SE316962B - - Google Patents
Info
- Publication number
- SE316962B SE316962B SE8362/65A SE836265A SE316962B SE 316962 B SE316962 B SE 316962B SE 8362/65 A SE8362/65 A SE 8362/65A SE 836265 A SE836265 A SE 836265A SE 316962 B SE316962 B SE 316962B
- Authority
- SE
- Sweden
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/52—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating using reducing agents for coating with metallic material not provided for in a single one of groups C23C18/32 - C23C18/50
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
- C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
- C23C18/36—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents using hypophosphites
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/38—Coating with copper
- C23C18/40—Coating with copper using reducing agents
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US377471A US3403035A (en) | 1964-06-24 | 1964-06-24 | Process for stabilizing autocatalytic metal plating solutions |
Publications (1)
Publication Number | Publication Date |
---|---|
SE316962B true SE316962B (en) | 1969-11-03 |
Family
ID=23489240
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SE8362/65A SE316962B (en) | 1964-06-24 | 1965-06-23 |
Country Status (10)
Country | Link |
---|---|
US (1) | US3403035A (en) |
AT (1) | AT270330B (en) |
BE (1) | BE665911A (en) |
CH (1) | CH467342A (en) |
DE (1) | DE1521440B2 (en) |
DK (1) | DK129949B (en) |
ES (1) | ES314564A2 (en) |
GB (1) | GB1121282A (en) |
NL (1) | NL6508142A (en) |
SE (1) | SE316962B (en) |
Families Citing this family (58)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3507681A (en) * | 1967-06-02 | 1970-04-21 | Mine Safety Appliances Co | Metal plating of plastics |
US3992211A (en) * | 1968-07-15 | 1976-11-16 | Trans-Metals Corporation | Electroless plating composition |
US3946126A (en) * | 1968-11-22 | 1976-03-23 | Rca Corporation | Method of electroless nickel plating |
US3547818A (en) * | 1969-04-07 | 1970-12-15 | Ventron Corp | Alcoholic ionic compositions containing a metal selected from hg (ii),cu (ii),ag (i),cd (ii),ni (ii),zn (ii),and co (ii) |
US3915716A (en) * | 1969-04-17 | 1975-10-28 | Schering Ag | Chemical nickel plating bath |
US3653953A (en) * | 1970-01-26 | 1972-04-04 | North American Rockwell | Nonaqueous electroless plating |
US3637472A (en) * | 1970-03-16 | 1972-01-25 | Ventron Corp | Chemical plating baths containing an alkali metal cyanoborohydride |
US3650708A (en) * | 1970-03-30 | 1972-03-21 | Hooker Chemical Corp | Metal plating of substrates |
US3645749A (en) * | 1970-06-04 | 1972-02-29 | Kollmorgen Corp | Electroless plating baths with improved deposition rates |
DE2028950B2 (en) * | 1970-06-12 | 1976-05-13 | Shipley Co., Inc., Newton, Mass. (V.SLA.) | Aqueous solution for the electroless cutting of nickel, cobalt or its alloys |
US3663242A (en) * | 1970-09-25 | 1972-05-16 | Shipley Co | Stabilized electroless plating solutions |
US3893865A (en) * | 1971-02-02 | 1975-07-08 | Ppg Industries Inc | Method for stabilizing a chemical filming composition |
US3798050A (en) * | 1971-05-28 | 1974-03-19 | Ppg Industries Inc | Catalytic sensitization of substrates for metallization |
BE792310A (en) * | 1971-12-08 | 1973-06-05 | Kalle Ag | PROCESS FOR DEPOSITING COPPER COATS ON MOLDED PARTS OF POLYIMIDES |
US3899617A (en) * | 1973-07-19 | 1975-08-12 | Enthone | Process for conditioning ABS resin surface |
US3961109A (en) * | 1973-08-01 | 1976-06-01 | Photocircuits Division Of Kollmorgen Corporation | Sensitizers and process for electroless metal deposition |
