KR20240015548A - Flexible display and electronic device with the same - Google Patents

Abstract

According to an embodiment of the present disclosure, an electronic device includes a housing including a first housing and a second housing, a hinge structure rotatably connecting the first housing and the second housing, and a flexible device disposed on the housing. It may include a display, at least one heat dissipation sheet disposed between the first housing and the flexible display, and a cushion member disposed between the second housing and the flexible display. In addition, various embodiments may be possible.

Description

Flexible display and electronic device including same {FLEXIBLE DISPLAY AND ELECTRONIC DEVICE WITH THE SAME}

Various embodiments disclosed in this document relate to electronic devices, for example, flexible displays and electronic devices including the same.

Thanks to remarkable developments in information and communication technology and semiconductor technology, the distribution and use of various electronic devices is rapidly increasing. In particular, recent electronic devices are being developed so that they can be carried and used for communication.

Electronic devices refer to devices that perform specific functions according to installed programs, such as home appliances, electronic notebooks, portable multimedia players, mobile communication terminals, tablet PCs, video/audio devices, desktop/laptop computers, and vehicle navigation devices. It can mean. For example, these electronic devices can output stored information as sound or video. As the degree of integration of electronic devices increases and high-speed, high-capacity wireless communication becomes more common, recently, various functions can be installed in a single electronic device such as a mobile communication terminal. For example, in addition to communication functions, entertainment functions such as games, multimedia functions such as music/video playback, communication and security functions such as mobile banking, and functions such as schedule management and electronic wallet are integrated into one electronic device. will be. These electronic devices are being miniaturized so that users can conveniently carry them.

According to one embodiment of the present disclosure, an electronic device may include a housing, a hinge structure, a flexible display, at least one heat dissipation sheet, or a cushion member. The housing may include a first housing or a second housing. The hinge structure may rotatably connect the first housing and the second housing. The flexible display may be placed on the housing. The at least one heat dissipation sheet may be disposed between the first housing and the flexible display. The cushion member may be disposed between the second housing and the flexible display. The cushion member may include a first cushion member or a second cushion member. At least one portion of the first cushion member may be disposed between at least one portion of the hinge structure and the flexible display. The first cushion member may be spaced apart from the flexible display by a first distance. The second cushion member may be disposed adjacent to the first cushion member. The second cushion member may be spaced apart from the flexible display by a second distance smaller than the first distance.

According to one embodiment of the present disclosure, an electronic device may include a housing, a hinge structure, a flexible display, at least one heat dissipation sheet, or a cushion member. The housing may include a first housing or a second housing. The hinge structure may rotatably connect the first housing and the second housing. The flexible display may be placed on the housing. The at least one heat dissipation sheet may be disposed between the first housing and the flexible display. The cushion member may be disposed between the second housing and the flexible display. The cushion member may include a first cushion member or a second cushion member. At least one portion of the first cushion member may be disposed between at least one portion of the hinge structure and the flexible display. The first cushion member may have a first thickness in a first direction. The second cushion member may be disposed adjacent to the first cushion member. The second cushion member may have a second thickness greater than the first thickness in the first direction.

1 is a block diagram of an electronic device in a network environment, according to various embodiments.
FIG. 2 is a diagram illustrating an unfolded state of an electronic device according to an embodiment of the present disclosure.
FIG. 3 is a diagram illustrating a folded state of an electronic device according to an embodiment of the present disclosure.
Figure 4 is an exploded perspective view of an electronic device according to an embodiment of the present disclosure.
FIG. 5 is a diagram for explaining a housing and a camera decoration member of an electronic device, according to an embodiment of the present disclosure.
FIG. 6 is a diagram for explaining a heat dissipation sheet and a cushion member of an electronic device according to an embodiment of the present disclosure.
7 is a cross-sectional view of an electronic device according to an embodiment of the present disclosure.
8 is a cross-sectional view of an electronic device according to an embodiment of the present disclosure.
9 is a cross-sectional view of an electronic device, according to an embodiment of the present disclosure.
10 is a cross-sectional view of an electronic device according to an embodiment of the present disclosure.

1 is a block diagram of an electronic device 101 in a network environment 100, according to various embodiments.

Referring to FIG. 1, in the network environment 100, the electronic device 101 communicates with the electronic device 102 through a first network 198 (e.g., a short-range wireless communication network) or a second network 199. It is possible to communicate with at least one of the electronic device 104 or the server 108 through (e.g., a long-distance wireless communication network). According to one embodiment, the electronic device 101 may communicate with the electronic device 104 through the server 108. According to one embodiment, the electronic device 101 includes a processor 120, a memory 130, an input module 150, an audio output module 155, a display module 160, an audio module 170, and a sensor module ( 176), interface 177, connection terminal 178, haptic module 179, camera module 180, power management module 188, battery 189, communication module 190, subscriber identification module 196 , or may include an antenna module 197. In some embodiments, at least one of these components (eg, the connection terminal 178) may be omitted or one or more other components may be added to the electronic device 101. In some embodiments, some of these components (e.g., sensor module 176, camera module 180, or antenna module 197) are integrated into one component (e.g., display module 160). It can be.

The processor 120, for example, executes software (e.g., program 140) to operate at least one other component (e.g., hardware or software component) of the electronic device 101 connected to the processor 120. It can be controlled and various data processing or calculations can be performed. According to one embodiment, as at least part of data processing or computation, the processor 120 stores commands or data received from another component (e.g., sensor module 176 or communication module 190) in volatile memory 132. The commands or data stored in the volatile memory 132 can be processed, and the resulting data can be stored in the non-volatile memory 134. According to one embodiment, the processor 120 includes a main processor 121 (e.g., a central processing unit or an application processor) or an auxiliary processor 123 that can operate independently or together (e.g., a graphics processing unit, a neural network processing unit ( It may include a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor). For example, if the electronic device 101 includes a main processor 121 and a secondary processor 123, the secondary processor 123 may be set to use lower power than the main processor 121 or be specialized for a designated function. You can. The auxiliary processor 123 may be implemented separately from the main processor 121 or as part of it.

The auxiliary processor 123 may, for example, act on behalf of the main processor 121 while the main processor 121 is in an inactive (e.g., sleep) state, or while the main processor 121 is in an active (e.g., application execution) state. ), together with the main processor 121, at least one of the components of the electronic device 101 (e.g., the display module 160, the sensor module 176, or the communication module 190) At least some of the functions or states related to can be controlled. According to one embodiment, co-processor 123 (e.g., image signal processor or communication processor) may be implemented as part of another functionally related component (e.g., camera module 180 or communication module 190). there is. According to one embodiment, the auxiliary processor 123 (eg, neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. Artificial intelligence models can be created through machine learning. For example, such learning may be performed in the electronic device 101 itself on which the artificial intelligence model is performed, or may be performed through a separate server (e.g., server 108). Learning algorithms may include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but It is not limited. An artificial intelligence model may include multiple artificial neural network layers. Artificial neural networks include deep neural network (DNN), convolutional neural network (CNN), recurrent neural network (RNN), restricted boltzmann machine (RBM), belief deep network (DBN), bidirectional recurrent deep neural network (BRDNN), It may be one of deep Q-networks or a combination of two or more of the above, but is not limited to the examples described above. In addition to hardware structures, artificial intelligence models may additionally or alternatively include software structures.

The memory 130 may store various data used by at least one component (eg, the processor 120 or the sensor module 176) of the electronic device 101. Data may include, for example, input data or output data for software (e.g., program 140) and instructions related thereto. Memory 130 may include volatile memory 132 or non-volatile memory 134.

The program 140 may be stored as software in the memory 130 and may include, for example, an operating system 142, middleware 144, or application 146.

The input module 150 may receive commands or data to be used in a component of the electronic device 101 (e.g., the processor 120) from outside the electronic device 101 (e.g., a user). The input module 150 may include, for example, a microphone, mouse, keyboard, keys (eg, buttons), or digital pen (eg, stylus pen).

The sound output module 155 may output sound signals to the outside of the electronic device 101. The sound output module 155 may include, for example, a speaker or a receiver. Speakers can be used for general purposes such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. According to one embodiment, the receiver may be implemented separately from the speaker or as part of it.

The display module 160 can visually provide information to the outside of the electronic device 101 (eg, a user). The display module 160 may include, for example, a display, a hologram device, or a projector, and a control circuit for controlling the device. According to one embodiment, the display module 160 may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of force generated by the touch.

The audio module 170 can convert sound into an electrical signal or, conversely, convert an electrical signal into sound. According to one embodiment, the audio module 170 acquires sound through the input module 150, the sound output module 155, or an external electronic device (e.g., directly or wirelessly connected to the electronic device 101). Sound may be output through the electronic device 102 (e.g., speaker or headphone).

The sensor module 176 detects the operating state (e.g., power or temperature) of the electronic device 101 or the external environmental state (e.g., user state) and generates an electrical signal or data value corresponding to the detected state. can do. According to one embodiment, the sensor module 176 includes, for example, a gesture sensor, a gyro sensor, an air pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, It may include a temperature sensor, humidity sensor, or light sensor.

