RU2820193C2 - Electronic device - Google Patents

Abstract

FIELD: electrical communication equipment.

SUBSTANCE: invention relates to the field of user electronic communication devices, namely to folding devices with a flexible display. To this end, the electronic device includes a display comprising a first region and a second region, a first housing forming a first space located on a rear surface of the first region, second housing, forming a second space located on the rear surface of the second area, a hinge assembly to ensure that the first region and the second region are in a first state, forming substantially the same plane, or are in a second state when facing each other, and a plurality of front heat-conducting elements forming a heat transfer path between the hinge assembly and the display.

EFFECT: high efficiency of heat dissipation throughout the electronic device.

14 cl, 19 dwg

Description

1. Field of technology

[0001] The disclosure relates to an electronic device.

2. Description of the prior art

[0002] In recent years, electronic devices have been transformed from uniform rectangular shapes to shapes incorporating various designs and functions to satisfy the purchasing desires of consumers. For example, foldable electronic devices that can deform in size depending on states of use are being explored. Due to the better performance of electronic devices, improving the heat dissipation function to reduce the internal temperature has become an important issue.

[0003] The above information is provided as background information only to assist in understanding the disclosure. No determinations have been made or any statements made as to whether any of the foregoing may be applicable as prior art with respect to the disclosure.

SUMMARY OF THE INVENTION

[0004] Electronic devices radiate heat outward through displays. However, foldable electronic devices have reduced display surfaces when folded, and thus their internal temperature may increase compared to the unfolded state. The foldable electronic device may be provided with rigid members that are separated about a folding axis and can be folded in response to a folding operation. This separated structure can reduce the rate of mutual heat transfer.

[0005] An aspect of the disclosure is to provide a foldable electronic device.

[0006] Another aspect of the disclosure is to provide high heat dissipation efficiency, which can be achieved by dissipating heat throughout an electronic device.

[0007] Another aspect of the disclosure is to provide a heat dissipation effect through heat transfer.

[0008] In accordance with an aspect of the disclosure, an electronic device is provided. The electronic device includes a display including a first region and a second region, a first housing defining a first space located on a rear surface of the first region, a second housing defining a second space located on a rear surface of the second region, a hinge assembly for ensuring that the first the region and the second region were in a first state, forming substantially the same plane, or in a second state, facing each other, and a plurality of front heat-conducting elements forming a heat transfer path between the hinge assembly and the display, wherein the hinge assembly may include a set of hinge plates including a first hinge plate coupled to the first housing and a second hinge plate coupled to the second housing, a hinge connecting the first hinge plate and the second hinge plate so as to rotation about the folding axis, a hinge body to which the hinge is attached, the hinge body connecting the hinge plate set, and a flexible printed circuit board (FPCB) with at least a portion located between the hinge plate set and the hinge body, and both ends extending to the first space and to the second space, and wherein the front thermal conductive elements may be located on the surface of the set of hinge plates facing the display.

[0009] In accordance with another aspect of the disclosure, an electronic device is provided. The electronic device includes a display including a first area and a second area that are foldable through a folding axis, a first support plate located in a rearward direction from the first area, a second support plate located in a rearward direction from the second area, a hinge body to which a hinge is attached for rotating the first support plate and the second support plate about the folding axis, the hinge body being disposed along the folding axis connecting the first support plate and the second support plate, a set of hinge plates including a first hinge plate connecting the hinge body and the first support plate, and a second hinge plate connecting the hinge body and the second support plate, a first printed circuit board (PCB) located in a direction opposite the first region relative to the first support plate, a second printed circuit board located in a direction opposite the second region relative to the second support plate, a flexible printed circuit board (PCB) a circuit board (FPCB) disposed intersecting the first region and the second region between the hinge plate set and the hinge body and connecting the first printed circuit board and the second circuit board, and the first front thermal conductive element and the second front thermal conductive element disposed between the hinge plate set and the display therewith correspondingly formed heat transfer paths between the first region and the second region of the display and the set of hinge plates.

[0010] According to various exemplary embodiments, it is possible to improve the heat dissipation efficiency of an electronic device by distributing heat throughout the electronic device through a flexible printed circuit board (FPCB) connecting foldable regions of the electronic device and thermal conductive elements located between the flexible printed circuit board and the display.

BRIEF DESCRIPTION OF THE DRAWINGS

[0011] FIG. 1 is a block diagram of an electronic device in a network environment in accordance with an embodiment of the disclosure;

[0012] FIG. 2A and 2B are views illustrating a state of use of an electronic device according to embodiments of the disclosure;

[0013] FIG. 3A and 3B are exploded perspective views of an electronic device in accordance with various embodiments of the disclosure;

[0014] FIG. 4A is a view illustrating an arrangement position of front thermal conductive elements in an electronic device according to an embodiment of the disclosure;

[0015] FIG. 4B is a view illustrating an arrangement position of rear thermal conductive elements in an electronic device according to an embodiment of the disclosure;

[0016] FIG. 5A is a view illustrating the arrangement relationship of the front thermal conductive elements and the rear thermal conductive elements with respect to the hinge plate in an electronic device according to an embodiment of the disclosure;

[0017] FIG. 5B is a cross-sectional view of the electronic device along line Vb-Vb of FIG. 5A in accordance with an embodiment of the disclosure;

[0018] FIG. 6A is an exploded cross-sectional view of an electronic device in accordance with an embodiment of the disclosure;

[0019] FIG. 6B is a sectional view of a folded electronic device in accordance with an embodiment of the disclosure;

[0020] FIG. 7A is a partial exploded perspective view illustrating a thermal conductive sheet disposed between a display and a back plate in an electronic device according to an embodiment of the disclosure;

[0021] FIG. 7B is a view illustrating the relative states of the arrangement of the thermal conductive sheet and the front thermal conductive elements in the electronic device according to an embodiment of the disclosure;

[0022] FIG. 7C is a partial cross-sectional view of the electronic device along line VIIc-VIIc of FIG. 7B in accordance with an embodiment of the disclosure;

[0023] FIG. 8A is a view illustrating a set of hinge plates disposed in a hinge assembly in accordance with an embodiment of the disclosure;

[0024] FIG. 8B is a partial perspective view illustrating a set of hinge plates disposed in a hinge assembly, in accordance with an embodiment of the disclosure;

[0025] FIG. 8C is a partial cross-sectional view of the electronic device along line VIIIc-VIIIc of FIG. 8A in accordance with an embodiment of the disclosure;

[0026] FIG. 9A is a perspective view of a flexible printed circuit board (FPCB) in accordance with an embodiment of the disclosure; And

[0027] FIG. 9B is a partial cross-sectional view of an electronic device in accordance with an embodiment of the disclosure.

DETAILED DESCRIPTION

[0028] Exemplary embodiments will now be described in detail with reference to the accompanying drawings. When describing exemplary embodiments with reference to the accompanying drawings, like reference numerals refer to like elements, and repeated description relating thereto will be omitted.

[0029] FIG. 1 is a block diagram of an electronic device in a network environment in accordance with an embodiment of the disclosure.

[0030] Referring to FIG. 1, an electronic device 101 in a network environment 100 may communicate with an external electronic device 102 through a first network 198 (e.g., a short-range wireless communication network) or communicate with at least one of an external electronic device 104 or a server 108 through a second network 199 ( e.g. long range wireless network). According to an exemplary embodiment, the electronic device 101 may communicate with an external electronic device 104 through a server 108. According to an exemplary embodiment, the electronic device 101 may include a processor 120, a memory 130, an input module 150, an audio output module 155, display module 160, audio module 170, sensor module 176, interface 177, connection pin 178, haptic module 179, camera module 180, power management module 188, battery 189, communication module 190, subscriber identification (SIM) module 196 or module 197 antennas. In some exemplary embodiments, at least one (eg, connection terminal 178) of the above components may be omitted from the electronic device 101, or one or more other components may be added to the electronic device 101. In some exemplary embodiments, some (eg, sensor module 176, camera module 180, or antenna module 197) of the components may be combined as a single component (eg, display module 160).

[0031] Processor 120 may execute, for example, software (e.g., program 140) to control at least one other component (e.g., hardware or software component) of electronic device 101 coupled to processor 120 and may perform various data processing or calculations. According to an exemplary embodiment, as at least part of the data processing or computation, processor 120 may store a command or data received from another component (e.g., sensor module 176 or communications module 190) in volatile memory 132, process the command or data stored in volatile memory 132, and store the resulting data in non-volatile memory 134. According to an exemplary embodiment, processor 120 may include a main processor 121 (e.g., a central processing unit (CPU) or an application processor (AP)) or an auxiliary a processor 123 (e.g., a graphics processing unit (GPU), a neural processing unit (NPU), an image signal processor (ISP), a sensor hub processor, or a communications processor (CP)) that operates independently of or in conjunction with the main processor 121. For example, when the electronic device 101 includes a main processor 121 and an auxiliary processor 123, the auxiliary processor 123 may be configured to consume less power than the main processor 121 or to perform a specific function. The auxiliary processor 123 may be implemented separately from the main processor 121 or as part of the main processor 121.