US3870526A (en) * | 1973-09-20 | 1975-03-11 | Us Army | Electroless deposition of copper and copper-tin alloys |
US4036651A (en) * | 1974-02-26 | 1977-07-19 | Rca Corporation | Electroless copper plating bath |
US3963842A (en) * | 1974-06-20 | 1976-06-15 | London Laboratories Limited Co. | Deposition of copper |
CA1093911A (en) * | 1976-04-08 | 1981-01-20 | George A. Butter | Electroless copper plating |
US4328266A (en) * | 1977-06-06 | 1982-05-04 | Surface Technology, Inc. | Method for rendering non-platable substrates platable |
US4355083A (en) * | 1977-06-06 | 1982-10-19 | Nathan Feldstein | Electrolessly metallized silver coated article |
US4305997A (en) * | 1977-06-06 | 1981-12-15 | Surface Technology, Inc. | Electrolessly metallized product of non-catalytic metal or alloy |
JPS6018320B2 (en) * | 1977-10-06 | 1985-05-09 | 東方商館株式会社 | Method for modifying natural products containing calcium carbonate as the main component |
US4209331A (en) * | 1978-05-25 | 1980-06-24 | Macdermid Incorporated | Electroless copper composition solution using a hypophosphite reducing agent |
NL184695C (en) * | 1978-12-04 | 1989-10-02 | Philips Nv | BATH FOR THE STREAMLESS DEPOSIT OF TIN ON SUBSTRATES. |
US4279951A (en) * | 1979-01-15 | 1981-07-21 | Mine Safety Appliances Company | Method for the electroless deposition of palladium |
USH325H (en) | 1980-07-30 | 1987-09-01 | Richardson Chemical Company | Electroless deposition of transition metals |
WO1982001015A1 (en) * | 1980-09-15 | 1982-04-01 | Shipley Co | Electroless alloy plating |
DE3237394A1 (en) * | 1982-10-08 | 1984-04-12 | Siemens AG, 1000 Berlin und 8000 München | CHEMICAL GILDING BATH |
DE3622090C1 (en) * | 1986-07-02 | 1990-02-15 | Blasberg-Oberflaechentechnik Gmbh, 5650 Solingen, De | |
JPH0331484A (en) * | 1989-06-27 | 1991-02-12 | Nippon Parkerizing Co Ltd | Blackening treatment of zinc or zinc-based plating material |
US5472524A (en) * | 1990-05-17 | 1995-12-05 | The Boeing Company | Non-chromated cobalt conversion coating method and coated articles |
US5551994A (en) * | 1990-05-17 | 1996-09-03 | The Boeing Company | Non-chromated oxide coating for aluminum substrates |
US5468307A (en) * | 1990-05-17 | 1995-11-21 | Schriever; Matthias P. | Non-chromated oxide coating for aluminum substrates |
CA2087473C (en) * | 1990-05-17 | 2001-10-16 | Matthias P. Schriever | Non-chromated oxide coating for aluminum substrates |
US5298092A (en) * | 1990-05-17 | 1994-03-29 | The Boeing Company | Non-chromated oxide coating for aluminum substrates |
US5411606A (en) * | 1990-05-17 | 1995-05-02 | The Boeing Company | Non-chromated oxide coating for aluminum substrates |
US5419926A (en) * | 1993-11-22 | 1995-05-30 | Lilly London, Inc. | Ammonia-free deposition of copper by disproportionation |
US5873953A (en) * | 1996-12-26 | 1999-02-23 | The Boeing Company | Non-chromated oxide coating for aluminum substrates |
US6183546B1 (en) | 1998-11-02 | 2001-02-06 | Mccomas Industries International | Coating compositions containing nickel and boron |
US6432225B1 (en) | 1999-11-02 | 2002-08-13 | The Boeing Company | Non-chromated oxide coating for aluminum substrates |
US20030190426A1 (en) * | 2002-04-03 | 2003-10-09 | Deenesh Padhi | Electroless deposition method |
US20040217005A1 (en) * | 2002-07-24 | 2004-11-04 | Aron Rosenfeld | Method for electroplating bath chemistry control |
