SE0103922L - Värmestyrd optoelektrisk enhet - Google Patents

Värmestyrd optoelektrisk enhet

Info

Publication number
SE0103922L
SE0103922L SE0103922A SE0103922A SE0103922L SE 0103922 L SE0103922 L SE 0103922L SE 0103922 A SE0103922 A SE 0103922A SE 0103922 A SE0103922 A SE 0103922A SE 0103922 L SE0103922 L SE 0103922L
Authority
SE
Sweden
Prior art keywords
capsule
primary heat
circuit board
heat sink
optoelectrical
Prior art date
Application number
SE0103922A
Other languages
English (en)
Other versions
SE522857C2 (sv
Inventor
Lars Lindberg
Original Assignee
Optillion Ab
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Optillion Ab filed Critical Optillion Ab
Priority to SE0103922A priority Critical patent/SE522857C2/sv
Priority to AU2002353719A priority patent/AU2002353719A1/en
Priority to PCT/SE2002/002141 priority patent/WO2003044917A1/en
Priority to US10/495,851 priority patent/US6992895B2/en
Publication of SE0103922L publication Critical patent/SE0103922L/sv
Publication of SE522857C2 publication Critical patent/SE522857C2/sv

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/024—Arrangements for thermal management
    • H01S5/02407—Active cooling, e.g. the laser temperature is controlled by a thermo-electric cooler or water cooling
    • H01S5/02415—Active cooling, e.g. the laser temperature is controlled by a thermo-electric cooler or water cooling by using a thermo-electric cooler [TEC], e.g. Peltier element
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4274—Electrical aspects
    • G02B6/4277—Protection against electromagnetic interference [EMI], e.g. shielding means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4266—Thermal aspects, temperature control or temperature monitoring
    • G02B6/4268—Cooling
    • G02B6/4269—Cooling with heat sinks or radiation fins
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4292—Coupling light guides with opto-electronic elements the light guide being disconnectable from the opto-electronic element, e.g. mutually self aligning arrangements

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Optics & Photonics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Semiconductor Lasers (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
SE0103922A 2001-11-23 2001-11-23 Värmestyrd optoelektrisk enhet SE522857C2 (sv)

Priority Applications (4)

Application Number Priority Date Filing Date Title
SE0103922A SE522857C2 (sv) 2001-11-23 2001-11-23 Värmestyrd optoelektrisk enhet
AU2002353719A AU2002353719A1 (en) 2001-11-23 2002-11-22 Heat controlled optoelectrical unit
PCT/SE2002/002141 WO2003044917A1 (en) 2001-11-23 2002-11-22 Heat controlled optoelectrical unit
US10/495,851 US6992895B2 (en) 2001-11-23 2002-11-22 Heat controlled optoelectrical unit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SE0103922A SE522857C2 (sv) 2001-11-23 2001-11-23 Värmestyrd optoelektrisk enhet

Publications (2)

Publication Number Publication Date
SE0103922L true SE0103922L (sv) 2003-05-24
SE522857C2 SE522857C2 (sv) 2004-03-09

Family

ID=20286087

Family Applications (1)

Application Number Title Priority Date Filing Date
SE0103922A SE522857C2 (sv) 2001-11-23 2001-11-23 Värmestyrd optoelektrisk enhet

Country Status (4)