The interface 177 may support one or more designated protocols that can be used to connect the electronic device 101 directly or wirelessly with an external electronic device (eg, the electronic device 102). According to one embodiment, the interface 177 may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

The connection terminal 178 may include a connector through which the electronic device 101 can be physically connected to an external electronic device (eg, the electronic device 102). According to one embodiment, the connection terminal 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (eg, a headphone connector).

The haptic module 179 can convert electrical signals into mechanical stimulation (e.g., vibration or movement) or electrical stimulation that the user can perceive through tactile or kinesthetic senses. According to one embodiment, the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

The camera module 180 can capture still images and moving images. According to one embodiment, the camera module 180 may include one or more lenses, image sensors, image signal processors, or flashes.

The power management module 188 can manage power supplied to the electronic device 101. According to one embodiment, the power management module 188 may be implemented as at least a part of, for example, a power management integrated circuit (PMIC).

The battery 189 may supply power to at least one component of the electronic device 101. According to one embodiment, the battery 189 may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

Communication module 190 is configured to provide a direct (e.g., wired) communication channel or wireless communication channel between electronic device 101 and an external electronic device (e.g., electronic device 102, electronic device 104, or server 108). It can support establishment and communication through established communication channels. Communication module 190 operates independently of processor 120 (e.g., an application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module 190 is a wireless communication module 192 (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (e.g., : LAN (local area network) communication module, or power line communication module) may be included. Among these communication modules, the corresponding communication module is a first network 198 (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network 199 (e.g., legacy It may communicate with an external electronic device 104 through a telecommunication network such as a cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., LAN or WAN). These various types of communication modules may be integrated into one component (e.g., a single chip) or may be implemented as a plurality of separate components (e.g., multiple chips). The wireless communication module 192 uses subscriber information (e.g., International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module 196 within a communication network such as the first network 198 or the second network 199. The electronic device 101 can be confirmed or authenticated.

The wireless communication module 192 may support 5G networks after 4G networks and next-generation communication technologies, for example, NR access technology (new radio access technology). NR access technology provides high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and access to multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low latency). -latency communications)) can be supported. The wireless communication module 192 may support high frequency bands (eg, mmWave bands), for example, to achieve high data rates. The wireless communication module 192 uses various technologies to secure performance in high frequency bands, for example, beamforming, massive array multiple-input and multiple-output (MIMO), and full-dimensional multiplexing. It can support technologies such as input/output (FD-MIMO: full dimensional MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module 192 may support various requirements specified in the electronic device 101, an external electronic device (e.g., electronic device 104), or a network system (e.g., second network 199). According to one embodiment, the wireless communication module 192 supports Peak data rate (e.g., 20 Gbps or more) for realizing eMBB, loss coverage (e.g., 164 dB or less) for realizing mmTC, or U-plane latency (e.g., 164 dB or less) for realizing URLLC. Example: Downlink (DL) and uplink (UL) each of 0.5 ms or less, or round trip 1 ms or less) can be supported.

The antenna module 197 may transmit or receive signals or power to or from the outside (eg, an external electronic device). According to one embodiment, the antenna module 197 may include an antenna including a radiator made of a conductor or a conductive pattern formed on a substrate (eg, PCB). According to one embodiment, the antenna module 197 may include a plurality of antennas (eg, an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network such as the first network 198 or the second network 199 is connected to the plurality of antennas by, for example, the communication module 190. can be selected. Signals or power may be transmitted or received between the communication module 190 and an external electronic device through the at least one selected antenna. According to some embodiments, in addition to the radiator, other components (eg, radio frequency integrated circuit (RFIC)) may be additionally formed as part of the antenna module 197.

According to various embodiments, the antenna module 197 may form a mmWave antenna module. According to one embodiment, a mmWave antenna module includes: a printed circuit board, an RFIC disposed on or adjacent to a first side (e.g., bottom side) of the printed circuit board and capable of supporting a designated high frequency band (e.g., mmWave band); And a plurality of antennas (e.g., array antennas) disposed on or adjacent to the second side (e.g., top or side) of the printed circuit board and capable of transmitting or receiving signals in the designated high frequency band. can do.

At least some of the components are connected to each other through a communication method between peripheral devices (e.g., bus, general purpose input and output (GPIO), serial peripheral interface (SPI), or mobile industry processor interface (MIPI)) and signal ( (e.g. commands or data) can be exchanged with each other.

According to one embodiment, commands or data may be transmitted or received between the electronic device 101 and the external electronic device 104 through the server 108 connected to the second network 199. Each of the external electronic devices 102 or 104 may be of the same or different type as the electronic device 101. According to one embodiment, all or part of the operations performed in the electronic device 101 may be executed in one or more of the external electronic devices 102, 104, or 108. For example, when the electronic device 101 needs to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device 101 may perform the function or service instead of executing the function or service on its own. Alternatively, or additionally, one or more external electronic devices may be requested to perform at least part of the function or service. One or more external electronic devices that have received the request may execute at least part of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device 101. The electronic device 101 may process the result as is or additionally and provide it as at least part of a response to the request. For this purpose, for example, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology can be used. The electronic device 101 may provide an ultra-low latency service using, for example, distributed computing or mobile edge computing. In another embodiment, the external electronic device 104 may include an Internet of Things (IoT) device. Server 108 may be an intelligent server using machine learning and/or neural networks. According to one embodiment, the external electronic device 104 or server 108 may be included in the second network 199. The electronic device 101 may be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

Electronic devices according to various embodiments disclosed in this document may be of various types. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. Electronic devices according to embodiments of this document are not limited to the above-described devices.

The various embodiments of this document and the terms used herein are not intended to limit the technical features described in this document to specific embodiments, and should be understood to include various changes, equivalents, or replacements of the embodiments. In connection with the description of the drawings, similar reference numbers may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the above items, unless the relevant context clearly indicates otherwise. As used herein, “A or B”, “at least one of A and B”, “at least one of A or B”, “A, B or C”, “at least one of A, B and C”, and “A Each of phrases such as “at least one of , B, or C” may include any one of the items listed together in the corresponding phrase, or any possible combination thereof. Terms such as "first", "second", or "first" or "second" may be used simply to distinguish one component from another, and to refer to that component in other respects (e.g., importance or order) is not limited. One (e.g., first) component is said to be “coupled” or “connected” to another (e.g., second) component, with or without the terms “functionally” or “communicatively.” When mentioned, it means that any of the components can be connected to the other components directly (e.g. wired), wirelessly, or through a third component.

The term “module” used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and is interchangeable with terms such as logic, logic block, component, or circuit, for example. It can be used as A module may be an integrated part or a minimum unit of the parts or a part thereof that performs one or more functions. For example, according to one embodiment, the module may be implemented in the form of an application-specific integrated circuit (ASIC).

Various embodiments of the present document are one or more instructions stored in a storage medium (e.g., built-in memory 136 or external memory 138) that can be read by a machine (e.g., electronic device 101). It may be implemented as software (e.g., program 140) including these. For example, a processor (e.g., processor 120) of a device (e.g., electronic device 101) may call at least one command among one or more commands stored from a storage medium and execute it. This allows the device to be operated to perform at least one function according to the at least one instruction called. The one or more instructions may include code generated by a compiler or code that can be executed by an interpreter. A storage medium that can be read by a device may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' only means that the storage medium is a tangible device and does not contain signals (e.g. electromagnetic waves), and this term refers to cases where data is semi-permanently stored in the storage medium. There is no distinction between temporary storage cases.

According to one embodiment, methods according to various embodiments disclosed in this document may be included and provided in a computer program product. Computer program products are commodities and can be traded between sellers and buyers. The computer program product may be distributed in the form of a machine-readable storage medium (e.g. compact disc read only memory (CD-ROM)) or through an application store (e.g. Play StoreTM) or on two user devices (e.g. It can be distributed (e.g. downloaded or uploaded) directly between smart phones) or online. In the case of online distribution, at least a portion of the computer program product may be at least temporarily stored or temporarily created in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or a relay server.

According to various embodiments, each component (e.g., module or program) of the above-described components may include a single or plural entity, and some of the plurality of entities may be separately placed in other components. there is. According to various embodiments, one or more of the components or operations described above may be omitted, or one or more other components or operations may be added. Alternatively or additionally, multiple components (eg, modules or programs) may be integrated into a single component. In this case, the integrated component may perform one or more functions of each component of the plurality of components identically or similarly to those performed by the corresponding component of the plurality of components prior to the integration. . According to various embodiments, operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, or omitted. Alternatively, one or more other operations may be added.

FIG. 2 is a diagram illustrating an unfolded state of an electronic device according to an embodiment of the present disclosure. FIG. 3 is a diagram illustrating a folded state of an electronic device according to an embodiment of the present disclosure.

The configuration of the electronic device 101 of FIGS. 2 and 3 may be partially or entirely the same as the configuration of the electronic device 101 of FIG. 1 .

The embodiments of FIGS. 2 and 3 may be combined with the embodiment of FIG. 1 or the embodiments of FIGS. 4 to 10.

2 and 3, the electronic device 101 includes a housing 202 for accommodating parts of the electronic device 101 (e.g., the hinge structure 280 of FIG. 4), and a housing 202 in the housing 202. It may include a flexible display (hereinafter referred to as display 230) disposed in a space formed by. According to one embodiment, the housing 202 may be referred to as a foldable housing. According to one embodiment, the display 230 may be referred to as a foldable display.

