RU99122604A - ELECTRONIC MODULE FOR ELECTRONIC CARD - Google Patents

ELECTRONIC MODULE FOR ELECTRONIC CARD

Info

Publication number
RU99122604A
RU99122604A RU99122604/09A RU99122604A RU99122604A RU 99122604 A RU99122604 A RU 99122604A RU 99122604/09 A RU99122604/09 A RU 99122604/09A RU 99122604 A RU99122604 A RU 99122604A RU 99122604 A RU99122604 A RU 99122604A
Authority
RU
Russia
Prior art keywords
electronic
electronic module
module according
substrate
card
Prior art date
Application number
RU99122604/09A
Other languages
Russian (ru)
Other versions
RU2200975C2 (en
Inventor
Мишель ЗАФРАНИ
Филипп ПАТРИС
Original Assignee
Жемплюс С.С.А.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from FR9704094A external-priority patent/FR2761498B1/en
Application filed by Жемплюс С.С.А. filed Critical Жемплюс С.С.А.
Publication of RU99122604A publication Critical patent/RU99122604A/en
Application granted granted Critical
Publication of RU2200975C2 publication Critical patent/RU2200975C2/en

Links

Claims (7)

1. Электронный модуль (94), предназначенный, в частности, для установки в электронное устройство в виде карточки, включающий в себя подложку (10; 40; 108), имеющую, по меньшей мере, одну поверхность (12; 44) с контактными дорожками (14; 46; 48; 50), и микросхему (20; 56; 70; 98), закрепленную на указанной подложке (10; 40; 108) и имеющую выходные контакты (22; 60, 62; 72, 74, 76, 78, 80), каждый из которых соединен с контактной дорожкой подложки, отличающийся тем, что соединения (66, 68; 86, 88) между выходными контактами и контактными дорожками образованы швом из адгезивного токопроводящего вещества, нанесенным по рельефу подложки.1. An electronic module (94), designed in particular for installation in an electronic device in the form of a card, including a substrate (10; 40; 108) having at least one surface (12; 44) with contact tracks (14; 46; 48; 50), and a microcircuit (20; 56; 70; 98), mounted on the specified substrate (10; 40; 108) and having output contacts (22; 60, 62; 72, 74, 76, 78, 80), each of which is connected to the contact track of the substrate, characterized in that the compounds (66, 68; 86, 88) between the output contacts and contact tracks are formed by a seam of adhesive conductive in residues applied to the relief of the substrate. 2. Способ изготовления электронного модуля по п.1, отличающийся тем, что шов выполняют путем нанесения вязкого токопроводящего вещества. 2. A method of manufacturing an electronic module according to claim 1, characterized in that the seam is performed by applying a viscous conductive substance. 3. Электронный модуль по п.1, отличающийся тем, что токопроводящее вещество является изотропной токопроводящей смолой. 3. The electronic module according to claim 1, characterized in that the conductive substance is an isotropic conductive resin. 4. Электронный модуль по любому из пп.1-3, отличающийся тем, что подложка имеет две поверхности с контактными дорожками. 4. The electronic module according to any one of claims 1 to 3, characterized in that the substrate has two surfaces with contact tracks. 5. Электронный модуль по любому из пп.1-4, отличающийся тем, одна из поверхностей модуля покрыта активируемой адгезивной пленкой. 5. The electronic module according to any one of claims 1 to 4, characterized in that one of the surfaces of the module is coated with an activated adhesive film. 6. Электронный модуль по любому из пп.1-5, отличающийся тем, что выходные контакты микросхемы имеют контактные приливы. 6. The electronic module according to any one of claims 1 to 5, characterized in that the output contacts of the microcircuit have contact tides. 7. Электронная карточка, отличающаяся тем, что она имеет, по меньшей мере, один электронный модуль по любому из пп.1-6. 7. An electronic card, characterized in that it has at least one electronic module according to any one of claims 1 to 6.
RU99122604/09A 1997-03-27 1998-03-09 Electronic module for chip card RU2200975C2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR9704094A FR2761498B1 (en) 1997-03-27 1997-03-27 ELECTRONIC MODULE AND ITS MANUFACTURING PROCESS AND CHIP CARD INCLUDING SUCH A MODULE
FR97/04094 1997-03-27

Publications (2)

Publication Number Publication Date
RU99122604A true RU99122604A (en) 2001-08-27
RU2200975C2 RU2200975C2 (en) 2003-03-20

Family

ID=9505498

Family Applications (1)

Application Number Title Priority Date Filing Date
RU99122604/09A RU2200975C2 (en) 1997-03-27 1998-03-09 Electronic module for chip card

Country Status (12)

Country Link
US (2) US6435414B1 (en)
EP (2) EP0970437A1 (en)
JP (1) JP3869860B2 (en)
CN (1) CN1183486C (en)
AU (1) AU720691B2 (en)
BR (1) BR9808062A (en)
CA (1) CA2283692A1 (en)
DE (1) DE69832104T2 (en)
FR (1) FR2761498B1 (en)
HK (1) HK1028833A1 (en)
RU (1) RU2200975C2 (en)
WO (1) WO1998044451A1 (en)

