SE0601150L - Method for manufacturing photovoltaic cells and modules from silicon wafers - Google Patents
Method for manufacturing photovoltaic cells and modules from silicon wafersInfo
- Publication number
- SE0601150L SE0601150L SE0601150A SE0601150A SE0601150L SE 0601150 L SE0601150 L SE 0601150L SE 0601150 A SE0601150 A SE 0601150A SE 0601150 A SE0601150 A SE 0601150A SE 0601150 L SE0601150 L SE 0601150L
- Authority
- SE
- Sweden
- Prior art keywords
- wafers
- modules
- silicon wafers
- photovoltaic cells
- production
- Prior art date
Links
- 235000012431 wafers Nutrition 0.000 title abstract 6
- 238000004519 manufacturing process Methods 0.000 title abstract 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title abstract 3
- 238000000034 method Methods 0.000 title abstract 3
- 229910052710 silicon Inorganic materials 0.000 title abstract 3
- 239000010703 silicon Substances 0.000 title abstract 3
- 239000000969 carrier Substances 0.000 abstract 2
- 239000000853 adhesive Substances 0.000 abstract 1
- 230000001070 adhesive effect Effects 0.000 abstract 1
- 239000011521 glass Substances 0.000 abstract 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 abstract 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/67346—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders characterized by being specially adapted for supporting a single substrate or by comprising a stack of such individual supports
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67751—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber vertical transfer of a single workpiece
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Photovoltaic Devices (AREA)
Abstract
Method for the production of photovoltaic modules from mono- or multi-crystalline silicon wafers and from wafers produced by ribbon silicon methods, whereby prior to said production each silicon wafer is affixed to a carrier by the use of vacuum, an adhesive or a frame. The wafers remain affixed to their respective carriers during the necessary processing steps, where-after the wafers are loosened from their carriers and placed onto glass sheets upon fÊnalization of the last production step.
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SE0601150A SE0601150L (en) | 2006-05-24 | 2006-05-24 | Method for manufacturing photovoltaic cells and modules from silicon wafers |
PCT/SE2007/000472 WO2007136318A1 (en) | 2006-05-24 | 2007-05-16 | Method for producing photovoltaic cells and modules from silicon wafers |
EP07748136A EP2022086A4 (en) | 2006-05-24 | 2007-05-16 | Method for producing photovoltaic cells and modules from silicon wafers |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SE0601150A SE0601150L (en) | 2006-05-24 | 2006-05-24 | Method for manufacturing photovoltaic cells and modules from silicon wafers |
Publications (2)
Publication Number | Publication Date |
---|---|
SE529315C2 SE529315C2 (en) | 2007-07-03 |
SE0601150L true SE0601150L (en) | 2007-07-03 |
Family
ID=38229520
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SE0601150A SE0601150L (en) | 2006-05-24 | 2006-05-24 | Method for manufacturing photovoltaic cells and modules from silicon wafers |
Country Status (3)
Country | Link |
---|---|
EP (1) | EP2022086A4 (en) |
SE (1) | SE0601150L (en) |
WO (1) | WO2007136318A1 (en) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102007038240B4 (en) * | 2007-08-13 | 2013-02-07 | Institut für Kunststofftechnologie und -recycling e.V. | Method and plant for the production of a solar module |
DE102008046327A1 (en) * | 2008-08-29 | 2010-03-04 | Schmid Technology Systems Gmbh | Production system i.e. production line, for processing and/or manufacturing solar cells to solar cell module, has production device for merging pre-confectioned solar cells provided at substrate on support glass for producing module |
DE102008046328A1 (en) * | 2008-08-29 | 2010-03-04 | Schmid Technology Systems Gmbh | Support for solar cells and process for processing solar cells |
DE202008012449U1 (en) | 2008-09-18 | 2010-02-25 | Kuka Systems Gmbh | Manufacturing device for strings |
US8922972B2 (en) | 2011-08-12 | 2014-12-30 | General Electric Company | Integral module power conditioning system |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4219926A (en) * | 1979-02-23 | 1980-09-02 | Nasa | Method and apparatus for fabricating improved solar cell modules |
US4561541A (en) * | 1983-09-26 | 1985-12-31 | Spectrolab, Incorporated | Carrier system for photovoltaic cells |
US4602417A (en) * | 1983-10-24 | 1986-07-29 | Trw Inc. | Interconnector attachment machine |
US4617722A (en) * | 1984-12-04 | 1986-10-21 | Mobil Solar Energy Corporation | Method for electrically interconnecting solar cells |
JP3732250B2 (en) * | 1995-03-30 | 2006-01-05 | キヤノンアネルバ株式会社 | In-line deposition system |
DE19928799A1 (en) * | 1999-06-23 | 2001-01-04 | Siemens Ag | Mobile workpiece carrier and method for using it |
US6423565B1 (en) * | 2000-05-30 | 2002-07-23 | Kurt L. Barth | Apparatus and processes for the massproduction of photovotaic modules |
US7259321B2 (en) * | 2002-01-07 | 2007-08-21 | Bp Corporation North America Inc. | Method of manufacturing thin film photovoltaic modules |
DE10348542A1 (en) * | 2002-11-28 | 2004-06-17 | Brose, Ursula | Cell contacting and attachment process for photovoltaic module, involves using conductive adhesive layer to attach cell to a carrier |
-
2006
- 2006-05-24 SE SE0601150A patent/SE0601150L/en unknown
-
2007
- 2007-05-16 WO PCT/SE2007/000472 patent/WO2007136318A1/en active Application Filing
- 2007-05-16 EP EP07748136A patent/EP2022086A4/en not_active Withdrawn
Also Published As
Publication number | Publication date |
---|---|
SE529315C2 (en) | 2007-07-03 |
EP2022086A1 (en) | 2009-02-11 |
WO2007136318A1 (en) | 2007-11-29 |
EP2022086A4 (en) | 2010-03-31 |
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