SE0004614D0 - Shielded inductor - Google Patents

Shielded inductor

Info

Publication number
SE0004614D0
SE0004614D0 SE0004614A SE0004614A SE0004614D0 SE 0004614 D0 SE0004614 D0 SE 0004614D0 SE 0004614 A SE0004614 A SE 0004614A SE 0004614 A SE0004614 A SE 0004614A SE 0004614 D0 SE0004614 D0 SE 0004614D0
Authority
SE
Sweden
Prior art keywords
substrate
inductor
contacts
electrically
islands
Prior art date
Application number
SE0004614A
Other languages
Swedish (sv)
Other versions
SE520093C2 (en
SE0004614L (en
Inventor
Ted Johansson
Hans Norstroem
Mats Carlsson
Original Assignee
Ericsson Telefon Ab L M
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ericsson Telefon Ab L M filed Critical Ericsson Telefon Ab L M
Priority to SE0004614A priority Critical patent/SE520093C2/en
Publication of SE0004614D0 publication Critical patent/SE0004614D0/en
Priority to TW090103022A priority patent/TW518619B/en
Priority to AU2002222870A priority patent/AU2002222870A1/en
Priority to PCT/SE2001/002768 priority patent/WO2002049110A1/en
Publication of SE0004614L publication Critical patent/SE0004614L/en
Publication of SE520093C2 publication Critical patent/SE520093C2/en

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L28/00Passive two-terminal components without a potential-jump or surface barrier for integrated circuits; Details thereof; Multistep manufacturing processes therefor
    • H01L28/10Inductors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/52Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/5227Inductive arrangements or effects of, or between, wiring layers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/04Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
    • H01L27/08Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)

Abstract

An integrated circuit comprises an inductor path (17) formed in a metal layer located in a surface structure on top of an electrically well conducting substrate (7). Trenches (1) filled with an electrically isolating material are located under the inductor path and are arranged in a meshlike or grid pattern. In order to improve the shielding of the inductor path and to simultaneously improve the Q-value of the inductor, in the islands (5) of material formed in the surface structure between the meshes of the pattern deep substrate contacts (11) are located. The substrate contacts extend down into the substrate and the substrate and the contacts are intended to be connected to ground potential. Electrically conducting areas (13) can cover the islands and are then connected to the substrate contacts.
SE0004614A 2000-12-13 2000-12-13 Shielded inductor SE520093C2 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
SE0004614A SE520093C2 (en) 2000-12-13 2000-12-13 Shielded inductor
TW090103022A TW518619B (en) 2000-12-13 2001-02-12 Integrated circuit
AU2002222870A AU2002222870A1 (en) 2000-12-13 2001-12-13 Shielded inductor
PCT/SE2001/002768 WO2002049110A1 (en) 2000-12-13 2001-12-13 Shielded inductor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SE0004614A SE520093C2 (en) 2000-12-13 2000-12-13 Shielded inductor

Publications (3)

Publication Number Publication Date
SE0004614D0 true SE0004614D0 (en) 2000-12-13
SE0004614L SE0004614L (en) 2002-06-14
SE520093C2 SE520093C2 (en) 2003-05-27

Family

ID=20282217

Family Applications (1)

Application Number Title Priority Date Filing Date
SE0004614A SE520093C2 (en) 2000-12-13 2000-12-13 Shielded inductor

Country Status (4)

Country Link
AU (1) AU2002222870A1 (en)
SE (1) SE520093C2 (en)
TW (1) TW518619B (en)
WO (1) WO2002049110A1 (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050247999A1 (en) * 2003-05-29 2005-11-10 Kazuyasu Nishikawa Semiconductor device
US6833603B1 (en) 2003-08-11 2004-12-21 International Business Machines Corporation Dynamically patterned shielded high-Q inductor
US8084829B2 (en) 2004-04-27 2011-12-27 Nxp B.V. Semiconductors device and method of manufacturing such a device
US7268409B2 (en) 2004-05-21 2007-09-11 Taiwan Semiconductor Manufacturing Company, Ltd. Spiral inductor with electrically controllable resistivity of silicon substrate layer
US7247922B2 (en) 2004-09-24 2007-07-24 Taiwan Semiconductor Manufacturing Company, Ltd. Inductor energy loss reduction techniques
US10217703B2 (en) * 2017-01-03 2019-02-26 Xilinx, Inc. Circuits for and methods of implementing an inductor and a pattern ground shield in an integrated circuit

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3592505B2 (en) * 1997-11-10 2004-11-24 松下電器産業株式会社 Manufacturing method of inductor element
TW363278B (en) * 1998-01-16 1999-07-01 Winbond Electronics Corp Preparation method for semiconductor to increase the inductive resonance frequency and Q value
US6310387B1 (en) * 1999-05-03 2001-10-30 Silicon Wave, Inc. Integrated circuit inductor with high self-resonance frequency
US6140197A (en) * 1999-08-30 2000-10-31 Chartered Semiconductor Manufacturing Ltd. Method of making spiral-type RF inductors having a high quality factor (Q)

Also Published As

Publication number Publication date
SE520093C2 (en) 2003-05-27
TW518619B (en) 2003-01-21
SE0004614L (en) 2002-06-14
WO2002049110A1 (en) 2002-06-20
AU2002222870A1 (en) 2002-06-24

Similar Documents

Publication Publication Date Title
TW351832B (en) Method for fabricating semiconductor member
WO2000059281A8 (en) Shielding apparatus for electronic devices
EP0845815A3 (en) Semiconductor device, method of designing the same and semiconductor integrated circuit device
TW375861B (en) Wiring board constructions and methods of making same
TW336348B (en) Integrated circuit having a dummy structure and method of making the same
SE0102167L (en) Device
SG81960A1 (en) Semiconductor device, substrate for a semiconductor device, method of manufacture thereof, and electronic instrument
ATE512575T1 (en) ELECTROMAGNETIC SHIELDED LAYER, ELECTROMAGNETIC SHIELDED STRUCTURE AND ENTERTAINMENT DEVICE
TW363256B (en) Semiconductor integrated circuit, design and manufacturing method thereof
TW200511500A (en) Semiconductor device having electrical contact from opposite sides and method therefor
EP1538672A4 (en) Semiconductor device
WO2000067320A3 (en) Integrated circuit inductor with high self-resonance frequency
SE9801794D0 (en) Integrated microwave hybrid circuit
TW200701264A (en) Inductor
NO20003003L (en) Miniature sensor
TW200515568A (en) Circuit barrier structure of semiconductor package substrate and method for fabricating the same
KR960019663A (en) Method for manufacturing multilevel metallization of integrated circuits
SE0004614L (en) Shielded inductor
TW200740326A (en) Method of making a circuitized substrate having a plurality of solder connection sites thereon
DE50000836D1 (en) METHOD FOR PUTTING CONTACT HOLES INTO AN ELECTRICALLY INSULATING BASE MATERIAL PROVIDED ON TWO-SIDED METAL LAYERS
MY119979A (en) Integrated capacitor using embedded enclosure for effective electromagnetic radiation reduction
ATE376256T1 (en) CIRCUIT COMPRISING A CAPACITOR AND AT LEAST ONE SEMICONDUCTOR COMPONENT AND DESIGN METHOD THEREOF
WO2003058327A8 (en) Surface type optical modulator and its manufacturing method
MY123561A (en) Integrated circuit structure.
GB2364170B (en) Dual damascene bond pad structure for lowering stress and allowing circuitry under pads and a process to form the same

Legal Events

Date Code Title Description
NUG Patent has lapsed