SE0400177D0 - Sensor - Google Patents

Sensor

Info

Publication number
SE0400177D0
SE0400177D0 SE0400177A SE0400177A SE0400177D0 SE 0400177 D0 SE0400177 D0 SE 0400177D0 SE 0400177 A SE0400177 A SE 0400177A SE 0400177 A SE0400177 A SE 0400177A SE 0400177 D0 SE0400177 D0 SE 0400177D0
Authority
SE
Sweden
Prior art keywords
membrane
force sensor
springs
electrodes
bulk structure
Prior art date
Application number
SE0400177A
Other languages
English (en)
Original Assignee
Nanofactory Instruments Ab
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nanofactory Instruments Ab filed Critical Nanofactory Instruments Ab
Priority to SE0400177A priority Critical patent/SE0400177D0/sv
Publication of SE0400177D0 publication Critical patent/SE0400177D0/sv
Priority to EP05704766A priority patent/EP1706888A2/en
Priority to US10/586,729 priority patent/US7654159B2/en
Priority to PCT/SE2005/000098 priority patent/WO2005069748A2/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01Q—SCANNING-PROBE TECHNIQUES OR APPARATUS; APPLICATIONS OF SCANNING-PROBE TECHNIQUES, e.g. SCANNING PROBE MICROSCOPY [SPM]
    • G01Q60/00—Particular types of SPM [Scanning Probe Microscopy] or microscopes; Essential components thereof
    • G01Q60/24—AFM [Atomic Force Microscopy] or apparatus therefor, e.g. AFM probes
    • G01Q60/36—DC mode
    • G01Q60/366—Nanoindenters, i.e. wherein the indenting force is measured
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01Q—SCANNING-PROBE TECHNIQUES OR APPARATUS; APPLICATIONS OF SCANNING-PROBE TECHNIQUES, e.g. SCANNING PROBE MICROSCOPY [SPM]
    • G01Q30/00—Auxiliary means serving to assist or improve the scanning probe techniques or apparatus, e.g. display or data processing devices
    • G01Q30/02—Non-SPM analysing devices, e.g. SEM [Scanning Electron Microscope], spectrometer or optical microscope
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01Q—SCANNING-PROBE TECHNIQUES OR APPARATUS; APPLICATIONS OF SCANNING-PROBE TECHNIQUES, e.g. SCANNING PROBE MICROSCOPY [SPM]
    • G01Q80/00—Applications, other than SPM, of scanning-probe techniques
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/20—Positioning, supporting, modifying or maintaining the physical state of objects being observed or treated
    • H01J2237/206—Modifying objects while observing
    • H01J2237/2067—Surface alteration
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor

Landscapes

  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Nuclear Medicine, Radiotherapy & Molecular Imaging (AREA)
  • Radiology & Medical Imaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Nanotechnology (AREA)
  • Micromachines (AREA)
  • Force Measurement Appropriate To Specific Purposes (AREA)
  • Pressure Sensors (AREA)
SE0400177A 2004-01-26 2004-01-26 Sensor SE0400177D0 (sv)

Priority Applications (4)

Application Number Priority Date Filing Date Title
SE0400177A SE0400177D0 (sv) 2004-01-26 2004-01-26 Sensor
EP05704766A EP1706888A2 (en) 2004-01-26 2005-01-26 Mems nanoindenter
US10/586,729 US7654159B2 (en) 2004-01-26 2005-01-26 MEMS nanoindenter
PCT/SE2005/000098 WO2005069748A2 (en) 2004-01-26 2005-01-26 Mems nanoindenter

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SE0400177A SE0400177D0 (sv) 2004-01-26 2004-01-26 Sensor

Publications (1)

Publication Number Publication Date
SE0400177D0 true SE0400177D0 (sv) 2004-01-26

Family

ID=31713246

Family Applications (1)

Application Number Title Priority Date Filing Date
SE0400177A SE0400177D0 (sv) 2004-01-26 2004-01-26 Sensor

Country Status (4)

Country Link
US (1) US7654159B2 (sv)
EP (1) EP1706888A2 (sv)
SE (1) SE0400177D0 (sv)
WO (1) WO2005069748A2 (sv)