[0032] The secondary processor 123 may control at least some of the functions or states related to at least one (e.g., display module 160, sensor module 176, or communication module 190) of the components of the electronic device 101, in place of the main processor 121 when the main processor 121 is in an inactive (eg, standby) state, or together with the main processor 121 when the main processor 121 is in an active state (eg, running an application). According to an exemplary embodiment, an auxiliary processor 123 (e.g., an ISP or CP) may be implemented as part of another component (e.g., camera module 180 or communications module 190) that is operatively coupled to the support processor 123. In an exemplary embodiment, the support processor 123 (e.g., an NPU) may include a hardware structure configured to process an artificial intelligence (AI) model . An AI model can be created through machine learning. Such training may be performed, for example, by an electronic device 101 running the artificial intelligence model, or performed through a separate server (eg, server 108). Learning algorithms may include, but are not limited to, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning. An artificial intelligence model may include many layers of artificial neural network. The artificial neural network may include, for example, a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), and a bidirectional recurrent deep neural network. network (BRDNN), deep Q-network or a combination of two or more of them, but is not limited to it. The artificial intelligence model may additionally or alternatively include a software structure different from the hardware structure.

[0033] Storage device 130 may store various data used by at least one component (e.g., processor 120 or sensor module 176) of electronic device 101. The various data may include, for example, software (e.g., program 140) and input data or output for a command related to it. Storage device 130 may include volatile storage device 132 or non-volatile storage device 134. Non-volatile storage device 134 may include internal storage device 136 and external storage device 138.

[0034] Program 140 may be stored as software in storage device 130 and may include, for example, an operating system (OS) 142, middleware 144, or an application 146.

[0035] The input module 150 may receive command or data to be used by another component (e.g., processor 120) of the electronic device 101 from outside (e.g., from a user) of the electronic device 101. The input module 150 may include, for example, a microphone, a mouse , keyboard, key (such as a button), or digital pen (such as a stylus).

[0036] The audio output module 155 may output an audio signal to the outside of the electronic device 101. The audio output module 155 may include, for example, a speaker or a receiver. The loudspeaker can be used for general purposes such as playing media or playing a recording. The receiver can be used to receive an incoming call. According to an exemplary embodiment, the receiver may be implemented separately from the loudspeaker or as part of the loudspeaker.

[0037] The display module 160 may visually provide information to the outside (e.g., to the user) of the electronic device 101. The display module 160 may include, for example, control circuitry for controlling a display, a holographic device, or a projector, and a control circuitry controlling a corresponding one of the display, holographic device and projector. According to an exemplary embodiment, the display module 160 may include a touch sensor adapted to sense a touch or a pressure sensor adapted to measure the intensity of a force generated by a touch.

[0038] Audio module 170 may convert sound to an electrical signal or vice versa. According to an exemplary embodiment, audio module 170 may receive audio through input module 150 or output audio through audio output module 155 or an electronic device (e.g., external electronic device 102 such as a speaker or headphones) connected directly or wirelessly to the electronic device. 101.

[0039] Sensor module 176 may detect an operating state (eg, power or temperature) of the electronic device 101 or an environmental condition (eg, user state) external to the electronic device 101, and generate an electrical signal or data value corresponding to the detected state. According to an exemplary embodiment, sensor module 176 may include, for example, a gesture sensor, a gyro sensor, an atmospheric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an infrared (IR) sensor, biometric sensor, temperature sensor, humidity sensor or light sensor.

[0040] Interface 177 may support one or more specialized protocols used in electronic device 101 for connecting to an external electronic device (eg, external electronic device 102) directly (eg, in a wired manner) or wirelessly. According to an exemplary embodiment, interface 177 may include, for example, a high-definition multimedia interface (HDMI), a universal serial bus (USB) interface, a secure digital (SD) card interface, or an audio interface.

[0041] Connection terminal 178 may include a connector through which electronic device 101 may be physically connected to external electronic device 102. According to an exemplary embodiment, connection terminal 178 may include, for example, an HDMI connector, a connector USB, SD card slot, or audio jack (such as headphone jack).

[0042] Tactile module 179 may convert the electrical signal into a mechanical effect (eg, vibration or movement) or electrical effect that can be recognized by the user through his or her tactile sensation or kinesthetic sensation. According to an exemplary embodiment, haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulator.

[0043] The camera module 180 can capture still images and moving images. According to an exemplary embodiment, camera module 180 may include one or more lenses, image sensors, image signal processors, or flashes.

[0044] Power management module 188 may control power supplied to electronic device 101. According to an exemplary embodiment, power management module 188 may be implemented as, for example, at least part of a power management integrated circuit (PMIC).

[0045] Battery 189 may provide power to at least one component of electronic device 101. According to an exemplary embodiment, battery 189 may include, for example, a primary cell that is not rechargeable, a secondary cell (battery) that is rechargeable , or fuel cell.

[0046] The communication module 190 may support establishing a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device 101 and an external electronic device (e.g., external electronic device 102, external electronic device 104, or server 108) and communicating according to the established communication channel. Communications module 190 may include one or more communications processors that operate independently of processor 120 (eg, AP) and that support direct (eg, wired) communications or wireless communications. According to an exemplary embodiment, the communications module 190 may include a wireless communications module 192 (e.g., a cellular communications module, a short-range wireless communications module, or a global navigation satellite system (GNSS) communications module) or a wired communications module 194 (e.g., a local area communications module). network (LAN) or power line communication (PLC) module). A respective one of these communication modules may communicate with the external electronic device 104 via a first network 198 (e.g., a short-range communication network such as BluetoothTM, Wi-Fi Direct (Wi-Fi) or infrared (IrDA)) or a second network 199 ( for example, a long-range communications network such as a legacy cellular network, a 5G network, a next-generation communications network, the Internet, or a computer network (e.g., a LAN or wide area network (WAN)). These different types of communication modules may be implemented as a single component (eg, a single chip) or may be implemented as multiple components (eg, multiple chips) separate from each other. Wireless communication module 192 may identify and authenticate electronic device 101 on a communications network, such as first network 198 or second network 199, using subscriber information (e.g., International Mobile Subscriber Identity (IMSI)) stored in SIM card 196.

[0047] The wireless communication module 192 may support a 5G network after a 4G network and next generation communication technology, such as new radio access (NR) technology. NR access technology can support enhanced mobile broadband (eMBB), mass machine type communications (mMTC), or ultra-reliable low-latency communications (URLLC). The wireless communication module 192 may support a high frequency band (eg, millimeter wave band) to achieve, for example, high data rates. Wireless communication module 192 may support various technologies to provide high frequency performance, such as, for example, beamforming, massive multiple inputs and multiple outputs (massive MIMO), full-field MIMO (FD-MIMO), antenna arrays, analog beamforming or large scale antenna. The wireless communication module 192 may support various requirements established in the electronic device 101, an external electronic device (eg, external electronic device 104), or a network system (eg, a second network 199). According to an exemplary embodiment, wireless module 192 may support peak data rate (e.g., 20 Gbps or more) for eMBB implementation, loss coverage (e.g., 164 dB or less) for mMTC implementation, or U-plane latency (e.g., 0 .5 ms or less for each of the downlink (DL) and uplink (UL), or 1 ms or less for full bypass) to implement URLLC.

[0048] Antenna module 197 may transmit or receive a signal or power to or from (e.g., an external electronic device) electronic device 101. According to an exemplary embodiment, antenna module 197 may include an antenna comprising a radiating element including a conductive a material or conductive pattern formed in or on a substrate (such as a printed circuit board (PCB)). According to an exemplary embodiment, antenna module 197 may include a plurality of antennas (eg, antenna arrays). In such a case, at least one antenna suitable for a communication circuit used in a communication network, such as the first network 198 or the second network 199, can be selected, for example, by the communication module 190 from a plurality of antennas. A signal or power may be transmitted or received between the communication module 190 and an external electronic device through the at least one selected antenna. According to an exemplary embodiment, another component (eg, a radio frequency integrated circuit (RFIC)) other than the radiating element may be further formed as part of the antenna module 197.

[0049] According to various example embodiments, the antenna module 197 may form a millimeter wave antenna module. According to an exemplary embodiment, a millimeter wave antenna module may include a circuit board, an RFIC, located on or adjacent to a first surface (e.g., a bottom surface) of the circuit board and capable of supporting a designated high frequency band (e.g., millimeter wave band), and a plurality of antennas (eg, antenna arrays) located on or adjacent to a second surface (eg, a top or side surface) of the circuit board and capable of transmitting or receiving signals in a designated high frequency band.

[0050] At least some of the above-described components may be interconnected with each other and transmit signals (e.g., commands or data) among themselves through inter-peripheral communication circuitry (e.g., a general purpose input and output (GPIO) bus, a serial peripheral interface ( SPI) or Mobile Industry Processor Interface (MIPI)).

[0051] According to an exemplary embodiment, commands or data may be transmitted or received between electronic device 101 and external electronic device 104 via server 108 coupled to second network 199. Each of external electronic devices 102 or 104 may be the same type of device or type other than the electronic device 101. According to an exemplary embodiment, all or some of the operations to be performed by the electronic device 101 may be performed on one or more external electronic devices 102 and 104 and the server 108. For example, if the electronic device 101 is to perform a function or service automatically or in response to a request from a user or other device, the electronic device 101, instead of or in addition to performing a function or service, may request one or more external electronic devices to perform at least a portion of the function or service. The one or more external electronic devices receiving the request may perform said at least part of the requested function or service or an additional function or additional service associated with the request, and may transmit the result of the execution to the electronic device 101. The electronic device 101 may output a result with or without additional processing of the result, in the form of at least part of the response to the request. For this purpose, for example, cloud computing, distributed computing, mobile edge computing (MEC) or client-server computing technology. Electronic device 101 may provide ultra-low latency services using, for example, distributed computing or mobile edge computing. In another exemplary embodiment, external electronic device 104 may include an Internet of Things (IoT) device. Server 108 may be an intelligent server using machine learning and/or a neural network. According to an exemplary embodiment, the external electronic device 104 or server 108 may be included in the second network 199. The electronic device 101 may be used for smart services (e.g., smart home, smart city, smart car, or healthcare) based technology 5G communications or IoT related technology.