According to one embodiment, the housing 202 may include a first housing 210 and a second housing 220 configured to rotate relative to the first housing 210 .

According to one embodiment, the first housing 210 and/or the second housing 220 may form at least a portion of the exterior of the electronic device 101. According to one embodiment, the surface on which the display 230 is visually exposed is the front of the electronic device 101 and/or the housing 202 (e.g., the first front 210a and the second front 220a). is defined. The opposite side of the front side is defined as the back side (eg, the first back side 210b and the second back side 220b) of the electronic device 101. The side surrounding at least a portion of the space between the front and back sides is defined as the side (eg, first side 210c and second side 220c) of the electronic device 101.

According to one embodiment, the first housing 210 may be rotatably connected to the second housing 220 using a hinge structure (eg, the hinge structure 280 of FIG. 4). For example, the first housing 210 and the second housing 220 may each be rotatably connected to the hinge structure 280 . Accordingly, the electronic device 101 may change to a folded state (eg, FIG. 3) or an unfolded state (eg, FIG. 2). The electronic device 101 may have the first front surface 210a facing the second front surface 220a in a folded state, and the direction toward which the first front surface 210a faces in the unfolded state. may be substantially the same as the direction toward which the second front surface 220a faces. For example, in the unfolded state, the first front surface 210a may be located on substantially the same plane as the second front surface 220a. According to one embodiment, the second housing 220 may provide relative movement with respect to the first housing 210.

According to one embodiment, the first housing 210 and the second housing 220 are disposed on both sides of the folding axis (A) and may have an overall symmetrical shape with respect to the folding axis (A). The first housing 210 and the second housing 220 are configured to form a first housing ( The angle between 210) and the second housing 220 may be changed.

According to one embodiment, the electronic device 101 may include a hinge cover 240. At least a portion of the hinge cover 240 may be disposed between the first housing 210 and the second housing 220. According to one embodiment, the hinge cover 240 is covered by a part of the first housing 210 and the second housing 220, or is exposed to the outside of the electronic device 101, depending on the state of the electronic device 101. may be exposed. According to one embodiment, the hinge cover 240 may protect the hinge structure (eg, the hinge structure 280 of FIG. 4) from external impact of the electronic device 101. According to one embodiment, the hinge cover 240 may be interpreted as a hinge housing for protecting the hinge structure (eg, the hinge structure 280 in FIG. 4).

According to one embodiment, as shown in FIG. 2, when the electronic device 101 is unfolded, the hinge cover 240 is covered by the first housing 210 and the second housing 220. It may not be exposed. As another example, as shown in FIG. 3, when the electronic device 101 is in a folded state (e.g., fully folded state), the hinge cover 240 is connected to the first housing 210 and It may be exposed to the outside between the second housing 220. As another example, when the first housing 210 and the second housing 220 are in an intermediate state folded with a certain angle, the hinge cover 240 is folded with the first housing 210. ) and the second housing 220 may be partially exposed to the outside. However, in this case, the exposed area may be less than in the fully folded state. In one embodiment, the hinge cover 240 may include a curved surface.

According to one embodiment, the display 230 may visually provide information to the outside of the electronic device 101 (eg, a user). The display 230 may include, for example, a hologram device or a projector and a control circuit for controlling the device. According to one embodiment, the display 230 may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of force generated by the touch.

According to one embodiment, the display 230 may refer to a display in which at least some areas can be transformed into a flat or curved surface. For example, the display 230 may be formed to vary in response to the relative movement of the second housing 220 with respect to the first housing 210. According to one embodiment, the display 230 includes a folding area 233, a first display area 231 disposed on one side (e.g. above (+Y direction)) of the folding area 233, and the other side (e.g. : May include a second display area 232 disposed below (-Y direction). According to one embodiment, the folding area 233 may be located above a hinge structure (eg, hinge structure 280 in FIG. 4). For example, at least a portion of the folding region 233 may face the hinge structure 280. According to one embodiment, the first display area 231 may be placed on the first housing 210, and the second display area 232 may be placed on the second housing 220. According to one embodiment, the display 230 may be accommodated in the first housing 210 and the second housing 220.

However, the division of areas of the display 230 shown in FIG. 2 is exemplary, and the display 230 may be divided into a plurality of areas (e.g., four or more or two) depending on the structure or function. .

Additionally, in the embodiment shown in FIG. 2, the area of the display 230 may be divided by the folding area 233 or the folding axis (A-axis) extending parallel to the X-axis, but in another embodiment, the display 230 ) may be divided into regions based on different folding regions (e.g., folding regions parallel to the Y-axis) or different folding axes (e.g., folding axes parallel to the Y-axis). According to one embodiment, the display 230 is coupled to or disposed adjacent to a touch detection circuit, a pressure sensor capable of measuring the intensity (pressure) of touch, and/or a digitizer configured to detect a magnetic field-type stylus pen. It can be.

According to one embodiment, the electronic device 101 may include a rear display 234. The rear display 234 may be arranged to face a different direction from the display 230. For example, the display 230 is visually exposed through the front (e.g., the first front 210a and/or the second front 220a) of the electronic device 101, and the rear display 234 is exposed through the front of the electronic device 101. It may be visually exposed through the rear surface of 101 (eg, the first rear surface 210b).

According to one embodiment, the electronic device 101 may include at least one camera module 204 and 206 and a flash 208. According to one embodiment, the electronic device 101 has a front camera module 204 exposed through the front (e.g., first front 210a) and/or through the rear (e.g., first back 220b). It may include an exposed rear camera module 206. The camera modules 204 and 206 may include one or more lenses, an image sensor, a flash, and/or an image signal processor. Flash 208 may include a light emitting diode or xenon lamp. According to one embodiment, two or more lenses (an infrared camera, a wide-angle lens, and a telephoto lens) and image sensors may be disposed on one side of the electronic device 101. The configuration of the front camera module 204 and/or the rear camera module 206 may be partially or entirely the same as the configuration of the camera module 180 of FIG. 1 .

In the following drawings, a spatial coordinate system is shown for convenience of explanation. The X-axis direction of the spatial coordinate system can be defined and interpreted as the width direction of the electronic device and its components, the Y-axis direction can be defined and interpreted as the length direction of the electronic device and its components, and Z The axial direction can be defined and interpreted as the thickness direction of electronic devices and their components.

Figure 4 is an exploded perspective view of an electronic device according to an embodiment of the present disclosure.

The embodiment of FIG. 4 may be combined with the embodiments of FIGS. 1 to 3 and the embodiments of FIGS. 5 to 10 .

Referring to FIG. 4, the electronic device 201 includes a first housing 210, a second housing 220, a display 230, a hinge cover 240, a battery 250, a printed circuit board 260, and a flexible It may include a printed circuit board 270 and a hinge structure 280. The configuration of the first housing 210, the second housing 220, the display 230, and the hinge cover 240 of FIG. 4 are similar to the first housing 210 and the second housing (210) of FIG. 2 and/or 3. All or part of the configuration of 220), display 230, and hinge cover 240 may be the same.

According to one embodiment, the electronic device 101 may include a first support member 212 and a second support member 222. For example, the first housing 210 may include a first support member 212 and the second housing 220 may include a second support member 222 . According to one embodiment, the first support member 212 and/or the second support member 222 are components of the electronic device 101 (e.g., the display 230, the battery 250, and the printed circuit board 260). )) can be supported.

According to one embodiment, the first support member 212 and/or the second support member 222 may be formed of a metallic material and/or a non-metallic (eg, polymer) material. According to one embodiment, the first support member 212 may be disposed between the display 230 and the battery 250. For example, the display 230 may be coupled to one side of the first support member 212, and the battery 250 and the printed circuit board 260 may be disposed on the other side.

According to one embodiment, the electronic device 101 may include a first protection member 214 and a second protection member 224. For example, the first housing 210 may include a first protective member 214, and the second housing 220 may include a second protective member 224. According to one embodiment, the protection members 214 and 224 may protect the display 230 from external shock. For example, the first protective member 214 surrounds at least a portion of the display 230 (e.g., the first display area 231 in FIG. 2), and the second protective member 224 surrounds the display 230. It may surround at least a part of another part (e.g., the second display area 232 of FIG. 2). According to one embodiment, the first protection member 214 may be referred to as a first protection member, and the second protection member 214 may be referred to as a second protection member.

According to one embodiment, the housings 210 and 220 may include a first rear plate 216 and a second rear plate 226. For example, the first housing 210 includes a first back plate 216 connected to the first support member 212, and the second housing 220 includes a second back plate 216 connected to the second support member 222. It may include a plate 226. According to one embodiment, the rear plates 216 and 226 may form part of the exterior of the electronic device 101. For example, the first back plate 216 forms a first back side (e.g., the first back side 210b in FIGS. 2 and 3), and the second back plate 226 forms a second back side (e.g., FIG. The second rear surface 220b of FIGS. 2 to 3 may be formed. According to one embodiment, a first battery 252, and a first printed circuit board 262 are disposed between the first support member 212 and the first back plate 216, and a second battery 254, And the second printed circuit board 264 may be disposed between the second support member 222 and the second rear plate 226.