Country Link
US (1) US6992895B2 (sv)
AU (1) AU2002353719A1 (sv)
SE (1) SE522857C2 (sv)
WO (1) WO2003044917A1 (sv)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100542190B1 (ko) * 2003-10-17 2006-01-11 삼성에스디아이 주식회사 드라이버 ｉｃ 방열구조를 갖는 플라즈마 디스플레이 장치
US7508673B2 (en) * 2004-03-04 2009-03-24 Samsung Sdi Co., Ltd. Heat dissipating apparatus for plasma display device
US7405931B2 (en) * 2004-09-20 2008-07-29 Nortel Networks Limited Floating heatsink for removable components
US7224582B1 (en) * 2004-09-20 2007-05-29 Nortel Networks Limited Floating heatsink for removable components
KR100677620B1 (ko) * 2005-11-22 2007-02-02 삼성전자주식회사 전자기기의 냉각 방법 및 냉각 효율이 향상된 전자기기
CN101018467B (zh) * 2006-02-11 2010-05-26 富准精密工业(深圳)有限公司 散热装置
US7345879B2 (en) * 2006-05-15 2008-03-18 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device
US20080068805A1 (en) * 2006-09-15 2008-03-20 Foxconn Technology Co., Ltd. Heat sink assembly for multiple electronic components
US7780361B2 (en) * 2008-04-02 2010-08-24 Ciena Corporation Card guide and heatsink assemblies for pluggable electro-optic modules
CN101907908B (zh) * 2009-06-04 2013-03-13 富准精密工业(深圳)有限公司 电子设备及其机箱
US20110206328A1 (en) * 2010-02-25 2011-08-25 Emcore Corporation Optoelectronic module with emi shield
JP2012015488A (ja) * 2010-06-01 2012-01-19 Sumitomo Electric Ind Ltd 光モジュール
JP5533431B2 (ja) * 2010-08-23 2014-06-25 住友電気工業株式会社 光モジュール
US8358504B2 (en) * 2011-01-18 2013-01-22 Avago Technologies Enterprise IP (Singapore) Pte. Ltd. Direct cooling system and method for transceivers
US20130064512A1 (en) * 2011-09-08 2013-03-14 Nayana Ghantiwala Cooling system for an optical module
WO2013159040A1 (en) 2012-04-19 2013-10-24 Packet Photonics, Inc. Heat removal system for devices and subassemblies
CN103676027B (zh) * 2012-09-14 2016-01-27 泰科电子(上海)有限公司 连接器
US9883612B2 (en) 2015-06-02 2018-01-30 International Business Machines Corporation Heat sink attachment on existing heat sinks
US20160381442A1 (en) * 2015-06-25 2016-12-29 Kaiam Corp. Optical interconnect for switch applications
CN110798961B (zh) * 2018-08-01 2022-10-21 苏州旭创科技有限公司 一种电路板及具有其的光模块
US10901161B2 (en) * 2018-09-14 2021-01-26 Toyota Motor Engineering & Manufacturing North America, Inc. Optical power transfer devices with an embedded active cooling chip
US10691184B1 (en) 2018-11-29 2020-06-23 Hewlett Packard Enterprise Development Lp Heat sink assemblies having removable portions
WO2022083149A1 (zh) * 2020-10-19 2022-04-28 青岛海信宽带多媒体技术有限公司 一种光模块
TWI826860B (zh) * 2021-11-10 2023-12-21 英業達股份有限公司 液冷模組及電子裝置

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Publication number Priority date Publication date Assignee Title
NL8800140A (nl) 1988-01-22 1989-08-16 Philips Nv Laserdiode module.
DE3922800A1 (de) * 1989-07-11 1991-01-17 Siemens Ag Laserdiodensender mit handelsueblichem lasermodul
JPH04256203A (ja) 1991-02-07 1992-09-10 Mitsubishi Electric Corp マイクロ波帯ｉｃ用パッケージ
US5513073A (en) * 1994-04-18 1996-04-30 International Business Machines Corporation Optical device heat spreader and thermal isolation apparatus
JPH11196055A (ja) 1997-12-26 1999-07-21 Hitachi Cable Ltd 光送受信器
DE19832710A1 (de) * 1998-07-14 2000-01-27 Siemens Ag Elektrooptische Baugruppe
US6583902B1 (en) * 1999-12-09 2003-06-24 Alvesta, Inc. Modular fiber-optic transceiver
DE10013844A1 (de) * 2000-03-15 2001-09-27 Infineon Technologies Ag Vorrichtung zum Kühlen eines elektrischen Moduls
US6508595B1 (en) * 2000-05-11 2003-01-21 International Business Machines Corporation Assembly of opto-electronic module with improved heat sink
FR2810192A1 (fr) * 2000-06-08 2001-12-14 Cit Alcatel Montage electronique a haute densite d'interconnexions
US6614659B2 (en) * 2001-12-07 2003-09-02 Delphi Technologies, Inc. De-mountable, solderless in-line lead module package with interface
US6729771B2 (en) * 2001-12-17 2004-05-04 Stratos Lightwave, Inc. Parallel optics subassembly having at least twelve lenses
US6747820B2 (en) * 2002-10-23 2004-06-08 Intel Corporation Cooling opto-electronic packages
US6870746B2 (en) * 2002-11-06 2005-03-22 Agilent Technologies, Inc. Electronic module

Also Published As

Publication number Publication date
SE522857C2 (sv) 2004-03-09
WO2003044917A1 (en) 2003-05-30
US6992895B2 (en) 2006-01-31
AU2002353719A1 (en) 2003-06-10
US20040257738A1 (en) 2004-12-23

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Legal Events

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NUG Patent has lapsed