[0052] The electronic device according to various exemplary embodiments may be one of various types of electronic devices. An electronic device may include, for example, a portable communications device (eg, a smartphone), a computing device, a portable media device, a portable medical device, a camera, a wearable device, or a consumer appliance device. According to an exemplary embodiment of the disclosure, the electronic device is not limited to those described above.

[0053] It should be understood that the various exemplary embodiments of the disclosure and the terms used herein are not intended to limit the technological features set forth herein to specific embodiments and include various variations, equivalents, or substitutions for the corresponding embodiment. With respect to the description of the drawings, the same reference numerals may be used for like or similar components. It should be understood that the singular form of a noun corresponding to a subject may include one or more of the subjects unless the relevant context clearly indicates otherwise. As used herein, the phrases "A or B", "at least one of A and B", "at least one of A or B", "A, B or C", "at least one of A, B and C" and "A, B or C", each of which may include any of the elements listed together in the corresponding one of the phrases, or all possible combinations thereof. Terms such as "first", "second" or "first" or "second" may be used simply to distinguish a component from other components under consideration, and may refer to components in other respects (such as importance or order) without limitation . It should be understood that if an element (e.g., the first element) is referred to with or without the term "functionally" or "communicatively" as being "connected to," "attached to," "coupled with," or "connected to" another element ( for example, a second element), this means that the element can be connected to another element directly (for example, in a wired manner), wirelessly, or through a third element.

[0054] As used in connection with various exemplary embodiments of the disclosure, the term “module” may include a block implemented in hardware, software, or firmware, and may be used interchangeably with other terms, such as “logic”, “logical block" "part" or "circuit". A module may be a single composite component or a minimal unit or part thereof designed to perform one or more functions. For example, according to an exemplary embodiment, the module may be implemented as an application specific integrated circuit (ASIC).

[0055] Various exemplary embodiments set forth herein may be implemented as software (e.g., program 140) including one or more instructions that are stored on a storage medium (e.g., internal storage device 136 or external storage device 138 ), which can be read by a machine (eg, electronic device 101). For example, a processor (eg, processor 120) of a machine (eg, electronic device 101) may call and execute at least one of the one or more instructions stored on a storage medium. This allows the machine to be controlled to perform at least one function in accordance with the at least one invoked instruction. The one or more instructions may include code generated by a compiler or code executed by an interpreter. The computer-readable storage medium may be provided in the form of a non-transitory storage medium. Here the term "non-transitory" simply means that the storage medium is a tangible device and does not include a signal (such as an electromagnetic wave), but the term does not distinguish between when data is stored semi-permanently on the storage medium and when data is stored on the storage medium temporarily.

[0056] According to an exemplary embodiment, the method according to various exemplary embodiments of the disclosure may be included and provided in a computer program product. A computer software product may be sold as a product between a seller and a buyer. The computer program product may be distributed in the form of a machine-readable storage medium (e.g., a compact disc read-only (CD-ROM)) or distributed (e.g., downloaded or uploaded) online through an application store (e.g., PlayStoreTM) or directly between two user devices (for example, smartphones). In online distribution, at least a portion of the computer program product may be temporarily generated or at least temporarily stored on a computer-readable storage medium, such as a manufacturer's server storage device, an application store server, or a relay server.

[0057] According to various exemplary embodiments, each component (eg, module or program) of the components described above may include a single object or multiple objects, and some of the multiple objects may be located separately in different components. According to various exemplary embodiments, one or more of the above-described components may be omitted or one or more other components may be added. Alternatively or additionally, multiple components (eg, modules or programs) may be integrated into a single component. In such a case, according to various exemplary embodiments, the integrated component may still perform one or more functions of each of the plurality of components in the same or similar manner as they were performed by each of the plurality of components prior to integration. According to various exemplary embodiments, operations performed by a module, program, or other component may be performed sequentially, in parallel, repeatedly, or heuristically, or one or more operations may be performed in a different order or eliminated, or one or more other operations may be added.

[0058] FIG. 2A and 2B are views illustrating a state of use of an electronic device according to embodiments of the disclosure, and FIG. 3A and 3B are exploded perspective views of an electronic device in accordance with various embodiments of the disclosure.

[0059] Referring to FIG. 2A, 2B, 3A and 3B, the electronic device 20 (eg, the electronic device 101 of FIG. 1) may be deformed in shape depending on the state of use. For example, a foldable type electronic device 20 may be provided that can be selectively folded or unfolded by the user.

[0060] In an exemplary embodiment, the electronic device 20 may include a display 210, a back plate set 350, a first housing 220, a second housing 230, a hinge assembly 240, a printed circuit board 360, front thermal conductive elements 370, and rear thermal conductive elements 380. Meanwhile , in the disclosure, the externally exposed surface of the display 210 may be defined as the front surface of the electronic device 20 and display 210, and the surface opposite the front surface may be defined as the rear surface of the electronic device 20 and display 210. In addition, the surface spanning the space between the front surface and a rear surface of the electronic device 20 may be defined as a side surface of the electronic device 20.

[0061] The display 210 may display visual information (eg, text, video, and/or image) to the user. In an exemplary embodiment, at least one partial region of the display 210 may be deformed into a flat surface or a curved surface such that the display 210 may deform in response to a change in the shape of the electronic device 20. The display 210 may include an axial region 213 in which there is a folding axis A, a first region 211 located on one side of the axial region 213 (for example, the left region of the axial region 213 in FIG. 2A), and a second region 212 located on the other side of the axial region 213 (for example, the right region from the axial region 213 of Fig. 2A). In this case, the overall shape of the display 210 may deform in response to the opening and/or closing operation of the electronic device 20 because the angle formed between the first region 211 and the second region 212 is adjusted by deforming the shape of the axial region 213. For example, the display 210 may be deformed in shape to be in a first state (e.g., the expanded state of FIG. 2A) in which the first region 211 and the second region 212 form substantially the same plane, a second state (e.g., the folded state of FIG. 2B ), in which the first region 211 and the second region 212 face each other, or an intermediate state in which the first region 211 and the second region 212 form a predetermined angle between the first state and the second state.

[0062] In an exemplary embodiment, the first region 211 and the second region 212 of the display 210 may be generally symmetrical with respect to the axial region 213. However, the first region 211 or the second region 212 may include a cutout region that is partially cut away to expose another component ( such as a camera, sensor, etc.) through the front surface of the electronic device 20. In this case, a portion of the first region 211 or the second region 212 may be asymmetrical.

[0063] Meanwhile, the above-described division of the display 210 into areas can be presented as an example, and the display 210 can be divided into a plurality of areas in accordance with the functions and structures required for the electronic device 20. For example, the areas of the display 210 are shown into parts (A) FIG. 2 as divided based on the folding axis A or a central region parallel to the y axis. However, in another exemplary embodiment, areas of the display 210 may be divided based on a different folding axis A (eg, an area parallel to the x-axis).

[0064] In an exemplary embodiment, the display device 210 may include a display panel, a touch panel, a polarizing film, and a window layer. The display panel, touch panel, polarizing film and window layer can be attached using pressure sensitive adhesive (PSA). In an exemplary embodiment, a shock-absorbing layer may be attached to the rear surface of the display panel to absorb shock applied to the display 210.

[0065] In an exemplary embodiment, the display panel may include a display substrate, a plurality of display elements connected on the display substrate, one or more conductive lines coupled to the display substrate and electrically connected to the plurality of display elements, and a thin film cladding layer.

[0066] The display substrate may be formed from a flexible material, for example, plastic such as polyimide (PI), but the display substrate material is not limited to this and may include various materials having flexible properties. A plurality of display elements may be arranged on a display substrate and form some of the pixels. For example, a plurality of display elements may be arranged in a matrix form on a display substrate to form display panel pixels. In this case, the plurality of display elements may include a fluorescent material or an organic fluorescent material capable of displaying colors. For example, display elements 210 may include organic light-emitting diodes (OLEDs). The conductive lines may include one or more gate signal lines or one or more data signal lines. For example, the conductive lines may include a plurality of gate signal lines and a plurality of data signal lines, and the plurality of gate signal lines and a plurality of data signal lines may be arranged in a matrix form. In this case, a plurality of display elements may be located adjacent to the point where the plurality of lines intersect, and may be electrically connected to each line. The thin film shell layer can cover the display substrate, a plurality of display elements and conductive lines, thereby preventing the influx of oxygen and moisture from outside. In an exemplary embodiment, the thin film shell layer may be formed by alternately laying down one or more layers of organic film and one or more layers of inorganic film.

[0067] In an exemplary embodiment, the touch panel may be formed as a single body on or attached to the display panel. For example, a touch panel can be formed by applying an aluminum metal mesh sensor pattern to a thin film shell layer of the display panel.

[0068] In an exemplary embodiment, a polarizing film may be placed between the display panel and the touch panel. The polarizing film may improve the visibility of the display 210. The polarizing film may change the phase of light passing through the display 210. For example, the polarizing film may convert linearly polarized light to circularly polarized light or convert circularly polarized light to linearly polarized light, thereby preventing reflection of incident light to the display panel.

[0069] The window layer may be formed from a transparent plastic film having high flexibility and high hardness. For example, the window layer may be formed from polyimide (PI) or polyethylene terephthalate (PET) film. In an exemplary embodiment, the window layer may be formed in multiple layers including a plurality of plastic films.

