE350874B (ko) 1970-03-05 1970-03-05
US115289A US3649738A (en) 1970-03-05 1971-02-16 Semiconductor device
SU1630418A SU503563A3 (ru) 1970-03-05 1971-02-25 Полупроводниковое устройство
DE2109116A DE2109116C3 (de) 1970-03-05 1971-02-26 Halbleiteranordnung mit einem Halbleiterbauelement und einem Kühlmittelbehälter
GB2306071*A GB1333190A (en) 1970-03-05 1971-04-19 Semiconductor devices

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SE02909/70A SE350874B (ko) 1970-03-05 1970-03-05

Publications (1)

Publication Number Publication Date
SE350874B true SE350874B (ko) 1972-11-06

Family

ID=20260980

Family Applications (1)

Application Number Title Priority Date Filing Date
SE02909/70A SE350874B (ko) 1970-03-05 1970-03-05

Country Status (5)

Country Link
US (1) US3649738A (ko)
DE (1) DE2109116C3 (ko)
GB (1) GB1333190A (ko)
SE (1) SE350874B (ko)
SU (1) SU503563A3 (ko)

Families Citing this family (36)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2160001C2 (de) * 1971-12-03 1974-01-10 Siemens Ag, 1000 Berlin U. 8000 Muenchen Halbleiteranordnung, insbesondere Thyristorbaugruppe
US3800191A (en) * 1972-10-26 1974-03-26 Borg Warner Expandible pressure mounted semiconductor assembly
CS159563B1 (ko) * 1972-12-28 1975-01-31
US3989095A (en) * 1972-12-28 1976-11-02 Ckd Praha, Oborovy Podnik Semi conductor cooling system
US3972063A (en) * 1973-10-19 1976-07-27 Mitsubishi Denki Kabushiki Kaisha Vapor cooled semiconductor device enclosed in an envelope having a compression mechanism for holding said device within said envelope
US4009423A (en) * 1975-07-02 1977-02-22 Honeywell Information Systems, Inc. Liquid cooled heat exchanger for electronic power supplies
US4072188A (en) * 1975-07-02 1978-02-07 Honeywell Information Systems Inc. Fluid cooling systems for electronic systems
CS179822B1 (en) * 1975-09-08 1977-11-30 Petr Novak Cooling and pressuring equipment esp. for power semiconductive elements
US4138692A (en) * 1977-09-12 1979-02-06 International Business Machines Corporation Gas encapsulated cooling module
US4167031A (en) * 1978-06-21 1979-09-04 Bell Telephone Laboratories, Incorporated Heat dissipating assembly for semiconductor devices
US4395728A (en) * 1979-08-24 1983-07-26 Li Chou H Temperature controlled apparatus
US4296455A (en) * 1979-11-23 1981-10-20 International Business Machines Corporation Slotted heat sinks for high powered air cooled modules
US4532426A (en) * 1983-06-17 1985-07-30 Hughes Aircraft Company Wafer height correction system for focused beam system
CA1227886A (en) * 1984-01-26 1987-10-06 Haruhiko Yamamoto Liquid-cooling module system for electronic circuit components
JPS60160149A (ja) * 1984-01-26 1985-08-21 Fujitsu Ltd 集積回路装置の冷却方式
US4561040A (en) * 1984-07-12 1985-12-24 Ibm Corporation Cooling system for VLSI circuit chips
EP0175995B1 (de) * 1984-09-21 1990-01-03 Siemens Aktiengesellschaft Einrichtung für die Funktionsprüfung integrierter Schaltkreise
US4750086A (en) * 1985-12-11 1988-06-07 Unisys Corporation Apparatus for cooling integrated circuit chips with forced coolant jet
US4721996A (en) * 1986-10-14 1988-01-26 Unisys Corporation Spring loaded module for cooling integrated circuit packages directly with a liquid
US5040053A (en) * 1988-05-31 1991-08-13 Ncr Corporation Cryogenically cooled integrated circuit apparatus
US4865331A (en) * 1988-09-15 1989-09-12 Ncr Corporation Differential temperature seal
US5050036A (en) * 1989-10-24 1991-09-17 Amdahl Corporation Liquid cooled integrated circuit assembly
EP0560478B1 (en) * 1992-02-10 1998-10-14 Nec Corporation Cooling structure for electronic circuit package
US5369550A (en) * 1992-09-02 1994-11-29 Vlsi Technology, Inc. Method and apparatus for cooling a molded-plastic integrated-circuit package
US6035523A (en) * 1995-06-16 2000-03-14 Apple Computer, Inc. Method and apparatus for supporting a component on a substrate
SE524204C2 (sv) * 2001-07-19 2004-07-06 Denso Corp Värmeansamlare med ett membran vilket tar emot ett fluidtryck
DE10164522B4 (de) * 2001-12-17 2005-05-25 Siemens Ag Spannvorrichtung und Halbleiterbauelement mit einer Spannvorrichtung
DE10207873A1 (de) * 2002-02-23 2003-09-04 Modine Mfg Co Kühlvorrichtung für elektronische/elektrische Komponenten
US20050039884A1 (en) * 2003-08-20 2005-02-24 Ivan Pawlenko Conformal heat sink
WO2006087031A1 (de) * 2005-02-18 2006-08-24 Ebm-Papst St. Georgen Gmbh & Co. Kg Wärmetauscher
US8176972B2 (en) * 2006-08-31 2012-05-15 International Business Machines Corporation Compliant vapor chamber chip packaging
KR101799485B1 (ko) * 2007-12-07 2017-11-20 필립스 라이팅 홀딩 비.브이. 내부 합성 제트를 이용한 냉각 장치
RU2449417C2 (ru) * 2009-06-01 2012-04-27 Государственное Образовательное Учреждение Высшего Профессионального Образования "Дагестанский Государственный Технический Университет" (Дгту) Способ охлаждения полупроводниковых тепловыделяющих электронных компонентов через биметаллические термоэлектрические электроды
JP5481680B2 (ja) * 2010-04-28 2014-04-23 三菱電機株式会社 半導体装置および半導体装置の製造方法
US20110303403A1 (en) * 2010-06-11 2011-12-15 International Business Machines Corporation Flexible Heat Exchanger
US9721870B2 (en) * 2014-12-05 2017-08-01 International Business Machines Corporation Cooling structure for electronic boards