According to one embodiment, hinge cover 240 may accommodate at least a portion of hinge structure 280. For example, hinge cover 240 may include a receiving groove 242 for receiving hinge structure 280 . According to one embodiment, hinge cover 240 may be coupled with hinge structure 280. According to one embodiment, when the electronic device 101 is unfolded, at least a portion of the hinge cover 240 may be located between the hinge structure 280 and the housings 210 and 220.

According to one embodiment, the battery 250 is a device for supplying power to at least one component of the electronic device 101 and may include a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. You can. The battery 250 may be placed integrally within the electronic device 101, or may be placed to be detachable from the electronic device 101. According to one embodiment, the battery 250 may include a first battery 252 disposed in the first housing 210 and a second battery 254 disposed in the second housing 220. For example, the first battery 252 may be placed on the first support member 212 and the second battery 254 may be placed on the second support member 222 .

According to one embodiment, the printed circuit board 260 includes a processor (e.g., processor 220 of FIG. 1), memory (e.g., memory 230 of FIG. 1), and/or an interface (e.g., interface of FIG. 1). (277)) can be installed. According to one embodiment, the printed circuit board 260 includes a first printed circuit board 262 disposed within the first housing 210 and a second printed circuit board 264 disposed within the second housing 220. can do.

According to one embodiment, the flexible printed circuit board 270 (FPCB, flexible printed circuit board) includes a component located in the first housing 210 (e.g., a first printed circuit board 262) and a second housing ( Components located at 220 (e.g., second printed circuit board 264) may be electrically connected. According to one embodiment, at least a portion of the flexible printed circuit board 270 may cross the hinge cover 240 and/or the hinge structure 280. For example, a portion of the flexible printed circuit board 270 may be disposed within the first housing 210 and the other portion may be disposed within the second housing 220 . According to one embodiment, the flexible printed circuit board 270 may be connected to an antenna or may be connected to the display 230.

According to one embodiment, the hinge structure 280 may be connected to the first housing 210 and the second housing 220. According to one embodiment, the first housing 210 can rotate relative to the second housing 220 using the hinge structure 280. According to one embodiment, the hinge structure 280 may rotatably connect the first housing 210 and the second housing 220 from a folded state (e.g., FIG. 3) to an unfolded state (e.g., FIG. 2). .

According to one embodiment, the hinge structure 280 may include a plurality of hinge structures 280-1 and 280-2 arranged in parallel. For example, the hinge structure 280 may include a first hinge structure 280-1 and a second hinge structure 280-2 spaced apart from the first hinge structure 280-1. According to one embodiment, the first hinge structure 280-1 and the second hinge structure 280-2 may be symmetrical with respect to the longitudinal direction (eg, Y-axis direction) of the electronic device 101.

According to one embodiment, the first hinge structure 280-1 may connect the first support member 212 and the second support member 222 to be relatively rotatable. According to one embodiment, the first hinge structure 280-1 may include a 1-1 hinge structure 280-11 and a 1-2 hinge structure 280-12. For example, the 1-1 hinge structure 280-11 may be connected to the first support member 212, and the 1-2 hinge structure 280-12 may be connected to the second support member 222. .

According to one embodiment, the second hinge structure 280-2 may connect the first support member 212 and the second support member 222 to be relatively rotatable. According to one embodiment, the second hinge structure 280-2 may be spaced apart from the first hinge structure 280-1. According to one embodiment, the second hinge structure 280-2 may include a 2-1 hinge structure 280-21 and a 2-2 hinge structure 280-22. For example, the 2-1 hinge structure 280-21 may be connected to the first support member 212, and the 2-2 hinge structure 280-22 may be connected to the second support member 222. .

FIG. 5 is a diagram for explaining a housing and a camera decoration member of an electronic device, according to an embodiment of the present disclosure.

The embodiment of FIG. 5 may be combined with the embodiments of FIGS. 1 to 4 or the embodiments of FIGS. 6 to 10.

Referring to FIG. 5, the electronic device 101 (e.g., the electronic device 101 of FIGS. 1 to 4) includes a first housing 210 or a second housing rotatably connected to the first housing 210. It may include (220).

The configuration of the first housing 210 or the second housing 220 in FIG. 5 may be partially or entirely the same as the configuration of the first housing 210 or the second housing 220 in FIG. 4 .

According to one embodiment, the first housing 210 includes a first support member 212 (e.g., the first support member 212 in FIG. 4) and a first rear plate 216 (e.g., the first support member 212 in FIG. 4). 1 rear plate 216), or may include a decoration member 218.

According to one embodiment, the second housing 220 includes a second support member 222 (e.g., the second support member 222 in FIG. 4), or a second rear plate 226 (e.g., the second support member 222 in FIG. 4). It may include a second rear plate 226).

According to one embodiment, at least a portion of the decoration member 218 may be disposed to be exposed (or protrude) from the first rear plate 216. According to one embodiment, the decor member 218 may be defined and referred to as a camera decor member. According to one embodiment, the decoration member 218 may be configured to cover a camera module (eg, the camera module 206 in FIGS. 2 and 3) exposed through the rear of the first housing 210.

According to one embodiment, when the electronic device 101 is placed on the ground 10 (or other flat surface) in an unfolded state (e.g., Figure 2 or Figure 5), the second housing 220 is positioned on the ground 10 ) can be placed parallel to the. Additionally, when the electronic device 101 is placed on the ground 10 in an unfolded state (e.g., Figure 2 or Figure 5), the first housing 210 is positioned relative to the ground 10 due to the decor member 218. It may be arranged obliquely to form a predetermined angle (G). Accordingly, a predetermined space may be formed between the first rear plate 216 and the ground 10.

When an external impact is applied to the first housing 210 of the electronic device 101, the external impact applied to the first housing 210 is caused by the space formed due to the predetermined angle G. The impact can be easily distributed from the part where the impact was applied to (210) to other parts.

When an external shock is applied to the second housing 220 of the electronic device 101, the external shock applied to the second housing 220 is easily distributed from the part where the impact was applied to the second housing 220 to other parts. It can be difficult to become Accordingly, it may be difficult to secure the durability of a portion of the display disposed on the second housing 220 against external shock applied to the second housing 220.

FIG. 6 is a diagram for explaining a heat dissipation sheet and a cushion member of an electronic device according to an embodiment of the present disclosure.

The embodiment of FIG. 6 may be partially or entirely the same as the embodiments of FIGS. 1 to 5 or the embodiments of FIGS. 7 to 10 .

Referring to FIG. 6, the electronic device 101 (e.g., the electronic device 101 of FIGS. 1 to 5) includes a first housing 210 including a first support member 212, a second support member ( 222) may include a second housing 220, at least one heat dissipation sheet 310, a cushion member 320, a first waterproof member 291, or a second waterproof member 292.

The configuration of the first housing 210 including the first support member 212 of FIG. 6 or the second housing 220 including the second support member 222 is the first support member 212 of FIG. 4 ) may be partially or entirely the same as the configuration of the first housing 210 including the first housing 210 or the second housing 220 including the second support member 222.

According to one embodiment, at least one heat dissipation sheet 310 may be disposed on the first housing 210 . For example, at least a portion of the at least one heat dissipation sheet 310 may be disposed between the first support member 212 and the flexible display (eg, the flexible display 230 of FIG. 4).

According to one embodiment, the at least one heat dissipation sheet 310 is a first printed circuit board disposed on the first support member 212 (e.g., the first printed circuit board 262 of FIG. 4), or the first printed circuit board 262 of FIG. It may be configured to receive heat generated from electrical components placed in the housing 210. For example, at least one heat dissipation sheet 310 receives heat generated from the first printed circuit board or electrical components, and directs the received heat in the surface direction of the heat dissipation sheet 310 (e.g., in FIG. 5 It can be spread in the direction of the plane formed by the X and Y axes. According to one embodiment, the at least one heat dissipation sheet 310 may include at least one of a graphite sheet, a copper sheet, or a metal sheet.

According to one embodiment, the cushion member 320 may be disposed on the second housing 220. For example, at least a portion of the cushion member 320 may be disposed between the second support member 222 and the flexible display (eg, the flexible display 230 of FIG. 4).

According to one embodiment, the cushion member 320 may be configured to absorb external shock applied to the second housing 220 or the flexible display (eg, the flexible display 230 of FIG. 4). For example, the cushion member 320 may be a sponge member that is deformed by the external shock and configured to absorb the external shock, but is not limited thereto.

According to one embodiment, the cushion member 320 may be a high-performance CFD (compression force deflection) sponge member or a high-elasticity sponge member. According to one embodiment, the cushion member 320 may have a 25% CFD value (eg, the force required to compress the cushion member 25%) of 0.25Mpa, but is not limited thereto.

According to one embodiment, the cushion member 320 may include a first cushion member 321 or a second cushion member 322.

According to one embodiment, at least a portion of the first cushion member 321 is between a hinge structure (e.g., the hinge structure 280 of FIG. 4) and a flexible display (e.g., the flexible display 230 of FIG. 4). can be placed. For example, at least a portion of the first cushion member 321 may be disposed between the hinge structure and at least a portion of the flexible display (eg, the folding area 233 in FIG. 2 ).