[0070] The backplate set 350 may support a rear surface of the display 210. In an exemplary embodiment, the backplate set 350 may be formed from a thin sheet in a shape corresponding to the shape of the display 210. In an exemplary embodiment, the backplate set 350 may include a first backplate a plate 351 supporting the rear surface of the first region 211 of the display 210, and a second back plate 352 supporting the rear surface of the second region 212 of the display 210. In an exemplary embodiment, the first back plate 351 and the second back plate 352 may be separated by a distance. For example, the first back plate 351 and the second back plate 352 may be separately attached to the rear surface of the first region 211 and the rear surface of the second region 212 of the display 210 so that they do not contact each other along the folding axis A. According to this structure, even when the back plate set 350 is attached to the display 210, the back plate set 350 can be prevented from interfering with the folding operation of the display 210 about the folding axis A.

[0071] In an exemplary embodiment, the first back plate 351 and the second back plate 352 may be formed from a conductive material, such as copper or an alloy material including copper. In this case, the first back plate 351 and the second back plate 352 can improve the impact resistance of the display 210 and at the same time serve as heat transfer paths by transferring heat to the first region 211 and the second region 212 of the display 210.

[0072] The first housing 220 and the second housing 230 may form the appearance of the electronic device 20. In an exemplary embodiment, the first housing 220 and the second housing 230 may be coupled to a hinge assembly 240 to form a rear surface of the electronic device 20. Each of the first housing 220 and the second housing 230 may include a front surface, a rear surface, and a side surface partially defining a space between the front surface and the rear surface. In this case, most of the regions of the front surfaces of the first housing 220 and the second housing 230 can be configured to be openable such that the display 210 can be opened therethrough. Meanwhile, the structure of the first body 220 and the second body 230 is not limited to the shape and connection shown in FIG. 3A, and may be implemented in other forms or by combining and/or connecting other components. For example, although in FIG. 3A shows that the side surface and the rear surface of each housing are formed as a single unit, each housing can be provided by connecting separate members respectively covering the side surface and the rear surface of the electronic device 20.

[0073] In an exemplary embodiment, the first housing 220 and the second housing 230 may secure and support components within the electronic device 20. For example, the first housing 220 and the second housing 230 may define a space in which a display 210, a hinge assembly 240, a circuit board 360 are mounted. etc., and fix and maintain installed components. In an exemplary embodiment, the first housing 220 may define a first space 221 located on the rear surface of a first region 211 of the display 210, and the second housing 230 may define a second space 231 located on the rear surface of a second region 212 of the display 210. The first space 221 and the second space 231 may form a single space in which the entire display 210 is located by connecting the first housing 220 and the second housing 230.

[0074] The hinge assembly 240 may implement a folding operation of the electronic device 20. In an exemplary embodiment, the hinge assembly 240 may fold the first area 211 and the second area 212 of the display 210 about the folding axis A, thereby ensuring that the first area 211 and the second area 212 were in the first state placed in the same plane, or were in the second state facing each other. Hinge assembly 240 may include a backing plate 343 (e.g., a first backing plate 3431 and a second backing plate 3432), a hinge 341, a hinge body 342, a hinge plate set 344, a first circuit board 361, a second circuit board 362, and a flex circuit board ( FPCB) 345.

[0075] In an exemplary embodiment, the first support plate 3431 and the second support plate 3432 may be located in a rearward direction from the first area 211 and a rearward direction from the second area 212 of the display 210, respectively. For example, the first support plate 3431 and the second support plate 3432 may be coupled to the first housing 220 and the second housing 230, respectively, to be positioned on the rear surface of the display 210. In this case, the first support plate 3431 may be coupled to the first housing 220 for insertion into a first space 221 defined by the first housing 220, and a second support plate 3432 may be coupled to the second housing 230 for insertion into a second space 231 defined by the second housing 230. The first support plate 3431 and the second support plate 3432 may include through holes 3431a and 3432a formed in portions connected to the hinge body 342, such that the flexible circuit board 345, which will be described below, can pass through them.

[0076] The hinge 341 can rotate the first support plate 3431 and the second support plate 3432 about the folding axis A. In an exemplary embodiment, one or more hinges (eg, hinge 341) may be provided. For example, two hinges may be provided, as shown in FIG. 3A. In this case, one or more hinges may be located between the first support plate 3431 and the second support plate 3432. In an exemplary embodiment, one or more hinges may be located at positions that overlap the folding axis A as viewed from the front surface of the display 210. B state in which the first support plate 3431 and the second support plate 3432 are connected to the first body 220 and the second body 230, respectively, the hinge 341 can rotate the first body 220 and the second body 230 about the folding axis A using the first support plate 3431 and the second support plate 3432 .

[0077] The hinge body 342 may rotatably couple the first support plate 3431 and the second support plate 3432 and secure one or more hinges (eg, hinge 341). The hinge body 342 may include a front surface, a rear surface, and a side surface partially defining a space between the front surface and the rear surface. In this case, the hinge body 342 may include a receiving space formed by having a portion of its front surface recessed toward the rear surface. In an exemplary embodiment, the side surface and rear surface of the hinge body 342 may include a curved shape. In this case, the shape of the curved surface of the hinge body 342 may appear straight when viewed in the longitudinal direction (e.g., along the y-axis of FIG. 3A) of the hinge body 342, but may appear substantially semicircular when viewed in a cross section thereof perpendicular to width direction (eg, x-axis in FIG. 3A).

[0078] In an exemplary embodiment, the hinge body 342 may be located between the first body 220 and the second body 230 along the folding axis A. The hinge body 342 may be rotatably coupled to a first support plate 3431 and a second support plate 3432. For example, relative to the folding axis A, the first support plate 3431 may be rotatably coupled to one side of the hinge body 342 (e.g., the left side of the hinge body 342 of FIG. 3B), and the second support plate 3432 may be rotatably coupled to the other side of the hinge body 342 (eg, the right side of the hinge body 342 of FIG. 3B). In an exemplary embodiment, the hinge housing 342 may cover the outer surface of the electronic device 20, thereby preventing components of the hinge assembly 240, including the hinge 341, from being exposed to the outside. For example, the hinge housing 342 may cover the space between the first housing 220 and the second housing 230. In an exemplary embodiment, the hinge housing 342 may cover the space between the first housing 220 and the second housing 230. , according to the operating state of the electronic device 20, the hinge body 342 may be closed by the first body 220 and the second body 230 (for example, unfolded as in part (A) of FIG. 2), or may be open outward (for example, folded as in part (B) of Fig. 2), closing the space between the first housing 220 and the second housing 230.

[0079] The hinge plate set 344 may include a first hinge plate 3441 coupled to the first body 220 and a second hinge plate 3442 coupled to the second body 230. For example, the first hinge plate 3441 may couple the first support plate 3431 coupled to the first body 220 to the hinge body 342, and a second hinge plate 3442 may couple a second support plate 3432 coupled to the second body 230 to the hinge body 342. In an exemplary embodiment, a set of hinge plates 344 may be located on the front surface of the hinge housing 342. In this case, the first hinge plate 3441 and the second hinge plate 3442 may be located at positions symmetrical with respect to the folding axis A, that is, at positions facing each other when the electronic device 20 is folded. For example, the first hinge plate 3441 and the second hinge plate 3442 may be coupled to the hinge body 342 in a manner that separates regions such that the first hinge plate 3441 may be positioned rearward of the first region 211 of the display 210 and the second hinge plate 3442 may be located in a rearward direction from the second area 212 of the display 210.

[0080] In an exemplary embodiment, the hinge plate set 344 may cover the connection portion between the first support plate 3431 and the hinge body 342 and the connection portion between the second support plate 3432 and the hinge body 342, while at the same time performing the function of protecting the flexible printed circuit board 345. located in the housing 342 hinges.

[0081] In an exemplary embodiment, the first circuit board 361 and the second circuit board 362 may be located in a first space 221 defined by the first housing 220 and a second space 231 defined by the second housing 230, respectively. In this case, the first circuit board 361 may be located in a direction opposite the first region 211 of the display 210 relative to the first support plate 3431, and the second circuit board 362 may be located in the opposite direction of the second region 212 of the display 210 relative to the second support plate 3432. elements may be installed on the board 360 to implement the function of the electronic device 20.

[0082] In an exemplary embodiment, flexible circuit board 345 may connect components located in first space 221 and second space 231. For example, flexible circuit board 345 may be positioned intersecting first space 221 and second space 231 to connect first circuit board 361 and a second circuit board 362. In an exemplary embodiment, at least a portion of the flexible circuit board 345 may be located between the hinge plate array 344 and the hinge body 342. For example, flexible circuit board 345 may include a curved region located in the receiving space of hinge housing 342. In this case, a portion of the flexible circuit board 345 extending to one end of the curved region may extend between the first hinge plate 3441 and the hinge body 342 and extend into the first space 221, and a portion extending to the other end of the curved region may extend between the second plate 3442. hinge body 342 and extend to the second space 231. In an exemplary embodiment, both ends of the flexible circuit board 345 extending to the first space 221 and the second space 231 may be connected to the first circuit board 361 and the second circuit board 362 through through holes 3431a and 3432a formed in the first support plate 3431 and the second support plate 3432, respectively.

[0083] In an exemplary embodiment, one or more flexible printed circuit boards (eg, flexible printed circuit board 345) may be provided. For example, electronic device 20 may include two flexible printed circuit boards, as shown in FIG. 3A and 3B. When the flexible circuit board 345 is provided in a plurality, the plurality of flexible circuit boards may be spaced apart from each other and each may connect the first circuit board 361 and the second circuit board 362.