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB787383A (en) * 1952-05-14 1957-12-04 Onera (Off Nat Aerospatiale) Process for producing superficial protective layers
DE1714910U (de) * 1953-10-19 1956-01-12 Licentia Gmbh Elektrisch unsymmetrisch leitendes system.
BE534817A (ko) * 1954-01-14 1900-01-01
BE555902A (ko) * 1956-03-22
US2958021A (en) * 1958-04-23 1960-10-25 Texas Instruments Inc Cooling arrangement for transistor
NL136972C (ko) * 1961-08-04 1900-01-01
DE1976270U (de) * 1965-02-20 1968-01-04 Siemens Ag Halbleiteranordnung.
DE1539325A1 (de) * 1966-08-04 1969-12-11 Siemens Ag Druckstueck zur oertlichen Fixierung eines thermoelektrischen Bauelements
US3400543A (en) * 1966-10-31 1968-09-10 Peter G. Ross Semi-conductor cooling means
US3581163A (en) * 1968-04-09 1971-05-25 Gen Electric High-current semiconductor rectifier assemblies
DE1914790A1 (de) * 1969-03-22 1970-10-01 Siemens Ag Fluessigkeitsgekuehlte Baugruppe mit Scheibenzellen
DE2348207A1 (de) * 1973-09-25 1975-04-17 Siemens Ag Thyristorsaeule

Also Published As

Publication number Publication date
GB1333190A (en) 1973-10-10
US3649738A (en) 1972-03-14
DE2109116A1 (de) 1971-09-16
DE2109116C3 (de) 1982-06-03
DE2109116B2 (de) 1974-08-29
SU503563A3 (ru) 1976-02-15

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