RU2781814C1 - Camera assembly and electronic apparatus - Google Patents

Abstract

FIELD: photography.

SUBSTANCE: invention relates to electronic image capture apparatus. The result is achieved by providing avoidance space on the printed circuit board. The time-of-flight module includes the individually assembled transmitting module and receiving module. The transmitting module is configured to emit an optical detection signal. The receiving module is configured to receive an optical induction signal formed after the optical detection signal being reflected by the object of measuring. The receiving module is located in the avoidance space. The connecting end of the receiving module is attached to the printed circuit board. The electronic imaging apparatus herein additionally comprises a camera bracket located in a hole or a groove, the camera bracket comprises a receiving groove, the receiving module is accepted into the receiving groove, and the receiving module reuses part or all of the thickness of the printed circuit board.

EFFECT: ensured unification of the design of the camera assembly including a time-of-flight module and a printed circuit board.

18 cl, 17 dwg

Description

[0001] The present application claims priority based on Chinese Patent Application No. 201811584395.9 filed with the National Intellectual Property Office of China on December 24, 2018, entitled "CAMERA AND ELECTRONIC DEVICE UNIT", which is hereby incorporated by reference in its entirety.

FIELD OF TECHNOLOGY TO WHICH THE INVENTION RELATES

[0002] The present application relates to the field of electronic product technology, and in particular to a camera assembly and an electronic device that uses a camera assembly.

BACKGROUND OF THE INVENTION

[0003] The main component of the electronic devices for realizing the imaging function is the camera module. The time of flight (TOF) module is a conventional depth camera module and may be configured to measure depth of field information. The TOF module includes a transmitter module and a receiver module. In order to be effective in detecting a TOF module, the transmitter module and the receiver module typically need to be close enough that the area of overlap between the transmitter module's field of view and the receiver module's field of view is relatively large. In the conventional TOF module, the transmitter module and the receiver module are attached to the same printed circuit board in order to satisfy the proximity requirement of the transmitter module and the receiver module. Thus, since the relative position of the transmitter module and the receiver module is fixed, and the PCB cable exit direction is fixed, the location of the interactive hole that directly faces the transmitter module and the receiver module, and which is on the cover plate of the cover/cover surface) of the electronic device , to which the time-of-flight module is attached, is also fixed. Therefore, the TOF module can only be applied to electronic devices that have a certain shape of appearance, but is hardly applicable to electronic devices that have other shapes of appearance, and such applicability is unsatisfactory.

DISCLOSURE OF THE INVENTION

[0004] Embodiments of the present invention provide a widely applicable camera assembly and an electronic device that uses a camera assembly.

[0005] According to a first aspect, an embodiment of the present invention provides a camera assembly including a TOF module and a circuit board. Avoidance space is provided on the PCB. The TOF module includes a transmitter module and a receiver module. The transmitting module is configured to emit an optical detection signal. The receiving module is configured to receive an optical induction signal generated after reflection of the optical detection signal from the object to be measured. The optical induction signal conveys information about the depth of field of the object to be measured. The receiving module may be a camera module. The receiving module and the transmitting module are individually assembled. The receiving module is located in the avoidance space, and the connecting end of the receiving module is attached to the circuit board. The receiver module is electrically connected to the printed circuit board through the connecting end. The transmitter module is located around the receiver module and attached to the printed circuit board.

[0006] In this embodiment, the receiving module and the transmitting module are individually assembled. The receiving module has a receiving field of view and a receiving axis, and the receiving axis is the central axis of the receiving field of view. The transmitting module has a transmitting field of view and a transmitting axis, and the transmitting axis is the central axis of the transmitting field of view. Since the receiving module is located in the avoidance space, and the connecting end of the receiving module is attached to the circuit board, the receiving module and the transmitting module can be close to each other, so that the distance between the receiving axis and the transmitting axis is small enough, and the coverage between the receiving field of view and transmitting field of view is large to meet the performance requirements of the TOF module. In addition, the receiving module and the transmitting module are individually assembled, and there is no direct mounting or direct connection between the receiving module and the transmitting module. Therefore, the transmitting module and the receiving module are arranged more flexibly, and a plurality of arrangement structures can be formed, so that the electronic devices in which the camera assembly is applied can have a plurality of appearances. In other words, the camera assembly can be applied to a variety of electronic devices that have different appearance shapes. The camera assembly is widely applicable. Since electronic devices that have many different appearance shapes can use the same camera assembly, it is not necessary to repeatedly design different shape TOF modules based on different appearance shapes, thereby reducing the development and production costs of electronic devices.

[0007] The avoidance space may be a through hole or slot located on the printed circuit board. The receiving unit is located in the avoidance space so that the receiving unit can reuse part or all of the PCB thickness space, the camera unit is made more compact, and the size of the camera unit in the Z thickness direction of the electronic device is smaller.