[0084] The front thermal conductive elements 370 and the rear thermal conductive elements 380 may form heat transfer paths within the electronic device 20 to dissipate heat generated in the electronic device 20 through the entire electronic device 20. For example, the front thermal conductive elements 370 and the rear thermal conductive elements 380 may form the paths heat transfer within the electronic device 20 such that heat generated by the internal components of the electronic device 20 can be dissipated through the display 210. In an exemplary embodiment, the front thermal conductive elements 370 and the rear thermal conductive elements 380 may include a material having high thermal conductivity for efficient heat transfer .

[0085] In an exemplary embodiment, the front thermal conductive elements 370 may define a heat transfer path in a direction (e.g., the +z-axis direction) toward the display 210 relative to the first and second hinge plates 3441 and 3442, and the rear thermal conductive elements 380 may define a heat transfer path in the ( for example, a -z-axis direction) opposite the display 210 relative to the first and second hinge plates 3441 and 3442.

[0086] FIG. 4A is a view illustrating an arrangement of front thermal conductive elements in an electronic device according to an embodiment of the disclosure, and FIG. 4B is a view illustrating an arrangement of rear thermal conductive elements in an electronic device according to an embodiment of the disclosure.

[0087] Referring to FIG. 4A and 4B, the front thermal conductive elements 370 and the rear thermal conductive elements 380 according to an exemplary embodiment can dissipate heat generated by components located in the electronic device 20 through the display 210 by heat transfer. In an exemplary embodiment, the front thermal conductive elements 370 and the rear thermal conductive elements 380 may define heat transfer paths extending from the flex circuit board 345 to the display 210.

[0088] In an exemplary embodiment, the front thermal conductive elements 370 may define a heat transfer path between the hinge plate set 344 and the display 210. The front thermal conductive elements 370 may be located on the surface of the hinge plate set 344 facing the display 210. In an exemplary embodiment, the front thermal conductive elements 370 may include a first front thermal conductive element 371 located on a surface of the first hinge plate 3441 and a second forward thermal conductive element 372 located on a surface of the second hinge plate 3442. In this case, the first front thermal conductive element 371 may be located between the first area 211 of the display 210 and the first hinge plate 3441, and the second front thermal conductive element 372 may be located between the second area 212 of the display 210 and the second hinge plate 3442.

[0089] In an exemplary embodiment, when the back plate set 350 supports the rear surface of the display 210, front thermal conductive elements 370 may be located between the hinge plate set 344 and the back plate set 350. In this case, the front thermal conductive elements 370 may physically connect the hinge plate set 344 and the back plate set 350 to form a heat transfer path. For example, both surfaces of the first front thermal conductive element 371 may contact the first hinge plate 3441 and the first back plate 351, respectively, and both surfaces of the second front thermal conductive element 372 may contact the second hinge plate 3442 and the second back plate 352, respectively. According to this design, the front thermal conductive elements 370 can form heat transfer paths, respectively, for the first region 211 and the second region 212 of the display 210. The back plate set 350 can separately support the first region 211 and the second region 212 through the first back plate 351 and the second back plate 352, which are separated. , minimizing interference when folding the display 210. In this case, the first front heat conduction element 371 can transfer heat to the first back plate 351, and the second front heat conduction element 372 can transfer heat to the second back plate 352, so that heat can be transferred evenly to the first area 211 and a second area 212 of the display 210.

[0090] In an exemplary embodiment, the first front thermal conductive element 371 and the second front thermal conductive element 372 may be arranged symmetrically with respect to the folding axis A. For example, the first front thermal conductive element 371 and the second front thermal conductive element 371 may be equally spaced relative to the folding axis A as viewed from the front surface of the display 210. In an exemplary embodiment, each of the first front thermal conductive element 371 and the second front thermal conductive element 372 may be provided in a plurality corresponding to the number of flexible circuit boards (eg, flexible circuit board 345) provided in the electronic device 20. For example, as shown in FIG. 4A, two first front thermal conductive elements 371 may be located on the front surface of the first hinge plate 3441, and two second front thermal conductive elements 372 may be located on the front surface of the second hinge plate 3442. In this case, a plurality of first front thermal conductive elements 371 and a plurality of second front thermal conductive elements The thermal conductive elements 372 may be arranged symmetrically to each other with respect to the folding axis A, that is, facing each other when the electronic device 20 is folded.

[0091] In an exemplary embodiment, the rear thermal conductive elements 380 may define heat transfer paths between the flexible printed circuit board 345 and the first and second hinge plates 3441 and 3442. The rear thermal conductive elements 380 may be located on the rear surface of the hinge plate array 344, that is, on a surface opposite the surface of the hinge plate array 344 on which the front thermal conductive elements 370 are located. In an exemplary embodiment, the rear thermal conductive elements 380 may be located between the hinge plate array 344 hinge and housing 342 hinges. In this case, at least a portion of the rear thermal conductive elements 380 may be positioned to cover the flexible printed circuit board 345, thereby connecting the flexible printed circuit board 345 and the hinge plate set 344. In an exemplary embodiment, the rear thermal conductive elements 380 may include a first rear thermal conductive element 381 located between the first hinge plate 3441 and the flexible printed circuit board 345, and a second rear thermal conductive element 382 located between the second hinge plate 3442 and the flexible printed circuit board 345. In an exemplary embodiment, both surfaces of the first rear thermal conductive element 381 may contact the first hinge plate 3441 and the flexible circuit board 345, and both surfaces of the second rear thermal conductive element 382 may contact the second hinge plate 3442 and the flexible circuit board 345. According to this design, the flexible circuit board 345 may be positioned extending between the first hinge plate 3441 and the hinge body 342 and between the second hinge plate 3442 and the hinge body 342, and connected to the first hinge plate 3441 and the second hinge plate 3442 via the first rear thermal conductive element 381 and the second rear thermal conductive element 382, respectively. thereby simultaneously transferring heat to the first hinge plate 3441 and the second hinge plate 3442.

[0092] In an exemplary embodiment, the flex printed circuit board 345 may include a pair of locking elements 4451 for attachment to the first support plate 3431 and the second support plate 3432. The pair of locking elements 4451 may cover a portion of the surface of the flexible printed circuit board 345 and be screwed to the support plates through flange protruding outwards. In an exemplary embodiment, the first hinge plate 3441 and the second hinge plate 3442 may include recesses 4443 recessed on their rear surfaces, i.e., the surfaces facing the flexible circuit board 345. In this case, a pair of locking elements 4451 may be inserted into the recesses 4443 corresponding first and second hinge plates 3441 and 3442, respectively. According to this design, the hinge plate set 344 and the flexible printed circuit board 345 can be connected through the recesses 4443 and the locking members 4451 and thus can be more firmly connected. In an exemplary embodiment, rear thermal conductive elements 380 may be located in recesses 4443. For example, a first rear thermal conductive element 381 may be located in a recess of recesses 4443 of a first hinge plate 3441, and a second rear thermal conductive element 382 may be located in a recess of recesses 4443 of a second hinge plate. hinge plates 3442.

[0093] In an exemplary embodiment, the first rear thermal conductive element 381 and the second rear thermal conductive element 382 may be arranged symmetrically with respect to the folding axis A. For example, the first rear thermal conductive element 381 and the second rear thermal conductive element 382 may be located at the same distance relative to the folding axis A. In an exemplary embodiment, when a plurality of flexible printed circuit boards (e.g., flexible printed circuit boards 345) are provided in the electronic device 20, each of the first rear thermal conductive element 381 and the second rear thermal conductive element 382 may be provided in a plurality corresponding to the number of flexible printed circuit boards 345.

[0094] FIG. 5A is a view illustrating the arrangement relationship of the front thermal conductive elements and the rear thermal conductive elements with respect to the hinge plate in an electronic device according to an embodiment of the disclosure, and FIG. 5B is a cross-sectional view of the electronic device along line Vb-Vb of FIG. 5A in accordance with an embodiment of the disclosure.

[0095] Referring to FIG. 5A and 5B, the electronic device 50 (for example, the electronic device 101 of FIG. 1) may implement a multi-directional heat dissipation function through the flexible printed circuit board 545, the rear thermal conductive element 580, and the front thermal conductive element 570.

[0096] In an exemplary embodiment, electronic device 50 may perform heat transfer between a first space (e.g., first space 221 of portion (A) of FIG. 2) and a second space (e.g., second space 231 of portion (A) of FIG. 2) via the flexible printed circuit board 545. The first space and the second space of the electronic device 50 may be divided based on a folding axis (for example, folding axis A of part (A) of FIG. 2), and a component that is the main source of heat, such as an application processor ( The AP), graphics processing unit (GPU), or power management IC (PMIC), may be mounted on a first circuit board (e.g., first circuit board 361 of FIG. 3A) or a second circuit board (e.g., second circuit board 362 of FIG. 3B ) located in each space. The flexible circuit board 545 may be positioned intersecting the first space and the second space, while both ends thereof may be connected to the first circuit board and the second circuit board, thereby serving as a heat transfer path for the first space and the second space. For example, when the temperature of the first space is higher than the temperature of the second space, heat may be dissipated from the first space to the second space through the flexible circuit board 545.

[0097] In an exemplary embodiment, the electronic device 50 may implement the function of radiating heat through the display 510 using a rear thermal conductive element 580 and a front thermal conductive element 570. Heat generated inside the electronic device 50 may be radiated outward through the display 510. In an exemplary embodiment, the rear the thermal conductive element 580 and the front thermal conductive element 570 may perform the function of transferring heat in a direction from the rear surface to the front surface of the electronic device 50 (eg, the z-axis direction of FIG. 5B).