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FR2761498B1 (en) * 1997-03-27 1999-06-18 Gemplus Card Int ELECTRONIC MODULE AND ITS MANUFACTURING PROCESS AND CHIP CARD INCLUDING SUCH A MODULE
FR2785072B1 (en) * 1998-10-23 2001-01-19 St Microelectronics Sa SELF-ADHESIVE ELECTRONIC CIRCUIT
FR2797075B1 (en) * 1999-07-26 2001-10-12 Gemplus Card Int METHOD FOR MANUFACTURING A PORTABLE DEVICE WITH INTEGRATED CIRCUITS, OF THE SMART CARD TYPE OF REDUCED FORMAT IN RELATION TO THE STANDARD FORMAT
FR2797995B1 (en) * 1999-08-25 2002-03-22 Gemplus Card Int METHOD FOR PROTECTING INTEGRATED CIRCUIT CHIPS BY INSULATING THIN FILM DEPOSITION
FR2797996B1 (en) * 1999-08-25 2003-10-03 Gemplus Card Int METHOD FOR PROTECTING INTEGRATED CIRCUIT CHIPS BY INSULATING THIN FILM DEPOSITION
FR2799306B1 (en) * 1999-10-04 2003-09-19 Gemplus Card Int METHOD FOR INSULATING AN INTEGRATED CIRCUIT CHIP BY DEPOSITING MATERIAL ON THE ACTIVE FACE
FR2800198B1 (en) * 1999-10-26 2002-03-29 Gemplus Card Int METHOD FOR PROTECTING INTEGRATED CIRCUIT CHIPS BY VACUUM SUCTION
FR2808920B1 (en) * 2000-05-10 2003-10-03 Gemplus Card Int INTEGRATED CIRCUIT CHIP PROTECTION METHOD
FR2818800B1 (en) * 2000-12-21 2003-04-04 Gemplus Card Int DEFORMABLE MEMBER INTERCONNECTION FOR ELECTRONIC DEVICES
FR2818801B1 (en) * 2000-12-21 2003-04-04 Gemplus Card Int INTERCONNECTION BY CUT-OUT INSULATION DEVICE AND CONDUCTION CORD
FR2823011B1 (en) * 2001-03-30 2004-11-19 Gemplus Card Int CONNECTION BY CONDUCTIVE CORD DEPOSIT ON CONNECTION AREA DEDICATED BY INSULATING MASK
FR2845805B1 (en) * 2002-10-10 2005-06-03 Gemplus Card Int SHUTTERING ADHESIVE FORMING SHUTTLE
FR2847365B1 (en) * 2002-11-15 2005-03-11 Gemplus Card Int SIMULTANEOUS CONNECTION / CONNECTION BY INHIBITING ADHESIVE DRILLING
US7243421B2 (en) * 2003-10-29 2007-07-17 Conductive Inkjet Technology Limited Electrical connection of components
WO2007042071A1 (en) * 2005-10-10 2007-04-19 Alphasem Ag Assembly comprising at least two components that are electrically conductively operatively connected, and method for producing the assembly
DE102006056361B4 (en) * 2006-11-29 2012-08-16 Infineon Technologies Ag Module with polymer-containing electrical connection element and method
DE102008019571A1 (en) 2008-04-18 2009-10-22 Giesecke & Devrient Gmbh Chip card and method for its production
TWM425346U (en) * 2011-05-20 2012-03-21 Mxtran Inc Integrated circuit film for smart card and mobile communication device
US8991711B2 (en) * 2012-07-19 2015-03-31 Infineon Technologies Ag Chip card module
MY184608A (en) * 2013-12-10 2021-04-07 Carsem M Sdn Bhd Pre-molded integrated circuit packages
DE102014105861B4 (en) * 2014-04-25 2015-11-05 Infineon Technologies Ag Sensor device and method for producing a sensor device

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DE3338597A1 (en) * 1983-10-24 1985-05-02 GAO Gesellschaft für Automation und Organisation mbH, 8000 München DATA CARRIER WITH INTEGRATED CIRCUIT AND METHOD FOR PRODUCING THE SAME
US4999136A (en) * 1988-08-23 1991-03-12 Westinghouse Electric Corp. Ultraviolet curable conductive resin
US5255430A (en) * 1992-10-08 1993-10-26 Atmel Corporation Method of assembling a module for a smart card
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US5689136A (en) * 1993-08-04 1997-11-18 Hitachi, Ltd. Semiconductor device and fabrication method
DE9315652U1 (en) * 1993-10-15 1993-12-23 Nordson Corp., Westlake, Ohio Application head for applying adhesive to a substrate, in particular for gluing a chip to a card
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