Families Citing this family (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7798011B2 (en) * 2006-02-08 2010-09-21 Hysitron, Inc. Actuatable capacitive transducer for quantitative nanoindentation combined with transmission electron microscopy
US8945970B2 (en) * 2006-09-22 2015-02-03 Carnegie Mellon University Assembling and applying nano-electro-mechanical systems
WO2008089950A1 (en) * 2007-01-22 2008-07-31 Nanofactory Instruments Ab Mems sensor for in situ tem atomic force microscopy
US9335240B2 (en) 2008-07-03 2016-05-10 Hysitron Incorporated Method of measuring an interaction force
WO2010003149A1 (en) 2008-07-03 2010-01-07 Hysitron Incorporated Micromachined comb drive for quantitative nanoindentation
JP5826760B2 (ja) 2009-11-27 2015-12-02 ハイジトロン, インク.Hysitron, Inc. ミクロ電気機械ヒータ
US8631687B2 (en) 2010-04-19 2014-01-21 Hysitron, Inc. Indenter assembly
WO2012122523A1 (en) * 2011-03-09 2012-09-13 Warren Oden Lee Three dimensional transducer
US8717043B2 (en) 2011-07-27 2014-05-06 International Business Machines Corporation Determining thermal interface material (TIM) thickness change
US8794079B2 (en) 2011-11-04 2014-08-05 International Business Machines Corporation Determining magnitude of compressive loading
US9476816B2 (en) 2011-11-14 2016-10-25 Hysitron, Inc. Probe tip heating assembly
EP2786116B1 (en) 2011-11-28 2020-07-15 Bruker Nano, Inc. High temperature heating system
US9829417B2 (en) 2012-06-13 2017-11-28 Hysitron, Inc. Environmental conditioning assembly for use in mechanical testing at micron or nano-scales
EP2926111B1 (en) * 2012-11-28 2022-07-27 Bruker Nano, Inc. Micromachined comb drive for quantitative nanoindentation
US9535086B2 (en) 2014-06-24 2017-01-03 Femtotools Ag Interface of a microfabricated scanning force sensor for combined force and position sensing
US10168261B2 (en) 2015-03-23 2019-01-01 Kla-Tencor Corporation Structure for achieving dimensional stability during temperature changes
US10151715B2 (en) 2015-09-03 2018-12-11 Saudi Arabian Oil Company Nano-level evaluation of kerogen-rich reservoir rock
US9869649B2 (en) 2015-09-03 2018-01-16 Saudi Arabian Oil Company Nano-level evaluation of kerogen-rich reservoir rock
CN105223213B (zh) * 2015-09-28 2017-12-15 北京工业大学 一种透射电镜双倾原位纳米压痕平台
US10451601B2 (en) 2016-06-28 2019-10-22 Saudi Arabian Oil Company Nano-indentation test to determine mechanical properties of reservoir rock
EP3489654B1 (en) 2017-11-22 2020-07-29 FemtoTools AG Mems nanoindenter chip with indenter probe and reference probe
EP3690423B8 (en) 2019-02-04 2023-11-29 Femtotools AG Mems-based nanoindentation force sensor with electro-thermal tip heating
WO2021016515A1 (en) 2019-07-24 2021-01-28 Saudi Arabian Oil Company Oxidizing gasses for carbon dioxide-based fracturing fluids
US11492541B2 (en) 2019-07-24 2022-11-08 Saudi Arabian Oil Company Organic salts of oxidizing anions as energetic materials
WO2021138355A1 (en) 2019-12-31 2021-07-08 Saudi Arabian Oil Company Viscoelastic-surfactant fracturing fluids having oxidizer
US11352548B2 (en) 2019-12-31 2022-06-07 Saudi Arabian Oil Company Viscoelastic-surfactant treatment fluids having oxidizer
US11339321B2 (en) 2019-12-31 2022-05-24 Saudi Arabian Oil Company Reactive hydraulic fracturing fluid
US11473001B2 (en) 2020-01-17 2022-10-18 Saudi Arabian Oil Company Delivery of halogens to a subterranean formation
US11268373B2 (en) 2020-01-17 2022-03-08 Saudi Arabian Oil Company Estimating natural fracture properties based on production from hydraulically fractured wells
US11473009B2 (en) 2020-01-17 2022-10-18 Saudi Arabian Oil Company Delivery of halogens to a subterranean formation
US11365344B2 (en) 2020-01-17 2022-06-21 Saudi Arabian Oil Company Delivery of halogens to a subterranean formation
US11578263B2 (en) 2020-05-12 2023-02-14 Saudi Arabian Oil Company Ceramic-coated proppant
US11542815B2 (en) 2020-11-30 2023-01-03 Saudi Arabian Oil Company Determining effect of oxidative hydraulic fracturing
US20230280218A1 (en) * 2022-03-01 2023-09-07 Asmpt Singapore Pte. Ltd. Force measurement device and method for bonding or encapsulation process and apparatus incorporating the device

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3287858B2 (ja) * 1991-05-15 2002-06-04 株式会社日立製作所 電子顕微鏡装置及び電子顕微方法
DE4309206C1 (de) * 1993-03-22 1994-09-15 Texas Instruments Deutschland Halbleitervorrichtung mit einem Kraft- und/oder Beschleunigungssensor
US6026677A (en) * 1993-10-01 2000-02-22 Hysitron, Incorporated Apparatus for microindentation hardness testing and surface imaging incorporating a multi-plate capacitor system
US5553486A (en) 1993-10-01 1996-09-10 Hysitron Incorporated Apparatus for microindentation hardness testing and surface imaging incorporating a multi-plate capacitor system
SE0000555D0 (sv) 2000-02-22 2000-02-22 Nanofactory Instruments Ab Mätanordning för transmissions-elektron-mikroskop
US6806991B1 (en) * 2001-08-16 2004-10-19 Zyvex Corporation Fully released MEMs XYZ flexure stage with integrated capacitive feedback
SE0103781D0 (sv) 2001-11-12 2001-11-12 Nanofactory Instruments Ab Mätanordning för elektronmikroskop
US7461543B2 (en) * 2005-06-17 2008-12-09 Georgia Tech Research Corporation Overlay measurement methods with firat based probe microscope

Also Published As

Publication number Publication date
EP1706888A2 (en) 2006-10-04
WO2005069748A2 (en) 2005-08-04
US20080276727A1 (en) 2008-11-13
US7654159B2 (en) 2010-02-02
WO2005069748A3 (en) 2005-09-22

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