According to one embodiment, the first cushion member 321, when the electronic device 101 is in an unfolded state (e.g., Figure 2 or Figures 7 to 10), at least one heat dissipation sheet 310 and the second It may be disposed between the cushion members 322. According to one embodiment, the first cushion member 321 is connected to a hinge cover (e.g., the hinge cover 240 of FIG. 4) and the second cushion when the electronic device 101 is in a folded state (e.g., FIG. 3). It may also be placed between members 322.

According to one embodiment, at least a portion of the second cushion member 322 may be disposed between the second support member 222 and a flexible display (eg, the flexible display 230 of FIG. 4). For example, at least a portion of the second cushion member 322 may be disposed between the second support member 222 and at least a portion of the flexible display (e.g., the second display area 232 in FIG. 2). there is. The second cushion member 322 is disposed between the first cushion member 321 and the second waterproof member 292 based on the longitudinal direction of the electronic device 101 (e.g., Y-axis direction in FIG. 6). You can.

According to one embodiment, when the electronic device 101 is unfolded (e.g., Figure 2 or Figure 6), the at least one heat dissipation sheet 310 is larger than the first cushion member 321 than the second cushion member 322. ) can be placed close to. According to one embodiment, when the electronic device 101 is unfolded, the first cushion member 321 may be disposed between at least one heat dissipation sheet 310 and the second cushion member 322.

According to one embodiment, the first waterproof member 291 may be disposed between the first housing 210 and a flexible display (eg, the flexible display 230 of FIG. 4). According to one embodiment, the first waterproof member 291 may be disposed between the first support member 212 and the first display area (eg, the first display area 231 in FIG. 2). According to one embodiment, the first waterproof member 291 may include a waterproof tape.

According to one embodiment, the first waterproof member 291 includes the first housing 210 (or the first support member 212) and a flexible display (e.g., the flexible display 230 of FIG. 2 (or the first display) area 231). According to one embodiment, the first waterproof member 291 may include a closed loop shape.

For example, the first waterproof member 291 may include at least one closed curve area 291-1. The first waterproof member 291 may limit the inflow of liquid from the outside of the closed curve area 291-1 to the inside of the closed curve area 291-1. According to one embodiment, the closed curve area 291-1 of the first waterproof member 291 may be defined and referred to as the first waterproof area 291-1.

According to one embodiment, the second waterproof member 292 may be disposed between the first housing 210 and a flexible display (eg, the flexible display 230 of FIG. 4). According to one embodiment, the second waterproof member 292 may be disposed between the first support member 222 and the second display area (eg, the second display area 232 in FIG. 2). According to one embodiment, the second waterproof member 292 may include a waterproof tape.

According to one embodiment, the second waterproof member 292 includes the second housing 220 (or the second support member 222) and a flexible display (e.g., the flexible display 230 of FIG. 2 (or the second display) area 232. According to one embodiment, the second waterproof member 292 may include a closed loop shape.

For example, the second waterproof member 292 may include at least one closed curve area 292-1. The second waterproof member 292 may limit the inflow of liquid from the outside of the closed curve area 292-1 to the inside of the closed curve area 292-1. According to one embodiment, the closed curve area 292-1 of the second waterproof member 292 may be defined and referred to as the second waterproof area 292-1.

7 is a cross-sectional view of an electronic device according to an embodiment of the present disclosure. 8 is a cross-sectional view of an electronic device according to an embodiment of the present disclosure. 9 is a cross-sectional view of an electronic device, according to an embodiment of the present disclosure. 10 is a cross-sectional view of an electronic device according to an embodiment of the present disclosure.

The embodiments of FIGS. 7 to 10 may be combined with the embodiments of FIGS. 1 to 6 .

7 to 10, the electronic device 101 (e.g., the electronic device 101 of FIGS. 1 to 6) includes a first housing 210, a second housing 220, and a flexible display 230. , hinge cover 240, first battery 252, second battery 254, first printed circuit board 262, second printed circuit board 264, second hinge structure 280-2, first It may include a first waterproof member 291, a second waterproof member 292, or a display sheet member 300.

7 to 10, the first housing 210, the second housing 220, the flexible display 230, the second hinge structure 280-2, the first waterproof member 291, or the second waterproof member ( The configuration of 292) includes the first housing 210, second housing 220, flexible display 230, hinge cover 240, second hinge structure 280-2, and first housing 210 of FIGS. 4 to 6. Some or all of the configuration may be the same as that of the waterproof member 291 or the second waterproof member 292.

According to one embodiment, the first housing 210 includes a first support member 212 (e.g., the first support member 212 in FIG. 4) and a first rear plate 216 (e.g., the first support member 212 in FIG. 4). 1 rear plate 216), or a decoration member 218 (eg, the decoration member 218 in FIG. 5).

According to one embodiment, the second housing 220 includes a second support member 222 (e.g., the second support member 222 in FIG. 4), or a second rear plate 226 (e.g., the second support member 222 in FIG. 4). 2 may include a rear plate 226).

According to one embodiment, the electronic device 101 includes a first battery 252 (e.g., the first battery 252 in FIG. 4) disposed on the first support member 212, and a second support member ( 222) may include a second battery 254 (eg, the second battery 254 of FIG. 4) disposed on the battery 222).

According to one embodiment, the electronic device 101 includes a first printed circuit board 262 disposed in a first housing 210 (e.g., the first printed circuit board 262 in FIG. 4) and a second housing. It may include a second printed circuit board 264 disposed within 220 (eg, second printed circuit board 264 in FIG. 4).

According to one embodiment, the electronic device 101 includes a first hinge structure (e.g., the first hinge structure 280-1 in FIG. 4) and a second hinge structure 280-2 (e.g., the first hinge structure 280-2 in FIG. 4). It may include a hinge structure (eg, the hinge structure 280 of FIG. 4) including a second hinge structure 280-2. According to one embodiment, the second hinge structure 280-2 is a 2-1 hinge structure 280-21 connected to the first support member 212, or a second hinge structure 280-21 connected to the second support member 222. -2 may include a hinge structure (280-22).

According to one embodiment, the second hinge structure 280-2 (or the first hinge structure 280-1 of FIG. 4) is attached to the hinge cover 240 (e.g., the hinge cover 240 of FIG. 4). Therefore, it may not be exposed to the outside of the electronic device 101.

According to one embodiment, the electronic device 101 includes a first waterproof member 291 (e.g., the first waterproof member 291 in FIG. 6) or a second waterproof member 292 (e.g., the first waterproof member 291 in FIG. 6). 2 may include a waterproof member 292).

7 to 10, the display sheet member 300 includes at least one heat dissipation sheet 310, a cushion member 320, at least one first adhesive member 330, and at least one cover member 340. ), a second adhesive member 350, or a gap adjustment member 360.

According to one embodiment, the display sheet member 300 may be disposed between the flexible display 230 and the housings 210 and 220. According to one embodiment, the display sheet member 300 may be configured to improve the impact resistance of the flexible display 250 or the heat generation performance of the electronic device 101.

According to one embodiment, the at least one heat dissipation sheet 310 may receive and transfer heat generated from the first printed circuit board 262 or an electrical component disposed on the first printed circuit board 262. The heat may be spread in the direction of the surface of at least one heat dissipation sheet 310 (e.g., the direction of the surface formed by the X and Y axes of FIGS. 7 to 10).

According to one embodiment, at least one heat dissipation sheet 310 (e.g., at least one heat dissipation sheet 310 in FIG. 6) may include a first heat dissipation sheet 311 or a second heat dissipation sheet 312. You can. According to one embodiment, the at least one heat dissipation sheet 310 may include at least one of a graphite sheet, a copper sheet, or a metal sheet.

According to one embodiment, the first heat dissipation sheet 311 and the second heat dissipation sheet 312 may be adhered through the 1-1 adhesive member 331. For example, the first heat dissipation sheet 311 and the second heat dissipation sheet 312 may face each other with the 1-1 adhesive member 331 interposed therebetween.

According to one embodiment, at least a portion of the first heat dissipation sheet 311 may be adhered to at least a portion of the first support member 212 through the 1-2 adhesive member 332 . According to one embodiment, the first heat dissipation sheet 311 has at least a portion of the first support member 212 based on the thickness direction of the electronic device 101 (e.g., the Z-axis direction of FIGS. 7 to 10). ) and the flexible display 230, and the remaining portion may be placed between the 2-1 hinge structure 280-21 and the flexible display 230. According to one embodiment, the remaining portion of the first heat dissipation sheet 311 includes a 1-1 hinge structure (e.g., the 1-1 hinge structure 280-11 of FIG. 4) and the flexible display 230. ) can also be defined as being placed between.

According to one embodiment, at least a portion of the second heat dissipation sheet 312 may be adhered to the first heat dissipation sheet 311 through the 1-1 adhesive member 331. According to one embodiment, the second heat dissipation sheet 312 may be disposed between the first heat dissipation sheet 311 and the flexible display 230. Additionally, at least a portion of the second heat dissipation sheet 312 is aligned with the first support member 212 and the flexible display based on the thickness direction of the electronic device 101 (e.g., the Z-axis direction in FIGS. 7 to 10). It may be placed between 230, and the remaining part may be placed between the 2-1 hinge structure 280-21 and the flexible display 230. According to one embodiment, the remaining portion of the second heat dissipation sheet 312 includes a 1-1 hinge structure (e.g., 1-1 hinge structure 280-11 of FIG. 4) and a flexible display 230. ) can also be defined as being placed between.