[0098] In an exemplary embodiment, the rear thermal conductive element 580 may be attached to be in contact with the flexible circuit board 545 and the hinge plate set 544, thereby forming a heat transfer path. In this case, the heat generated in the first circuit board and the second circuit board may be transferred to the flexible circuit board 545, and the heat transferred to the flexible circuit board 545 may be transferred to the hinge plate set 544 through the rear thermal conductive element 580. In an exemplary embodiment, the hinge plate set 544 may be divided into a first hinge plate 5441 and a second hinge plate 5442 based on the folding axis to realize the folding operation of the electronic device 50. In this case, heat from the flexible circuit board 545 may be transferred to the first hinge plate 5441 and the second hinge plate 5442 through the first front heat conduction element 571 and the second front heat conduction element 572, respectively.

[0099] In an exemplary embodiment, the front thermal conductive element 570 may form a heat transfer path between the hinge plate set 544 and the display 510. For example, the front thermal conductive element 570 may be in physical contact with the hinge plate set 544 and the back plate set 550, thereby transferring heat from a set of 544 hinge plates to a set of 550 back plates. In an exemplary embodiment, the back plate set 550 may be divided into a first back plate 551 and a second back plate 552 supporting a first region and a second region of the display 510, respectively, so as not to interfere with the folding operation of the display 510. In this case, the first front thermal conductive element 571 may carry heat from the first hinge plate 5441 to the first back plate 551, and the second front heat conductive element 572 may transfer heat from the second hinge plate 5442 to the second back plate 552. In an exemplary embodiment, the heat transferred to the first back plate 551 and the heat transferred to the second back plate 552 may be brought out into the first region and the second region, respectively, and thereby radiated outward.

[00100] In an exemplary embodiment, rear thermal conductive element 580 and front thermal conductive element 570 may be arranged overlapping each other with a hinge plate set 544 placed between them. In other words, based on the state observed from the front surface of the display 510, as shown in FIG. 5A, the rear thermal conductive element 580 and the front thermal conductive element 570 may be located in positions overlapping each other. For example, the first front thermal conductive element 571 and the first rear thermal conductive element 581 may be arranged overlapping each other with the first hinge plate 5441 placed between them, and the second front thermal conductive element 572 and the second rear thermal conductive element 582 may be arranged overlapping each other with the second plate 5442 hinge placed between them. According to this design, the heat transfer path through the hinge plate between the front heat conduction element 570 and the rear heat conduction element 580 has the shortest distance. Thus, the heat from the flexible circuit board 545 can be efficiently transferred to the display 510.

[00101] FIG. 6A is a sectional view of an unfolded electronic device in accordance with an embodiment of the disclosure, and FIG. 6B is a sectional view of a folded electronic device in accordance with an embodiment of the disclosure.

[00102] Referring to FIG. 6A and 6B, as the electronic device 60 (e.g., the electronic device 101 of FIG. 1) is folded according to an exemplary embodiment, the distance between the display 610 and the hinge plate set 644 including the first hinge plate 6441 and the second hinge plate may change. 6442 hinges. In an exemplary embodiment, display 610 may be unfolded as shown in FIG. 6A, or folded as shown in FIG. 6B, according to the state of the electronic device 60. This folding operation of the display 610 can be performed by changing the shape of the folding area (for example, the axial area 213 of FIG. 2A) in which the folding axis is located (for example, the folding axis A of FIG. 2A , Fig. 2B). In this case, due to the change in the shape of the folding area, the distance between the display 610 and the hinge plate stack 644 may change slightly according to the folding state. In an exemplary embodiment, when the back plate set 650 including the first back plate 651 and the second back plate 652 is in contact with the rear surface of the display 610, the distance between the back plate set 650 and the hinge plate set 644 may also change slightly according to with the operation of folding the electronic device 60. For example, the distance d2 between the first back plate 651 and the first hinge plate 6441 when the electronic device 60 is folded, as shown in FIG. 6B may be less than the distance d1 between the first back plate 651 and the first hinge plate 6441 when the electronic device 60 is unfolded, as shown in FIG. 6A.

[00103] In an exemplary embodiment, the front thermal conductive element 671 may be single-sidedly bonded to only one of the back plate set 650 and the hinge plate set 644. For example, the front thermal conductive element 671 may be adhesively attached to the surface of the hinge plate set 644 while being releasably connected to the surface of the back plate set 650. According to this structure, even when the distance between the back plate set 650 and the hinge plate set 644 is increased, it is possible to prevent the back plate set 650 from being pulled out by the front heat conduction member 671 towards the hinge plate. Accordingly, it is possible to prevent the display 610 from being deformed by the rear heat conduction member 681 during the folding process.

[00104] In an exemplary embodiment, the rear thermal conductive element 681 may be double-sidedly bonded to the flexible circuit board 645 and the hinge plate set 644, respectively. In this case, the rear thermal conductive member 681 may be formed of a thermal conductive material and may be formed to have greater rigidity than the front thermal conductive member 671. In an exemplary embodiment, the shape of the flexible circuit board 645 may be changed during the folding process of the electronic device 60. Because the flexible circuit board 645 has an elastic force, the flexible circuit board 645 can apply an external force to the display 610 in the process of changing its shape. In this case, the rear thermal conductive element 681 can absorb the force caused by the change in the shape of the flexible circuit board 645, and at the same time reduce the change in the distance between the flexible circuit board 645 and the hinge plate set 644, thereby minimizing the influence of the flexible circuit board 645 on the display 610.

[00105] In an exemplary embodiment, when the electronic device 60 is folded as shown in FIG. 6B, the outwardly exposed area of the display 610 from which heat can radiate may be reduced, increasing the internal temperature of the electronic device 60. In this case, the electronic device 60 can perform the function of dissipating heat between both folded spaces through the heat transfer path formed by the flexible circuit board 645, and perform the function of dissipating heat between the flexible circuit board 645 and the display 610 through the front heat conduction element 671 and the rear heat conduction element 681, thereby distributing heat throughout the electronic device 60. Accordingly, the temperature difference in the electronic device 60 can be minimized depending on the position.

[00106] FIG. 7A is a partial exploded perspective view illustrating a thermal conductive sheet disposed between a display and a back plate in an electronic device according to an embodiment of the disclosure, FIG. 7B is a view illustrating the relative states of the arrangements of the thermal conductive sheet and the front thermal conductive elements in the electronic device according to an embodiment of the disclosure, and FIG. 7C is a partial exploded perspective view of the electronic device along line VIIc-VIIc of FIG. 7B in accordance with an embodiment of the disclosure.

[00107] Referring to FIG. 7A-7C, an electronic device 70 (e.g., the electronic device 101 of FIG. 1) in accordance with an exemplary embodiment may include a display 710, a back plate set 750, a hinge plate set 744 including a first hinge plate 7441 and a second a hinge plate 7442, a flexible printed circuit board 745, a front thermal conductive element 770, a rear thermal conductive element 780, and a thermal conductive sheet 790.

[00108] The display 710 may include a first area 711 and a second area 712 that fold about a folding axis. A backplate set 750 may be attached to a rear surface of the display 710 to support the display 710. The backplate set 750 may include a first backplate 751 supporting a first region 711 of the display 710 and a second backplate 752 supporting a second region 712 of the display 710. The first back plate 751 and the second back plate 752 may be arranged separately around the folding axis A so as not to interfere with the folding operation of the display 710.

[00109] A thermal conductive sheet 790 may be positioned between the display 710 and the backplate array 750. The thermal conductive sheet 790 may be attached to the back surface of the display 710 using an adhesive. The thermal conductive sheet 790 may provide uniform in-plane distribution of heat transferred to the display 710 through the backplate array 750. In an exemplary embodiment, the thermal conductive sheet 790 may include a highly conductive material, such as a graphite material.

[00110] In an exemplary embodiment, the thermally conductive sheet 790 may include a first sheet portion 791 located between the first region 711 of the display 710 and the first back plate 751, a second sheet portion 792 located between the second region 712 of the display 710 and the second back plate 752, and one or more connectors 793 connecting the first sheet portion 791 and the second sheet portion 792. In an exemplary embodiment, the one or more connectors 793 may have a relatively narrow width (eg, a direction parallel to the folding axis A) compared to the first sheet portion 791 and the second sheet portion 792. In an exemplary embodiment, when a plurality of one or more connectors 793 connects a first sheet portion 791 and a second sheet portion 792, an open space may be defined between the plurality of one or more connectors 793. According to this design, the one or more connectors 793 can perform a heat transfer function between the first sheet portion 791 and the second sheet portion 792 while minimizing interference during the folding operation of the display 710.

[00111] In an exemplary embodiment, the front thermal conductive element 770 may be located between the hinge plate set 744 and the back plate set 750. For example, the front thermal conductive element 770 may include a first front thermal conductive element 771 located between the first hinge plate and the first back plate 751, and a second front thermal conductive element 772 located between the second hinge plate and the second back plate 752. In an exemplary embodiment, the front thermal conductive element 772 is located between the second hinge plate and the second back plate 752. thermal conductive element 770 may be positioned facing one or more connectors 793 with back plates interposed therebetween. In other words, when looking at the front surface of the display 710 as shown in FIG. 7B, the front thermal conductive element 770 may be located in a position that overlaps the one or more connectors 793 of the thermal conductive sheet 790. For example, the first front thermal conductive element 771 may be located at the portion where the one or more connectors 793 and the first sheet portion 791 are connected. and the second front heat conductive element 772 may be located at a portion where said one or more connectors 793 and the second sheet portion 792 are connected. In an exemplary embodiment, when the thermal conductive sheet 790 includes a plurality of one or more connectors 793, the first front thermal conductive element 771 and the second front thermal conductive element 772 may be provided in a plurality to correspond to respective positions of the plurality of one or more connectors 793 For example, when the thermal conductive sheet 790 includes three of the one or more connectors 793, as shown in FIG. 7B, three first front thermal conductive elements 771 and three second front thermal conductive elements 772 may be provided and positioned at positions corresponding to respective connectors of said one or more connectors 793, with a set of back plates 750 placed between them. According to this structure, the thermal conductive sheet 790 can receive heat in portions adjacent to the one or more connectors 793 through the front thermal conductive members 770, and thus heat transfer between the first sheet portion 791 and the second sheet portion 792 can be performed faster. Accordingly, heat can be distributed over the entire area of the display 710 and radiated.

