EP2022086A4 - Method for producing photovoltaic cells and modules from silicon wafers - Google Patents

Method for producing photovoltaic cells and modules from silicon wafers

Info

Publication number
EP2022086A4
EP2022086A4 EP07748136A EP07748136A EP2022086A4 EP 2022086 A4 EP2022086 A4 EP 2022086A4 EP 07748136 A EP07748136 A EP 07748136A EP 07748136 A EP07748136 A EP 07748136A EP 2022086 A4 EP2022086 A4 EP 2022086A4
Authority
EP
European Patent Office
Prior art keywords
modules
silicon wafers
photovoltaic cells
producing photovoltaic
producing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP07748136A
Other languages
German (de)
French (fr)
Other versions
EP2022086A1 (en
Inventor
Goeran Fajersson
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Publication of EP2022086A1 publication Critical patent/EP2022086A1/en
Publication of EP2022086A4 publication Critical patent/EP2022086A4/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67346—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders characterized by being specially adapted for supporting a single substrate or by comprising a stack of such individual supports
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67751—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber vertical transfer of a single workpiece
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Photovoltaic Devices (AREA)
EP07748136A 2006-05-24 2007-05-16 Method for producing photovoltaic cells and modules from silicon wafers Withdrawn EP2022086A4 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
SE0601150A SE529315C2 (en) 2006-05-24 2006-05-24 Producing photovoltaic modules from mono- or multi-crystalline silicon wafers, comprises affixing each silicon wafer to a carrier using vacuum, ceramic adhesive/frame, and carrying the silicon wafer on one side or each side of the carrier
PCT/SE2007/000472 WO2007136318A1 (en) 2006-05-24 2007-05-16 Method for producing photovoltaic cells and modules from silicon wafers

Publications (2)

Publication Number Publication Date
EP2022086A1 EP2022086A1 (en) 2009-02-11
EP2022086A4 true EP2022086A4 (en) 2010-03-31

Family

ID=38229520

Family Applications (1)

Application Number Title Priority Date Filing Date
EP07748136A Withdrawn EP2022086A4 (en) 2006-05-24 2007-05-16 Method for producing photovoltaic cells and modules from silicon wafers

Country Status (3)

Country Link
EP (1) EP2022086A4 (en)
SE (1) SE529315C2 (en)
WO (1) WO2007136318A1 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102007038240B4 (en) * 2007-08-13 2013-02-07 Institut für Kunststofftechnologie und -recycling e.V. Method and plant for the production of a solar module
DE102008046327A1 (en) * 2008-08-29 2010-03-04 Schmid Technology Systems Gmbh Production system i.e. production line, for processing and/or manufacturing solar cells to solar cell module, has production device for merging pre-confectioned solar cells provided at substrate on support glass for producing module
DE102008046328A1 (en) * 2008-08-29 2010-03-04 Schmid Technology Systems Gmbh Support for solar cells and process for processing solar cells
DE202008012449U1 (en) 2008-09-18 2010-02-25 Kuka Systems Gmbh Manufacturing device for strings
US8922972B2 (en) 2011-08-12 2014-12-30 General Electric Company Integral module power conditioning system

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4219926A (en) * 1979-02-23 1980-09-02 Nasa Method and apparatus for fabricating improved solar cell modules
WO1986003623A1 (en) * 1984-12-04 1986-06-19 Mobil Solar Energy Corporation Method for electrically interconnecting solar cells
US4602417A (en) * 1983-10-24 1986-07-29 Trw Inc. Interconnector attachment machine
US5846328A (en) * 1995-03-30 1998-12-08 Anelva Corporation In-line film deposition system
EP1160880A2 (en) * 2000-05-30 2001-12-05 Kurt L. Barth Apparatus and processes for the mass production of photovoltaic modules
US20030180983A1 (en) * 2002-01-07 2003-09-25 Oswald Robert S. Method of manufacturing thin film photovoltaic modules

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4561541A (en) * 1983-09-26 1985-12-31 Spectrolab, Incorporated Carrier system for photovoltaic cells
DE19928799A1 (en) * 1999-06-23 2001-01-04 Siemens Ag Mobile workpiece carrier and method for using it
DE10348542A1 (en) * 2002-11-28 2004-06-17 Brose, Ursula Cell contacting and attachment process for photovoltaic module, involves using conductive adhesive layer to attach cell to a carrier

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4219926A (en) * 1979-02-23 1980-09-02 Nasa Method and apparatus for fabricating improved solar cell modules
US4602417A (en) * 1983-10-24 1986-07-29 Trw Inc. Interconnector attachment machine
WO1986003623A1 (en) * 1984-12-04 1986-06-19 Mobil Solar Energy Corporation Method for electrically interconnecting solar cells
US5846328A (en) * 1995-03-30 1998-12-08 Anelva Corporation In-line film deposition system
EP1160880A2 (en) * 2000-05-30 2001-12-05 Kurt L. Barth Apparatus and processes for the mass production of photovoltaic modules
US20050158891A1 (en) * 2000-05-30 2005-07-21 Barth Kurt L. Apparatus and processes for the mass production of photovoltaic modules
US20030180983A1 (en) * 2002-01-07 2003-09-25 Oswald Robert S. Method of manufacturing thin film photovoltaic modules

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2007136318A1 *

Also Published As

Publication number Publication date
WO2007136318A1 (en) 2007-11-29
SE0601150L (en) 2007-07-03
EP2022086A1 (en) 2009-02-11
SE529315C2 (en) 2007-07-03

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