According to one embodiment, the thickness of the first heat dissipation sheet 311 (e.g., the thickness in the Z-axis direction of FIGS. 7 to 10) may be about 64 um to about 77 um (micro meter). According to one embodiment, the thickness of the first heat dissipation sheet 311 may be about 70 um (micro meter).

According to one embodiment, the thickness of the second heat dissipation sheet 312 (e.g., the thickness in the Z-axis direction of FIGS. 7 to 10) may be about 64 um to about 77 um (micro meter). According to one embodiment, the thickness of the second heat dissipation sheet 312 may be about 70 um (micro meter).

According to one embodiment, the cushion member 320 (e.g., the cushion member 320 of FIG. 6) may be configured to absorb external shock applied to the second housing 220 or the flexible display 230. For example, the cushion member 320 may be a sponge member that is deformed by the external shock and configured to absorb the external shock, but is not limited thereto.

According to one embodiment, the cushion member 320 is a first cushion member 321 (e.g., the first cushion member 321 in FIG. 6), or a second cushion member 322 (e.g., the first cushion member 321 in FIG. 6). 2 cushion member 322).

According to one embodiment, the first cushion member 321 and the second cushion member 322 may be disposed adjacent to each other. According to one embodiment, the first cushion member 321, when the electronic device 101 is in an unfolded state (e.g., Figure 2 or Figures 7 to 10), at least one heat dissipation sheet 310 and the second It may be disposed between the cushion members 322. According to one embodiment, the second cushion member 322 is, when the electronic device 101 is in an unfolded state (e.g., Figure 2 or Figures 7 to 10), the first cushion member 321 and the second waterproof It may be placed between members 292.

According to one embodiment, at least a portion of the first cushion member 321 may be adhered to at least a portion of the second support member 222 through the 1-4th adhesive member 334. According to one embodiment, the first cushion member 321 has at least a portion of the second support member 222 based on the thickness direction of the electronic device 101 (e.g., the Z-axis direction of FIGS. 7 to 10). ) and the flexible display 230, and the remaining portion may be placed between the 2-2 hinge structure 280-22 and the flexible display 230. According to one embodiment, the remaining portion of the first cushion member 321 includes a 1-2 hinge structure (e.g., the 1-2 hinge structure 280-12 of FIG. 4) and the flexible display 230. ) can also be defined as being placed between.

According to one embodiment, at least a portion of the first cushion member 321 may be adhered to at least a portion of the second support member 222 through the 1-4th adhesive member 334. According to one embodiment, the first cushion member 321 has at least a portion of the second support member 222 based on the thickness direction of the electronic device 101 (e.g., the Z-axis direction of FIGS. 7 to 10). ) and the flexible display 230, and the remaining portion may be placed between the 2-2 hinge structure 280-22 and the flexible display 230. According to one embodiment, the remaining portion of the first cushion member 321 includes a 1-2 hinge structure (e.g., the 1-2 hinge structure 280-12 of FIG. 4) and the flexible display 230. ) can also be defined as being placed between.

According to one embodiment, at least a portion of the second cushion member 321 may be adhered to at least a portion of the second support member 222 through the 1-5 adhesive members 335. According to one embodiment, the second cushion member 321 is aligned with the second support member 222 and the flexible display based on the thickness direction of the electronic device 101 (e.g., the Z-axis direction of FIGS. 7 to 10). It can be placed between (230).

According to one embodiment, when the electronic device 101 is in an unfolded state (e.g., Figure 2 or Figures 7 to 10), the first cushion member 321 is at a first distance L1 from the flexible display 230. ) can be spaced apart. The first distance L1 may be a distance in a first direction (eg, the Z-axis direction in FIGS. 7 to 10). According to one embodiment, the first direction may be defined as the thickness direction of the electronic device 101. The first direction may be defined as a direction from the second rear plate 226 toward the flexible display 230 or the opposite direction.

According to one embodiment, when the electronic device 101 is in an unfolded state (e.g., Figure 2 or Figures 7 to 10), the second cushion member 322 is at a second distance L2 from the flexible display 230. ) can be spaced apart. The second distance L2 may be a distance in the first direction. According to one embodiment, the second distance L2 may be smaller (or shorter) than the first distance L1.

According to one embodiment, when the electronic device 101 is in an unfolded state (e.g., Figure 2 or Figures 7 to 10), the first thickness (which is the thickness of the first cushion member 321 in the first direction) H1) may be smaller (or thinner) than the second thickness H2, which is the thickness of the second cushion member 322 in the first direction.

According to one embodiment, the first cushion member 321 or the second cushion member 322 may absorb external shock applied to the second housing 220 or the flexible display 230. Accordingly, the impact resistance of the second housing 220 or the flexible display 230 may be improved. In addition, by appropriately dispersing external shock applied to at least one part of the flexible display 230, the occurrence of cracks or damage in the portion of the flexible display 230 where the impact was applied can be reduced.

According to one embodiment, at least one first adhesive member 330 may adhere components of the display sheet member 300 to other components. According to one embodiment, the at least one first adhesive member 330 may include at least one of pressure sensitive adhesive (PSA), optical clear adhesive (OCA), heat-reactive adhesive, general adhesive, or double-sided tape.

According to one embodiment, the at least one first adhesive member 330 includes a 1-1 adhesive member 331, a 1-2 adhesive member 332, a 1-3 adhesive member 333, and a first adhesive member 331. It may include -4 adhesive members 334, or 1-5 adhesive members 335.

According to one embodiment, at least one cover member 340 may be a tape made of polyethylene terephthalate (PET). According to one embodiment, the at least one cover member 340 includes a first cover member 341, a second cover member 342, a third cover member 343, a fourth cover member 344, and a fifth cover member 344. It may include a cover member 345 or a sixth cover member 346.

According to one embodiment, the 1-1 adhesive member 331 may be disposed between the first heat dissipation sheet 331 and the second heat dissipation sheet 332. For example, the 1-1 adhesive member 331 may adhere the first heat dissipation sheet 331 and the second heat dissipation sheet 332.

According to one embodiment, the thickness of the 1-1 adhesive member 331 (e.g., the thickness in the Z-axis direction of FIGS. 7 to 10) may be about 9 um to about 11 um (micro meter). According to one embodiment, the thickness of the 1-1 adhesive member 331 may be about 10 um (micro meter).

According to one embodiment, the thickness of the structure in which the first heat dissipation sheet 311, the 1-1 adhesive member 331, and the second heat dissipation sheet 312 are stacked (e.g., the Z-axis direction in FIGS. 7 to 10 The thickness) may be about 150 um (micro meter). According to one embodiment, the thickness of the first heat dissipation sheet 311 and the second heat dissipation sheet 312 may be substantially the same.

According to one embodiment, the 1-2 adhesive member 332 may adhere at least a portion of the first heat dissipation sheet 311 and at least a portion of the first support member 212. According to one embodiment, a portion of the 1-2 adhesive member 332 that is not in contact with the first support member 212 may be covered by the first cover member 341.

According to one embodiment, the first cover member 341 may be arranged to cover a portion of the 1-2 adhesive member 332 facing the 2-1 hinge structure 280-21.

According to one embodiment, the second cover member 342 may be adhered to one surface (eg, the surface facing the +Z direction in FIGS. 7 to 10) of the second heat dissipation sheet 312.

According to one embodiment, the first-third adhesive member 333 may be adhered to at least a portion of the second cover member 342. The 1-3 adhesive member 333 is positioned to overlap the 1-2 adhesive member 332 based on the thickness direction of the electronic device 101 (e.g., Z-axis direction in FIGS. 7 to 10). You can.

According to one embodiment, the third cover member 343 may be adhered to one surface (eg, the surface facing the +Z direction in FIGS. 7 to 10) of the 1-3 adhesive member 333. According to one embodiment, the third cover member 343 may face at least a portion of the flexible display 230.

According to one embodiment, the 1-4th adhesive member 334 may adhere at least a portion of the first cushion member 321 and at least a portion of the second support member 222. According to one embodiment, the portion of the first-fourth adhesive member 334 that is not in contact with the second support member 222 may be covered by the fourth cover member 344.

According to one embodiment, the fourth cover member 344 may be arranged to cover a portion of the 1-4 adhesive member 334 facing the 2-2 hinge structure 280-22.

According to one embodiment, the second adhesive member 350 is connected to at least one portion of one surface of the first cushion member 321 (e.g., the surface facing the +Z direction in FIG. 7) and at least one portion of the flexible display 230. Parts can be glued together. According to one embodiment, the second adhesive member 350 may include at least one of pressure sensitive adhesive (PSA), optical clear adhesive (OCA), heat-reactive adhesive, general adhesive, or double-sided tape.

According to one embodiment, the second adhesive member 350 may be adhered to at least a portion of the flexible display 230. According to one embodiment, the second adhesive member 350 can reduce the occurrence of wrinkles in the flexible display 230 by directly supporting at least one portion of the flexible display 230. For example, the second adhesive member 350 can reduce the occurrence of wrinkles in a portion of the flexible display 230 disposed on the second housing 220.