[00112] FIG. 8A is a view illustrating a set of hinge plates disposed in a hinge assembly in accordance with the disclosure embodiment of FIG. 8B is a partial perspective view illustrating a set of hinge plates disposed in a hinge assembly in accordance with an embodiment of the disclosure, and FIG. 8C is a partial cross-sectional view of the electronic device along line VIIIc-VIIIc of FIG. 8A in accordance with an embodiment of the disclosure.

[00113] Referring to FIG. 8A-8C, an electronic device 80 (e.g., the electronic device 101 of FIG. 1) in accordance with an exemplary embodiment may include a display 810, a back plate set 850, a hinge plate set 844, a hinge housing 842, a flexible circuit board 845, and front thermal conductive element 870. In an exemplary embodiment, a set of back plates 850 may be attached to a rear surface of the display 810 to support the display 810. In an exemplary embodiment, a set of hinge plates 844 may include a first hinge plate 8441 located on the rear surface of the first region ( for example, a first region 211 of portion (A) of FIG. 2) of the display 810, and a second hinge plate 8442 located on the rear surface of the second region (e.g., second region 212 of portion (B) of FIG. 2) of the display 810. In an exemplary embodiment, In an embodiment, the flex circuit board 845 may be positioned extending between the hinge body 842 and the hinge plate set 844. In an exemplary embodiment, flexible printed circuit board 845 may include a locking element 8451 including first and second locking elements 8451a and 8451b facing the hinge plate set 844.

[00114] In an exemplary embodiment, each of the first hinge plate 8441 and the second hinge plate 8442 may include a first plate region A1 and a second plate region A2. In this case, each hinge plate can perform heat transfer with the flexible circuit board 845 through the first plate area A1. In an exemplary embodiment, the first plate region A1 and the second plate region A2 may include different materials. In this case, the first plate region A1 may include a material having a higher thermal conductivity than the second plate region A2. For example, the first plate region A1 may include a material such as aluminum or copper, and the second plate region A2 may include a material such as steel or stainless steel.

[00115] In an exemplary embodiment, each of the first and second hinge plates 8441 and 8442 may be in direct contact with the flexible circuit board 845 through the first plate area A1. For example, flexible circuit board 845 may contact the first plate area A1 of the first hinge plate 8441 through the first locking element 8451a and contact the first plate area A1 of the second hinge plate 8442 through the second locking element 8451b. In an exemplary embodiment, the first region A1 of the plate may have a greater thickness than the second region A2 of the plate. For example, each of the first and second hinge plates 8441 and 8442 may include a first plate region A1 that projects toward the flex circuit board 845 relative to the second plate region A2. In this case, the front surface of the first and second hinge plates 8441 and 8442, that is, the surface facing the rear plate set 850, can be formed without a step between the first plate region A1 and the second plate region A2.

[00116] In an exemplary embodiment, the front thermal conductive element 870 may be positioned in contact with the front surface of the first and second hinge plates 8441 and 8442. The front thermal conductive element 870 may include a first front thermal conductive element 871 located on the front surface of the first hinge plate 8441 and a second front thermal conductive element 872 located on the front surface of the second hinge plate 8442. In an exemplary embodiment, each of the first and second front thermal conductive elements 871 and 872 may be located on an opposite surface of the portion where the hinge plate contacts the flexible printed circuit board 845. Heat from the flexible printed circuit board 845 may be transferred to the front thermal conductive element 870 through the first and second hinge plates 8441 and 8442.

[00117] FIG. 9A is a perspective view of a flexible printed circuit board in accordance with an embodiment of the disclosure, and FIG. 9B is a partial cross-sectional view of an electronic device in accordance with an embodiment of the disclosure.

[00118] Referring to FIG. 9A and 9B, an electronic device 90 in accordance with an exemplary embodiment may include a display 910, a back plate set 950, a hinge plate set 944, a front thermal conductive element 970, a rear thermal conductive element 980, and a flexible printed circuit board 945.

[00119] In an exemplary embodiment, flexible circuit board 945 may include a pair of contact areas B1 and a curved area B2 that connects the pair of contact areas B1 and is curved into the interior of the hinge body. In an exemplary embodiment, a pair of contact areas B1 may be located between the hinge body 942 and the hinge plate set 944. The flexible circuit board 945 can transfer heat to the hinge plate set 944 through a pair of contact areas B1. In an exemplary embodiment, flexible printed circuit board 945 may include a pair of locking elements 9451a and 9451b located on a pair of contact areas B1, respectively. In this case, the positions of the pair of contact areas B1 of the flexible printed circuit board 945 can be fixed by a pair of locking elements 9451a and 9451b so as to be located between the hinge body 942 and the hinge plate set 944. For example, a pair of locking members 9451a and 9451b may be attached to support plates (eg, first and second support plates 3431 and 3432 of FIG. 4B) attached to both sides of the hinge body.

[00120] In an exemplary embodiment, the curved area B2 may be curved toward the receiving space 9421 within the hinge housing 942. In this case, the shape of the curved region B2 may change in accordance with the folding operation of the electronic device 90. The curved region B2 may have sufficient excess length to accommodate the change in shape. In an exemplary embodiment, a force that is relatively large and constant may be applied to the curved region B2 compared to the pair of contact regions B1 due to the change in shape in accordance with the folding operation of the electronic device 90.

[00121] In an exemplary embodiment, the surface of at least a portion of the flexible circuit board region 945, excluding the curved region B2, may be coated with a thermal radiative layer 9452 including a graphite material. Since mechanical stress is constantly applied to the curved region B2, the surface of the area other than the curved region B2, for example, a pair of contact regions B1, can be covered with a heat-radiating layer 9452. In this case, the heat-radiating layer 9452 can improve the heat transfer efficiency between the pair of contact regions B1 and the set 944 hinge plates. In an exemplary embodiment, at least a portion of the curved region B2 may contact the inner circumferential surface of the receiving space 9421 of the hinge body 942. In this case, since the heat-radiating layer 9452 is not provided on the surface of the curved region B2, heat transfer to the hinge body 942 can be accomplished through the metal layer that is exposed to the outside.

[00122] In various embodiments, the electronic device 20 may include a display 210 including a first area 211 and a second area 212, a first housing 220 defining a first space 221 located on a rear surface of the first area 211, a second housing 230 defining a second space 231 located on the rear surface of the second region 212, a hinge assembly 240 to ensure that the first region 211 and the second region 212 are in a first state forming substantially the same plane, or are in a second state facing each other to each other, and a plurality of front thermal conductive elements 370 defining a heat transfer path between the hinge assembly 240 and the display 210. In various exemplary embodiments, the hinge assembly 240 may include a hinge plate set 344 including a first hinge plate 3441 coupled to the first housing 220, and a second hinge plate 3442 connected to the second body 230, a hinge 341 connecting the first hinge plate 3441 and the second hinge plate 3442 rotatably about the folding axis A, the hinge body 342 to which the hinge 341 is attached, the hinge body 342 connecting a hinge plate set 344, and a flexible printed circuit board 345 with at least a portion located between the hinge plate set 344 and the hinge body 342, and both ends extending into the first space 221 and the second space 231, and wherein the front thermal conductive elements 370 may be located on the surface of the hinge plate set 344 facing the display 210.

[00123] In various exemplary embodiments, the electronic device 20 may further include a set of back plates 350 located between the display 210 and a set of hinge plates 344 and including conductive material. The backplate set 350 may include a first backplate 351 supporting the rear surface of the first region 211 and a second backplate 352 supporting the rear surface of the second region 212, wherein the second backplate 352 is spaced apart from the first backplate 351.

[00124] The front thermal conductive elements 370 may include a first front thermal conductive element 371 with both surfaces in contact with the first back plate 351 and the first hinge plate 3441, respectively, and a second front thermal conductive element 372 with both surfaces in contact with the second back plate 352 and the second plate 3442 hinge, respectively.

[00125] In various exemplary embodiments, the front thermal conductive elements 370 may be single-sidedly bonded to only one of the backplate set 350 and the hinge plate set 344.

[00126] In various embodiments, the first front thermal conductive element 371 and the second forward thermal conductive element 372 may be located symmetrically about the folding axis.

[00127] In various exemplary embodiments, the electronic device 70 may further include a thermal conductive sheet 790 located between the display 710 and the backplate array 750. Thermally conductive sheet 790 may include a first sheet region 791 located between the first region 711 and the first back plate 751, a second sheet region 792 located between the second region 712 and the second back plate 752, and one or more connectors 793 located intersecting the axis. And folding and connecting the first sheet portion 791 and the second sheet portion 792, and wherein the front thermal conductive elements 770 may be positioned facing said one or more connectors 793 with a set of back plates 750 placed between them.