US6821909B2 (en) * | 2002-10-30 | 2004-11-23 | Applied Materials, Inc. | Post rinse to improve selective deposition of electroless cobalt on copper for ULSI application |
US7306662B2 (en) * | 2006-05-11 | 2007-12-11 | Lam Research Corporation | Plating solution for electroless deposition of copper |
US7297190B1 (en) * | 2006-06-28 | 2007-11-20 | Lam Research Corporation | Plating solutions for electroless deposition of copper |
JP2004327229A (en) * | 2003-04-24 | 2004-11-18 | Konica Minolta Holdings Inc | Composition for forming conductive pattern, forming method for conductive pattern, and manufacturing method of composition |
US7064065B2 (en) * | 2003-10-15 | 2006-06-20 | Applied Materials, Inc. | Silver under-layers for electroless cobalt alloys |
WO2005038084A2 (en) * | 2003-10-17 | 2005-04-28 | Applied Materials, Inc. | Selective self-initiating electroless capping of copper with cobalt-containing alloys |
US7205233B2 (en) | 2003-11-07 | 2007-04-17 | Applied Materials, Inc. | Method for forming CoWRe alloys by electroless deposition |
US7256111B2 (en) * | 2004-01-26 | 2007-08-14 | Applied Materials, Inc. | Pretreatment for electroless deposition |
SE0403042D0 (en) * | 2004-12-14 | 2004-12-14 | Polymer Kompositer I Goeteborg | Improved stabilization and performance of autocatalytic electroless process |
US7651934B2 (en) | 2005-03-18 | 2010-01-26 | Applied Materials, Inc. | Process for electroless copper deposition |
US20060251801A1 (en) | 2005-03-18 | 2006-11-09 | Weidman Timothy W | In-situ silicidation metallization process |
US7659203B2 (en) | 2005-03-18 | 2010-02-09 | Applied Materials, Inc. | Electroless deposition process on a silicon contact |
KR20060128739A (en) * | 2005-06-10 | 2006-12-14 | 엔쏜 인코포레이티드 | Method for direct metallization of non-conducting substrates |
MX2016001677A (en) * | 2013-08-06 | 2016-10-05 | Earthone Circuit Tech Corp | Forming a conductive image using high speed electroless platin. |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3119709A (en) * | 1956-09-28 | 1964-01-28 | Atkinson Lab Inc | Material and method for electroless deposition of metal |
US3046159A (en) * | 1957-12-17 | 1962-07-24 | Hughes Aircraft Co | Method of copper plating by chemical reduction |
US3096182A (en) * | 1958-10-01 | 1963-07-02 | Du Pont | Chemical plating solution and process for plating therewith |
US3063850A (en) * | 1959-09-11 | 1962-11-13 | Metal Hydrides Inc | Metal plating by chemical reduction with amine boranes |
US3095309A (en) * | 1960-05-03 | 1963-06-25 | Day Company | Electroless copper plating |
-
1964
- 1964-06-24 US US377471A patent/US3403035A/en not_active Expired - Lifetime
-
1965
- 1965-06-22 CH CH872465A patent/CH467342A/en unknown
- 1965-06-22 GB GB26274/65A patent/GB1121282A/en not_active Expired
- 1965-06-23 SE SE8362/65A patent/SE316962B/xx unknown
- 1965-06-23 DK DK317365AA patent/DK129949B/en unknown
- 1965-06-23 DE DE19651521440 patent/DE1521440B2/en not_active Withdrawn
- 1965-06-23 AT AT570665A patent/AT270330B/en active
- 1965-06-23 ES ES0314564A patent/ES314564A2/en not_active Expired
- 1965-06-24 NL NL6508142A patent/NL6508142A/xx unknown
- 1965-06-24 BE BE665911A patent/BE665911A/xx unknown
Also Published As
Publication number | Publication date |
---|---|
DE1521440A1 (en) | 1970-01-08 |
US3403035A (en) | 1968-09-24 |
CH467342A (en) | 1969-01-15 |
DK129949C (en) | 1975-06-30 |
ES314564A2 (en) | 1967-07-01 |
DK129949B (en) | 1974-12-02 |
AT270330B (en) | 1969-04-25 |
NL6508142A (en) | 1965-12-27 |
GB1121282A (en) | 1968-07-24 |
BE665911A (en) | 1965-10-18 |
DE1521440B2 (en) | 1970-11-26 |