According to one embodiment, the second adhesive member 350 is connected to the flexible display 230 and the second support member based on the thickness direction of the electronic device 101 (e.g., the Z-axis direction of FIGS. 7 to 10). It can be placed between (222).

According to one embodiment, the thickness of the second adhesive member 350 (e.g., the thickness in the Z-axis direction of FIGS. 7 to 10) is the separation distance between the flexible display 230 and the first cushion member 321. It may be substantially the same as the first distance L1.

According to one embodiment, the gap adjustment member 360 may be disposed on at least one portion of one surface (eg, the surface facing the +Z direction in FIGS. 7 to 10) of the first cushion member 321.

According to one embodiment, the gap adjustment member 360 may be a tape made of polyethylene terephthalate (PET). According to one embodiment, the gap adjustment member 360 occupies at least a portion of the empty space between the flexible display 230 and a portion of the first cushion member 321 where the second adhesive member 350 is not disposed. It can be configured to do so. According to one embodiment, the gap adjustment member 360 may be configured to cover the empty space between the flexible display 230 and the first cushion member 321.

According to one embodiment, the gap adjustment member 360 is connected to the flexible display 230 and the 2-2 hinge based on the thickness direction of the electronic device 101 (e.g., the Z-axis direction of FIGS. 7 to 10). It may be placed between structures 280-22.

According to one embodiment, the fifth cover member 345 may be adhered to one surface (eg, the surface facing the +Z direction in FIGS. 7 to 10) of the gap adjustment member 360. According to one embodiment, the fifth cover member 345 may face at least a portion of the flexible display 230.

According to one embodiment, the sixth cover member 346 may be adhered to one surface (eg, the surface facing the +Z direction in FIGS. 7 to 10) of the second cushion member 322. According to one embodiment, the sixth cover member 346 may face at least a portion of the flexible display 230.

Referring to FIG. 7, the first cushion member 321 and the second cushion member 322 may be formed as separate cushion members. The first cushion member 321 and the second cushion member 322 may be disposed adjacent to each other.

Referring to FIG. 8, the first cushion member 3211 (e.g., the first cushion member 321 in FIG. 7) and the second cushion member 3221 (e.g., the second cushion member 322 in FIG. 7) are , may be formed integrally.

Referring to FIG. 9 , the display sheet member 300 may further include a third adhesive member 370.

According to one embodiment, the third adhesive member 370 is connected to at least one part of one surface of the second cover member 342 (e.g., the surface facing the +Z direction in FIG. 9) and at least one part of the flexible display 230. Parts can be glued together. According to one embodiment, the third adhesive member 370 may include at least one of pressure sensitive adhesive (PSA), optical clear adhesive (OCA), heat-reactive adhesive, general adhesive, or double-sided tape.

According to one embodiment, the third adhesive member 370 may be adhered to at least a portion of the flexible display 230. According to one embodiment, the third adhesive member 370 can reduce the occurrence of wrinkles in the flexible display 230 by directly supporting at least one portion of the flexible display 230. For example, the third adhesive member 370 can reduce the occurrence of wrinkles in a portion of the flexible display 230 disposed on the first housing 210.

Referring to FIG. 10, the display sheet member 300 may further include a film layer 380.

According to one embodiment, the 1-1 adhesive member 331 may include a first adhesive layer 3311 and a second adhesive layer 3312. For example, the first adhesive layer 3311 is adhered to the side of the first heat dissipation sheet 311 facing the second heat dissipation sheet 312 (e.g., the side facing the +Z direction in FIG. 10), and 2 The adhesive layer 3312 may be adhered to the side of the second heat dissipation sheet 312 that faces the first heat dissipation sheet 311 (eg, the side facing the -Z direction in FIG. 10).

According to one embodiment, the film layer 380 may be disposed between the first adhesive layer 3311 and the second adhesive layer 3312. For example, the film layer 380 may be adhered to the first adhesive layer 3311 and the second adhesive layer 3312.

According to one embodiment, the film layer 380 may be a polyimide film. According to one embodiment, the film layer 380 is disposed between the first heat dissipation sheet 311 and the second heat dissipation sheet 312, thereby transferring the heat from the first heat dissipation sheet 311 to the second heat dissipation sheet 312. It can alleviate the shock that is transmitted or vice versa.

Electronic devices (eg, portable terminals) include displays that are flat or have a flat and curved surface. Electronic devices including existing types of displays may require another terminal when implementing a screen larger than the size of the electronic device due to the fixed display structure. Accordingly, electronic devices including foldable or rollable displays are being studied.

An electronic device may include a plurality of housings, and the required heat generation performance or impact resistance of the housings may be different due to the structure of the plurality of housings or components disposed inside each housing.

According to an embodiment of the present disclosure, a flexible display with improved impact resistance and heat dissipation performance and an electronic device including the same can be provided.

However, the problems to be solved by the present disclosure are not limited to the above-mentioned problems, and may be determined in various ways without departing from the spirit and scope of the present disclosure.

According to an embodiment of the present disclosure, a flexible display that reduces damage to the flexible display from external impact and an electronic device including the same can be provided.

The effects that can be obtained from the present disclosure are not limited to the effects mentioned above, and other effects not mentioned can be clearly understood by those skilled in the art from the description below. will be.

According to an embodiment of the present disclosure, an electronic device (e.g., the electronic device 101 of FIG. 1 or the electronic device 101 of FIGS. 2 to 10) includes a housing (e.g., the housing 202 of FIG. 2). , a hinge structure (e.g., the hinge structure 280 of FIG. 4), a flexible display (e.g., the flexible display 230 of FIG. 4), or the flexible display 230 of FIGS. 7 to 10), and at least one heat dissipation sheet. (eg, at least one heat dissipation sheet 310 of FIGS. 6 to 10), or a cushion member (eg, the cushion member 320 of FIGS. 6 to 10). The housing may include a first housing (e.g., the first housing 210 in FIGS. 2 to 10) or a second housing (e.g., the second housing 220 in FIGS. 2 to 10). The hinge structure may rotatably connect the first housing and the second housing. The flexible display may be placed on the housing. The at least one heat dissipation sheet may be disposed between the first housing and the flexible display. The cushion member may be disposed between the second housing and the flexible display. The cushion member may include a first cushion member (e.g., the first cushion member 321 in FIGS. 6 to 10) or a second cushion member (e.g., the second cushion member 322 in FIGS. 6 to 10). It can be included. At least one portion of the first cushion member may be disposed between at least one portion of the hinge structure and the flexible display. The first cushion member may be spaced apart from the flexible display by a first distance (eg, the first distance L1 in FIGS. 7 to 9). The second cushion member may be disposed adjacent to the first cushion member. The second cushion member may be spaced apart from the flexible display by a second distance smaller than the first distance (eg, the second distance L2 in FIGS. 7 to 9).

According to one embodiment, the first cushion member may be disposed between the at least one heat dissipation sheet and the second cushion member when the electronic device is in an unfolded state.

According to one embodiment, the thickness of the first cushion member (e.g., the first thickness H1 in FIGS. 7 to 9) is the thickness of the second cushion member (e.g., the second thickness in FIGS. 7 to 9). It may be smaller than (H2)).

According to one embodiment, the electronic device may further include a gap adjustment member (eg, the gap adjustment member 360 of FIGS. 7 to 9). The gap adjustment member may be attached to at least a portion of the first cushion member. The gap adjustment member may face at least a portion of the flexible display.

According to one embodiment, the first cushion member (e.g., the first cushion member 3211 in FIG. 8) and the second cushion member (e.g., the second cushion member 3221 in FIG. 8) are formed integrally. It can be.

According to one embodiment, the at least one heat dissipation sheet may be a first heat dissipation sheet (e.g., the first heat dissipation sheet 311 of FIGS. 7 to 10) or a second heat dissipation sheet (e.g., the first heat dissipation sheet 311 of FIGS. 7 to 10). It may include a second heat dissipation sheet 312). The second heat dissipation sheet may be spaced apart from the first heat dissipation sheet. The second heat dissipation sheet may have a thickness that is substantially the same as the thickness of the first heat dissipation sheet.

According to one embodiment, the electronic device may further include a first adhesive member (eg, the 1-1 adhesive member 331 of FIGS. 6 to 10). The first adhesive member may be disposed between the first heat dissipation sheet and the second heat dissipation sheet. The first adhesive member may be configured to adhere the first heat dissipation sheet and the second heat dissipation sheet.

According to one embodiment, the first adhesive member may include pressure sensitive adhesive (PSA).

According to one embodiment, the first adhesive member may include a first adhesive layer (e.g., the first adhesive layer 3311 in FIG. 10) or a second adhesive layer (e.g., the second adhesive layer 3312 in FIG. 10). You can. The first adhesive layer may be disposed on a side of the first heat dissipation sheet facing the second heat dissipation sheet. The second adhesive layer may be disposed on a side of the second heat dissipation sheet facing the first heat dissipation sheet. The electronic device may further include a film layer (eg, film layer 380 in FIG. 10). The film layer may be disposed between the first adhesive layer and the second adhesive layer.

According to one embodiment, the film layer may be a polyimide film.

