SE0601150L - Metod för tillverkning av fotovoltaiska celler och moduler från kiselskivor - Google Patents

Metod för tillverkning av fotovoltaiska celler och moduler från kiselskivor

Info

Publication number
SE0601150L
SE0601150L SE0601150A SE0601150A SE0601150L SE 0601150 L SE0601150 L SE 0601150L SE 0601150 A SE0601150 A SE 0601150A SE 0601150 A SE0601150 A SE 0601150A SE 0601150 L SE0601150 L SE 0601150L
Authority
SE
Sweden
Prior art keywords
wafers
modules
silicon wafers
photovoltaic cells
production
Prior art date
Application number
SE0601150A
Other languages
English (en)
Swedish (sv)
Other versions
SE529315C2 (sv
Inventor
Goeran Fajerson
Original Assignee
Goeran Fajerson
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Goeran Fajerson filed Critical Goeran Fajerson
Priority to SE0601150A priority Critical patent/SE529315C2/sv
Priority to EP07748136A priority patent/EP2022086A4/en
Priority to PCT/SE2007/000472 priority patent/WO2007136318A1/en
Publication of SE0601150L publication Critical patent/SE0601150L/xx
Publication of SE529315C2 publication Critical patent/SE529315C2/sv

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67346—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders characterized by being specially adapted for supporting a single substrate or by comprising a stack of such individual supports
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67751—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber vertical transfer of a single workpiece
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Photovoltaic Devices (AREA)
SE0601150A 2006-05-24 2006-05-24 Metod för tillverkning av fotovoltaiska celler och moduler från kiselskivor SE529315C2 (sv)

Priority Applications (3)

Application Number Priority Date Filing Date Title
SE0601150A SE529315C2 (sv) 2006-05-24 2006-05-24 Metod för tillverkning av fotovoltaiska celler och moduler från kiselskivor
EP07748136A EP2022086A4 (en) 2006-05-24 2007-05-16 PROCESS FOR PRODUCING PHOTOVOLTAIC CELLS AND MODULES FROM SILICON PADS
PCT/SE2007/000472 WO2007136318A1 (en) 2006-05-24 2007-05-16 Method for producing photovoltaic cells and modules from silicon wafers

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SE0601150A SE529315C2 (sv) 2006-05-24 2006-05-24 Metod för tillverkning av fotovoltaiska celler och moduler från kiselskivor

Publications (2)

Publication Number Publication Date
SE0601150L true SE0601150L (sv) 2007-07-03
SE529315C2 SE529315C2 (sv) 2007-07-03

Family

ID=38229520

Family Applications (1)

Application Number Title Priority Date Filing Date
SE0601150A SE529315C2 (sv) 2006-05-24 2006-05-24 Metod för tillverkning av fotovoltaiska celler och moduler från kiselskivor

Country Status (3)

Country Link
EP (1) EP2022086A4 (xx)
SE (1) SE529315C2 (xx)
WO (1) WO2007136318A1 (xx)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102007038240B4 (de) * 2007-08-13 2013-02-07 Institut für Kunststofftechnologie und -recycling e.V. Verfahren und Anlage zur Herstellung eines Solarmoduls
DE102008046327A1 (de) * 2008-08-29 2010-03-04 Schmid Technology Systems Gmbh Anordnung mehrerer Produktionsvorrichtungen und Verfahren zur Verwendung der Anordnung bei der Herstellung von Solarzellen
DE102008046328A1 (de) * 2008-08-29 2010-03-04 Schmid Technology Systems Gmbh Träger für Solarzellen und Verfahren zur Bearbeitung von Solarzellen
DE202008012449U1 (de) 2008-09-18 2010-02-25 Kuka Systems Gmbh Herstellvorrichtung für Strings
US8922972B2 (en) 2011-08-12 2014-12-30 General Electric Company Integral module power conditioning system

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4219926A (en) * 1979-02-23 1980-09-02 Nasa Method and apparatus for fabricating improved solar cell modules
US4561541A (en) * 1983-09-26 1985-12-31 Spectrolab, Incorporated Carrier system for photovoltaic cells
US4602417A (en) * 1983-10-24 1986-07-29 Trw Inc. Interconnector attachment machine
US4617722A (en) * 1984-12-04 1986-10-21 Mobil Solar Energy Corporation Method for electrically interconnecting solar cells
JP3732250B2 (ja) * 1995-03-30 2006-01-05 キヤノンアネルバ株式会社 インライン式成膜装置
DE19928799A1 (de) * 1999-06-23 2001-01-04 Siemens Ag Mobiler Werkstückträger und Verfahren zu dessen Verwendung
US6423565B1 (en) * 2000-05-30 2002-07-23 Kurt L. Barth Apparatus and processes for the massproduction of photovotaic modules
US7259321B2 (en) * 2002-01-07 2007-08-21 Bp Corporation North America Inc. Method of manufacturing thin film photovoltaic modules
DE10348542A1 (de) * 2002-11-28 2004-06-17 Brose, Ursula Kontaktierungs- und Befestigungsverfahren von Zellen sowie Photovoltaikmodul

Also Published As

Publication number Publication date
EP2022086A4 (en) 2010-03-31
EP2022086A1 (en) 2009-02-11
WO2007136318A1 (en) 2007-11-29
SE529315C2 (sv) 2007-07-03

Similar Documents

Publication Publication Date Title
WO2009094558A3 (en) Method for reversibly mounting a device wafer to a carrier substrate
WO2009063620A1 (ja) プラズマダイシング装置および半導体チップの製造方法
WO2010062343A3 (en) Thin two sided single crystal solar cell and manufacturing process thereof
WO2011084531A3 (en) Mobile vacuum carriers for thin wafer processing
WO2010094048A3 (en) Solar cell absorber layer formed from equilibrium precursor(s)
ATE537562T1 (de) Verfahren zum herstellen von multikristallinen silizium-solarzellen des n-typs
WO2010062341A3 (en) Thin interdigitated backside contact solar cell and manufacturing process thereof
TW201130022A (en) Methods of fabricating stacked device and handling device wafer
SE0601150L (sv) Metod för tillverkning av fotovoltaiska celler och moduler från kiselskivor
WO2006081315A3 (en) Method of eliminating curl for devices on thin flexible substrates, and devices made thereby
WO2008143885A3 (en) Protection layer for fabricating a solar cell
WO2008013547A3 (en) Screening of silicon wafers used in photovoltaics
WO2010042577A3 (en) Advanced platform for processing crystalline silicon solar cells
MY165969A (en) High-productivity porous semiconductor manufacturing equipment
WO2011133975A3 (en) Thin film solar cell with ceramic handling layer
MX2009009666A (es) Metodo para la produccion de una celula solar asi como celula solar producida utilizando dicho metodo.
MX2016004789A (es) Metodo y sistema para mejorar rendimiento de fabricacion de celda solar.
WO2009004977A1 (ja) 基板処理装置、基板処理方法、並びに、記憶媒体
EP3940796A4 (en) Silicon wafer/cell sheet, photovoltaic cell assembly, carrier, and design and arrangement method
EP2141739A3 (en) System and method for substrate transport
ATE550778T1 (de) Verfahren und vorrichtung zur herstellung photovoltaischer module
WO2009127709A3 (en) Assembly line for photovoltaic devices
WO2017100393A3 (en) Photovoltaic devices and method of manufacturing
TW200623214A (en) Substrate processing system
WO2012170166A3 (en) Method and system for inline chemical vapor deposition