SE345038C - Halvledarkomponent med ett skivformigt halvledarelement inneslutet i ett hölje - Google Patents

Halvledarkomponent med ett skivformigt halvledarelement inneslutet i ett hölje

Info

Publication number
SE345038C
SE345038C SE111566A SE111566A SE345038C SE 345038 C SE345038 C SE 345038C SE 111566 A SE111566 A SE 111566A SE 111566 A SE111566 A SE 111566A SE 345038 C SE345038 C SE 345038C
Authority
SE
Sweden
Prior art keywords
disk
housing
element enclosed
semiconductor element
semiconductor component
Prior art date
Application number
SE111566A
Other languages
English (en)
Swedish (sv)
Other versions
SE345038B (sv
Inventor
J Haus
Original Assignee
Siemens Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Ag filed Critical Siemens Ag
Publication of SE345038B publication Critical patent/SE345038B/xx
Publication of SE345038C publication Critical patent/SE345038C/xx

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/13—Containers comprising a conductive base serving as an interconnection
    • H10W76/138—Containers comprising a conductive base serving as an interconnection having another interconnection being formed by a cover plate parallel to the conductive base, e.g. sandwich type
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/60—Securing means for detachable heating or cooling arrangements, e.g. clamps
    • H10W40/611—Bolts or screws
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
SE111566A 1962-05-28 1966-01-28 Halvledarkomponent med ett skivformigt halvledarelement inneslutet i ett hölje SE345038C (sv)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DES79642A DE1248814B (de) 1962-05-28 1962-05-28 Halbleiterbauelement und zugehörige Kühlordnung
DES0095262 1965-01-30
DES0101036 1965-12-18

Publications (2)

Publication Number Publication Date
SE345038B SE345038B (sv) 1972-05-08
SE345038C true SE345038C (sv) 1974-09-23

Family

ID=52395368

Family Applications (1)

Application Number Title Priority Date Filing Date
SE111566A SE345038C (sv) 1962-05-28 1966-01-28 Halvledarkomponent med ett skivformigt halvledarelement inneslutet i ett hölje

Country Status (8)

Country Link
US (1) US3499095A (ref)
BE (1) BE675736A (ref)
CH (1) CH446534A (ref)
DE (2) DE1248814B (ref)
FR (1) FR1466106A (ref)
GB (1) GB1078779A (ref)
NL (1) NL140362B (ref)
SE (1) SE345038C (ref)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3532942A (en) * 1967-05-23 1970-10-06 Int Rectifier Corp Pressure-assembled semiconductor device housing having three terminals
US3513361A (en) * 1968-05-09 1970-05-19 Westinghouse Electric Corp Flat package electrical device
US3746947A (en) * 1969-03-15 1973-07-17 Mitsubishi Electric Corp Semiconductor device
JPS5030428B1 (ref) * 1969-03-31 1975-10-01
DE2021158B2 (de) * 1970-04-30 1972-07-13 Licentia Patent Verwaltungs GmbH, 6000 Frankfurt Halbleiteranordnung mit einem scheibenfoermigen gehaeuse und einem in dieses eingespannten halbleiterelement
DE2160001C2 (de) * 1971-12-03 1974-01-10 Siemens Ag, 1000 Berlin U. 8000 Muenchen Halbleiteranordnung, insbesondere Thyristorbaugruppe
US3831067A (en) * 1972-05-15 1974-08-20 Int Rectifier Corp Semiconductor device with pressure connection electrodes and with headers cemented to insulation ring
US3992717A (en) * 1974-06-21 1976-11-16 Westinghouse Electric Corporation Housing for a compression bonded encapsulation of a semiconductor device
US4008486A (en) * 1975-06-02 1977-02-15 International Rectifier Corporation Compression-assembled semiconductor device with nesting circular flanges and flexible locating ring
DE2907780A1 (de) * 1979-02-28 1980-09-11 Alsthom Atlantique Halter fuer eine leistungshalbleiterscheibe, die zur kuehlung in fluessigen fluorierten kohlenwasserstoff eingetaucht wird
JPS5678130A (en) * 1979-11-30 1981-06-26 Hitachi Ltd Semiconductor device and its manufacture
DE3143335A1 (de) * 1981-10-31 1983-05-11 SEMIKRON Gesellschaft für Gleichrichterbau u. Elektronik mbH, 8500 Nürnberg Halbleitervorrichtung
DE102019217386B4 (de) * 2019-11-11 2023-12-14 Mahle International Gmbh Verfahren zum Herstellen einer Elektronikanordnung und die Elektronikanordnung

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2066856A (en) * 1936-02-28 1937-01-05 Rca Corp Stem for electron discharge devices
NL288523A (ref) * 1961-08-04 1900-01-01
GB1001269A (ref) * 1960-09-30 1900-01-01
NL302170A (ref) * 1963-06-15

Also Published As

Publication number Publication date
DE1514393B2 (de) 1972-11-09
NL140362B (nl) 1973-11-15
NL6600991A (ref) 1966-08-01
DE1514393A1 (de) 1970-09-24
GB1078779A (en) 1967-08-09
DE1248814B (de) 1968-03-14
US3499095A (en) 1970-03-03
FR1466106A (fr) 1967-01-13
CH446534A (de) 1967-11-15
SE345038B (sv) 1972-05-08
BE675736A (ref) 1966-07-28
DE1514643A1 (de) 1972-01-20

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