According to one embodiment, the electronic device may further include a second adhesive member (eg, the second adhesive member 350 of FIGS. 7 to 10). The second adhesive member may be disposed between the first cushion member and the flexible display. The second adhesive member may further include a second adhesive member configured to adhere the first cushion member and at least a portion of the flexible display.

According to one embodiment, the second adhesive member may include pressure sensitive adhesive (PSA).

According to one embodiment, the thickness of the second adhesive member may be substantially equal to the first distance.

According to one embodiment, the electronic device may further include at least one cover member (eg, the second cover member 342 of FIGS. 7 to 10). The at least one cover member may be disposed on at least a portion of the at least one heat dissipation sheet.

According to one embodiment, the electronic device may further include a third adhesive member (eg, the third adhesive member 370 of FIG. 9). The third adhesive member may be disposed between the at least one cover member and the flexible display. The third adhesive member may be configured to adhere the at least one cover member and at least a portion of the flexible display.

According to an embodiment of the present disclosure, an electronic device (e.g., the electronic device 101 of FIG. 1 or the electronic device 101 of FIGS. 2 to 10) includes a housing (e.g., the housing 202 of FIG. 2). , a hinge structure (e.g., the hinge structure 280 of FIG. 4), a flexible display (e.g., the flexible display 230 of FIG. 4), or the flexible display 230 of FIGS. 7 to 10), and at least one heat dissipation sheet. (eg, at least one heat dissipation sheet 310 of FIGS. 6 to 10), or a cushion member (eg, the cushion member 320 of FIGS. 6 to 10). The housing may include a first housing (e.g., the first housing 210 in FIGS. 2 to 10) or a second housing (e.g., the second housing 220 in FIGS. 2 to 10). The hinge structure may rotatably connect the first housing and the second housing. The flexible display may be placed on the housing. The at least one heat dissipation sheet may be disposed between the first housing and the flexible display. The cushion member may be disposed between the second housing and the flexible display. The cushion member may include a first cushion member (e.g., the first cushion member 321 in FIGS. 6 to 10) or a second cushion member (e.g., the second cushion member 322 in FIGS. 6 to 10). It can be included. At least one portion of the first cushion member may be disposed between at least one portion of the hinge structure and the flexible display. The first cushion member may have a first thickness (eg, first thickness H1 in FIGS. 7 to 9) in a first direction (eg, Z-axis direction in FIGS. 7 to 10). The second cushion member may be disposed adjacent to the first cushion member. The second cushion member may have a second thickness greater than the first thickness in the first direction (eg, the second thickness H2 in FIGS. 7 to 9).

According to one embodiment, the electronic device includes a first printed circuit board (e.g., the first printed circuit board 262 of FIG. 4, or the first printed circuit board 262 of FIGS. 7 to 10), or It may include two printed circuit boards (eg, the second printed circuit board 264 in FIG. 4 or the second printed circuit board 264 in FIGS. 7 to 9). The first printed circuit board may be disposed in the first housing. The second printed circuit board may be disposed in the second housing.

According to one embodiment, the at least one heat dissipation sheet may be a first heat dissipation sheet (e.g., the first heat dissipation sheet 311 in FIGS. 7 to 10) or a second heat dissipation sheet (e.g., the first heat dissipation sheet 311 in FIGS. 7 to 10). It may include a second heat dissipation sheet 312). The second heat dissipation sheet may be spaced apart from the first heat dissipation sheet. The second heat dissipation sheet may have a thickness that is substantially the same as the thickness of the first heat dissipation sheet.

According to one embodiment, the electronic device may further include a first adhesive member (eg, the 1-1 adhesive member 331 of FIGS. 6 to 10). The first adhesive member may be disposed between the first heat dissipation sheet and the second heat dissipation sheet. The first adhesive member may be configured to adhere the first heat dissipation sheet and the second heat dissipation sheet.

According to one embodiment, the electronic device may further include a second adhesive member (eg, the second adhesive member 350 of FIGS. 7 to 10). The second adhesive member may be disposed between the first cushion member and the flexible display. The second adhesive member may further include a second adhesive member configured to adhere the first cushion member and at least a portion of the flexible display.

Above, in the detailed description of this document, specific embodiments have been described, but it will be obvious to those skilled in the art that various modifications are possible without departing from the scope of this document.

101: Electronic devices
202: housing
210: first housing
220: second housing
230: Flexible display
310: At least one heat dissipation sheet
320: Cushion member
321: first cushion member
322: second cushion member

Claims (20)

In the electronic device (101;),
a housing 202; including a first housing 210; and a second housing 220;
a hinge structure (280;) rotatably connecting the first housing and the second housing;
a flexible display (230;) disposed on the housing;
at least one heat dissipation sheet (310;) disposed between the first housing and the flexible display; and
It includes a cushion member (320;) disposed between the second housing and the flexible display,
The cushion member is,
a first cushion member (321;), at least a portion of which is disposed between at least a portion of the hinge structure and the flexible display, and is spaced apart from the flexible display by a first distance (L1;); and
An electronic device comprising a second cushion member (322;) disposed adjacent to the first cushion member and spaced apart from the flexible display by a second distance (L2;) that is smaller than the first distance.
According to claim 1,
The first cushion member,
An electronic device disposed between the at least one heat dissipation sheet and the second cushion member when the electronic device is in an unfolded state.
The method according to any one of claims 1 to 2,
The thickness (H1;) of the first cushion member is,
An electronic device smaller than the thickness (H2;) of the second cushion member.
According to any one of claims 1 to 3,
The electronic device further includes a gap adjustment member (360) attached to at least a portion of the first cushion member and facing at least a portion of the flexible display.
According to any one of claims 1 to 4,
The first cushion member (3211;) and the second cushion member (3221;),
An electronic device formed in one piece.
According to any one of claims 1 to 5,
The at least one heat dissipation sheet,
first heat dissipation sheet (311;); and
An electronic device comprising a second heat dissipation sheet (312;) that is spaced apart from the first heat dissipation sheet and has a thickness substantially equal to the thickness of the first heat dissipation sheet.
The method according to any one of claims 1 to 6,
The electronic device further includes a first adhesive member (331;) disposed between the first heat dissipation sheet and the second heat dissipation sheet and configured to adhere the first heat dissipation sheet and the second heat dissipation sheet.
The method according to any one of claims 1 to 7,
The first adhesive member is,
Electronic devices containing pressure sensitive adhesive (PSA).
The method according to any one of claims 1 to 8,
The first adhesive member is,
a first adhesive layer (3311;) disposed on a side of the first heat dissipation sheet facing the second heat dissipation sheet; and
It includes a second adhesive layer (3312;) disposed on a side of the second heat dissipation sheet facing the first heat dissipation sheet,
The electronic device further includes a film layer (380;) disposed between the first adhesive layer and the second adhesive layer.
The method according to any one of claims 1 to 9,
The film layer is,
Electronic devices made of polyimide film.
The method according to any one of claims 1 to 10,
The electronic device further includes a second adhesive member (350;) disposed between the first cushion member and the flexible display and configured to adhere at least a portion of the first cushion member and the flexible display.
The method according to any one of claims 1 to 11,
The second adhesive member is,
Electronic devices containing pressure sensitive adhesive (PSA).
The method according to any one of claims 1 to 12,
The thickness of the second adhesive member is,
An electronic device substantially equal to the first distance.
The method according to any one of claims 1 to 13,
The electronic device further includes at least one cover member (342;) disposed on at least a portion of the at least one heat dissipation sheet.
The method according to any one of claims 1 to 14,
The electronic device further includes a third adhesive member (370;) disposed between the at least one cover member and the flexible display, and configured to adhere the at least one cover member to at least a portion of the flexible display.
In the electronic device (101;),
a housing 202; including a first housing 210; and a second housing 220;
a hinge structure (280;) rotatably connecting the first housing and the second housing;
a flexible display (230;) disposed on the housing;
at least one heat dissipation sheet (310;) disposed between the first housing and the flexible display; and
It includes a cushion member (320;) disposed between the second housing and the flexible display,
The cushion member is,
a first cushion member (321;), at least a portion of which is disposed between at least a portion of the hinge structure and the flexible display, and has a first thickness (H1;) in a first direction; and
An electronic device comprising a second cushion member (322;) disposed adjacent to the first cushion member and having a second thickness (H2;) greater than the first thickness in the first direction.
According to claim 16,
a first printed circuit board (262;) disposed in the first housing; and
An electronic device further comprising a second printed circuit board (264;) disposed in the second housing.
The method according to any one of claims 16 to 17,
The at least one heat dissipation sheet,
First heat dissipation sheet (311;); and
An electronic device comprising a second heat dissipation sheet (312;) that is spaced apart from the first heat dissipation sheet and has a thickness substantially equal to the thickness of the first heat dissipation sheet.
The method according to any one of claims 16 to 18,
The electronic device further includes a first adhesive member (331;) disposed between the first heat dissipation sheet and the second heat dissipation sheet and configured to adhere the first heat dissipation sheet and the second heat dissipation sheet.
The method according to any one of claims 16 to 19,
The electronic device further includes a second adhesive member (350;) disposed between the first cushion member and the flexible display and configured to adhere at least a portion of the first cushion member and the flexible display.

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