[00128] In various exemplary embodiments, front thermal conductive elements 370 may be located in portions facing the flexible circuit board 345 with a set of back plates 350 placed between them.

[00129] In various exemplary embodiments, the electronic device 20 may further include a plurality of rear thermal conductive elements 380 defining a heat transfer path between the hinge plate set 344 and the flexible printed circuit board 345. The rear thermal conductive elements 380 may include a first rear thermal conductive element 381, located between the first hinge plate 3441 and the flexible circuit board 345, and a second rear thermal conductive element 382 located between the second hinge plate 3442 and the flexible circuit board 345.

[00130] In various exemplary embodiments, the rear thermal conductive elements 380 may be positioned overlapping the front thermal conductive elements 370 with a hinge plate set 344 placed between them.

[00131] In various exemplary embodiments, the rear thermal conductive elements 380 and the front thermal conductive elements 370 may be formed from thermal conductive materials, and the rear thermal conductive elements 380 may have greater rigidity than the front thermal conductive elements 370.

[00132] In various exemplary embodiments, the rear thermal conductive elements 380 may be reversibly bonded to the hinge plate set 344 and the flexible printed circuit board 345, respectively.

[00133] In various exemplary embodiments, respectively, the first hinge plate 3441 and the second hinge plate 3442 may have recesses 4443 recessed into surfaces facing the flexible circuit board 345, the flexible circuit board 345 may include a pair of locking elements 4451 that are inserted into the recesses 4443 of the first hinge plate 3441 and the second hinge plate 3442, respectively, and the rear thermal conductive elements 380 may be located in the recesses 4443.

[00134] In various embodiments, the second distance d2 between the first back plate 651 and the first hinge plate 6441 in the second state is less than the first distance d1 between the first back plate 651 and the first hinge plate 6441 in the first state.

[00135] In various exemplary embodiments, the first hinge plate 8441 and the second hinge plate 8442 may include a first plate region A1 and a second plate region A2 including a material different from the material of the first plate region, and a flexible printed circuit board may be positioned between the first plate area A1 and the hinge body 842.

[00136] In various example embodiments, the first plate region A1 may be thicker than the second plate region A2 and contact the flexible circuit board 845.

[00137] In various exemplary embodiments, flexible printed circuit board 945 may include a curved region B2 that is curved into the interior of the hinge body 942 and coated with a thermal radiative layer 9452 including graphite material on the surface of at least a portion of the region other than the curved area. area B2.

[00138] The electronic device 20 according to various exemplary embodiments may include a display 210 including a first area 211 and a second area 212 that can be folded through a folding axis A, a first support plate 3431 located rearward of the first area 211 , a second support plate 3432 located in a rearward direction from the second region 212, a hinge body 342 to which a hinge 341 is attached for rotating the first support plate 3431 and the second support plate 3432 about a folding axis A, the hinge body 342 being located along the folding axis A for connecting the first support plate 3431 and the second support plate 3432, a hinge plate set 344 including a first hinge plate 3441 connecting the hinge body 342 and the first support plate 3431, and a second hinge plate 3442 connecting the hinge body 342 and the second support plate 3432 , a first circuit board 361 located in a direction opposite to the first region 211 relative to the first support plate 3431, a second circuit board 362 located in a direction opposite the second region 212 relative to the second support plate 3432, a flexible circuit board 345 located intersecting the first region 211, and a second region 212 between the hinge plate set 344 and the hinge body 342 and connecting the first circuit board 361 and the second circuit board 362, and a first front thermal conductive element 371 and a second front thermal conductive element 372 located between the hinge plate set 344 and the display 210, respectively forming paths heat transfer between the first region 211 and the second region 212 of the display 210 and the hinge plate array 344.

[00139] In various exemplary embodiments, the electronic device 20 may further include a first rear thermal conductive element 381 defining a heat transfer path between the first hinge plate 3441 and the flexible printed circuit board 345, and a second rear thermal conductive element 382 defining a heat transfer path between the second hinge plate 3442 hinge and flexible printed circuit board 345.

[00140] In various exemplary embodiments, the first front thermal conductive element 371 and the first rear thermal conductive element 381 may be positioned overlapping in at least a portion with the first hinge plate 3441 placed between them, and the second front thermal conductive element 372 and the second rear thermal conductive element 382 may be positioned overlapping over at least a portion with a second hinge plate 3442 placed between them.

[00141] In various exemplary embodiments, the electronic device 20 may further include a set of backplates 350 supporting a rear surface of the display 210. The set of backplates 350 may include a first backplate 351 on which a first region 211 of the display 210 is mounted, and a second back plate 352 on which a second region 212 of the display 210 is mounted, wherein the second back plate 352 is spaced from the first back plate 351 and both surfaces of each of the first front thermal conductive element 371 and the second front thermal conductive element 372 may be in contact with the set 350 back plates and a set of 344 hinge plates.

[00142] In various exemplary embodiments, the first front thermal conductive element 371 and the second front thermal conductive element 372 may be single-sidedly adhered to only one of the back plate set 350 and the hinge plate set 344.

[00143] While the present disclosure has been shown and described with reference to various embodiments thereof, those skilled in the art will appreciate that various changes in form and detail may be made thereto without departing from the spirit and scope of the disclosure as defined by the appended claims. invention and its equivalents.

[00144] Accordingly, other implementations, other embodiments and equivalent claims are within the scope of the following claims.

Claims (47)

1. A foldable electronic communication device with a flexible display, comprising: a flexible display comprising a first area and a second area; a first body defining a first space located on a rear surface of the first region; a second body defining a second space located on a rear surface of the second region; a hinge assembly configured to cause the first region and the second region to be in one of a first state or a second state, the first state comprising a first region and a second region forming substantially the same plane, the second state comprising a first region and a second region, facing each other; And a plurality of front heat conductive elements forming a heat transfer path between the hinge assembly and the display, wherein the hinge unit contains: a set of hinge plates comprising a first hinge plate and a second hinge plate, the first hinge plate being coupled to the first body and the second hinge plate being coupled to the second body; a hinge connecting the first hinge plate to the second hinge plate so that it can be rotated about a folding axis; a hinge body to which the hinge is attached, the hinge body connecting a set of hinge plates; And a flexible printed circuit board (FPCB), wherein at least a portion of the FPCB is located between the hinge plate set and the hinge body, and both ends of the FPCB extend into the first space and the second space, and wherein a plurality of front heat-conducting elements are located on the surface of the set of hinge plates facing the display, wherein the foldable electronic communication device with a flexible display further comprises: a set of back plates containing conductive material and located between the display and the set of hinge plates, the set of back plates contains: a first back plate supporting a rear surface of the first region; And a second back plate supporting a rear surface of the second region, wherein the second back plate and the first back plate are separated by a distance, wherein the plurality of front heat-conducting elements comprises: a first front thermal conductive element located between the first back plate and the first hinge plate, and a second front heat conductive element located between the second rear plate and the second hinge plate. 2. The electronic device according to claim 1, wherein the first front heat-conducting element is in contact with both surfaces of the first back plate and the first hinge plate, respectively; And the second front heat-conducting element contacts the second rear plate and the second hinge plate with both surfaces, respectively. 3. The electronic device of claim 1, wherein the plurality of front thermal conductive elements are unilaterally bonded to only one of the set of back plates or the set of hinge plates. 4. The electronic device according to claim 1, wherein the first front heat-conducting element and the second front heat-conducting element are located symmetrically relative to the folding axis. 5. Electronic device according to claim 1, additionally containing: a heat-conducting sheet located between the display and a set of back plates, the heat-conducting sheet contains: a first sheet portion located between the first region and the first back plate; a second sheet portion located between the second region and the second back plate; And one or more connectors located intersecting the folding axis and connecting the first sheet portion and the second sheet portion, and wherein a plurality of front thermal conductive elements are arranged facing said one or more connectors with a set of rear plates placed between them. 6. The electronic device of claim 1, wherein a plurality of front thermal conductive elements are located in portions facing the FPCB with a set of back plates placed between them. 7. Electronic device according to claim 1, additionally containing: a plurality of rear thermal conductive elements forming a heat transfer path between the hinge plate set and the FPCB, wherein the plurality of rear heat-conducting elements comprises: a first rear thermal conductive element located between the first hinge plate and the FPCB; And a second rear thermal conductive element located between the second hinge plate and the FPCB. 8. The electronic device of claim 7, wherein the plurality of rear thermal conductive elements overlap the plurality of front thermal conductive elements, with a set of hinge plates interposed therebetween. 9. The electronic device according to claim 7, wherein the plurality of rear thermal conductive members and the plurality of front thermal conductive members are formed of thermal conductive materials, and wherein the plurality of rear heat-conducting elements has greater rigidity than the plurality of front heat-conducting elements. 10. The electronic device according to claim 7, wherein the plurality of rear thermal conductive elements are double-sidedly bonded to the set of hinge plates and the FPCB, respectively. 11. The electronic device according to claim 1, wherein the second distance between the first back plate and the first hinge plate in the second state is less than the first distance between the first back plate and the first hinge plate in the first state. 12. The electronic device of claim 1, wherein the first hinge plate and the second hinge plate comprise a first plate region and a second plate region comprising a material different from the material of the first plate region, and wherein the FPCB is located between the first plate region and the hinge body. 13. The electronic device of claim 12, wherein the first region of the plate has a greater thickness than the second region of the plate, and wherein the first region of the plate is in contact with the FPCB. 14. The electronic device of claim 1, wherein the FPCB comprises a curved region that is curved into the interior of the hinge body and is coated with a heat-radiating layer comprising a graphite material on the surface of at least a portion of the FPCB region other than the curved region.

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