[0008] In one implementation, the camera assembly further includes one or more camera modules. The camera module can be a color lens, a black and white lens, a wide angle lens, or a zoom lens. One or more camera modules are located in the avoidance space, and the connecting ends of the one or more camera modules are attached to the circuit board. One or more camera modules may work in conjunction with the TOF module to improve the performance of the electronic device. For example, when an image captured by the TOF is combined with an image captured by a colored lens, a three-dimensional profile of the object to be measured can be graphically represented in which different colors represent different distances. This embodiment of the invention will be described using an example in which the camera assembly includes one camera module.

[0009] In one embodiment of the invention, the camera assembly further includes a camera bracket located in the avoidance space. The camera bracket has a plurality of receiving slots spaced apart from each other. The opening directions of the plurality of receiving slots are the same. The receiving module and one or more camera modules are received in a plurality of receiving slots in a one-to-one manner. The receiver module and one or more camera modules are located at a distance from each other to avoid collision and damage due to accidental impact.

[0010] In this embodiment, the receiving module and one or more camera modules are received in a plurality of receiving slots of the camera assembly and fixed against the camera bracket. The camera bracket is located in the avoidance space such that the receiver module and one or more camera modules are located in the avoidance space. The receiver module, one or more camera modules, and the camera bracket can achieve modularity through a separate assembly process before the overall camera assembly assembly process is performed, thereby simplifying the steps of the overall camera assembly assembly process and reducing assembly complexity.

[0011] The receiving module and one or more camera modules may be adhesively attached to the bottom walls of the plurality of receiving slots via an adhesive member to mount against the camera bracket. The camera bracket can be made of a material with high thermal conductivity, such as copper, aluminum foil, stainless steel, or other metal material. The adhesive element may be doped with thermally conductive particles (eg, graphite particles or metal particles) or made from a thermally conductive adhesive material.

[0012] In this embodiment, heat radiated from the receiver module and one or more camera modules can be conducted to the camera arm through the adhesive member, and heat is removed through the camera arm to ensure reliable operation of the camera assembly.

[0013] The camera bracket further has a plurality of connection recesses. The plurality of connection recesses communicate with the plurality of receiving grooves on the outside of the camera bracket in a one-to-one manner. The connecting end of the receiving module and the connecting ends of one or more camera modules extend from the plurality of receiving slots through the plurality of connecting recesses in a one-to-one manner to be attached to the printed circuit board.

[0014] In one implementation, the camera assembly further includes a mounting bracket. The printed circuit board is attached to the mounting bracket. The printed circuit board can be attached to the mounting bracket with a retainer. For example, the mounting bracket includes a first surface and a second surface that are opposite each other. The mounting bracket has a mounting lug and a mounting hole. The mounting protrusion protrudes from the first surface. The mounting hole is recessed from the top surface of the mounting lug, and which is from the first surface in a direction close to the second surface. The printed circuit board may abut against the top surface of the mounting tab. The connection hole corresponding to the mounting hole is located on the PCB. The retainer passes through the connection hole and extends into the mounting hole so that the PCB is tightly attached to the mounting bracket. The retainer, the connection hole structure, and the mounting hole structure form a fastening structure. A plurality of groups of fastening structures can be formed between the printed circuit board and the mounting bracket. A plurality of fastening structure groups can be scattered around the peripheral area of the printed circuit board, so that the printed circuit board is more stably attached to the fastening bracket.

[0015] The mounting bracket has a mounting groove. The mounting groove is recessed from the first surface in a direction close to the second surface. The camera bracket is attached to the mounting slot. The bottom surface of the camera bracket, facing away from the receiving slot, can abut against the bottom wall of the mounting slot to achieve a mutual position between them. A concave-convex matching structure can be located between the bottom wall of the mounting slot and the bottom surface of the camera bracket. For example, a protruding convex block may be located on the bottom wall of the mounting slot. A concave groove may be provided on the bottom surface of the camera bracket. The convex block continues into the groove so that the camera bracket locks against the mounting bracket. In another embodiment of the invention, the slot is located on the bottom wall of the mounting slot and the convex block is located on the bottom surface of the camera bracket. The convex block continues into the groove so that the camera bracket locks against the mounting bracket.

[0016] In this embodiment, since the PCB is attached to the mounting bracket and the camera bracket is also attached to the mounting bracket, the relationship between the circuit board and the camera bracket is achieved by using the mounting bracket, so that the relationship between the receiver module installed on the camera bracket, and the transmitting unit attached to the circuit board are achieved, and the relative position between the transmitting field of view and the receiving field of view is stable. Thus, reliable operation of the TOF module and relatively good performance of the camera assembly assembly can be ensured.

[0017] In one implementation, the camera assembly further includes a decorative portion. The decorative part is located on one side of the receiving module, which receives the optical induction signal. The decorative part includes a decorative ring and a protective plate. The decorative ring has an upper and lower surface located opposite each other. On the upper surface of the decorative ring there is a recessed restrictive groove. The protective plate is installed in the restrictive groove and abuts against the bottom wall of the restrictive groove. A plurality of mounting spaces are provided in the decorative part. A plurality of mounting spaces are provided in the decorative ring. The mounting spaces communicate with a restrictive groove on the underside of the decorative ring.

[0018] The receiver module and one or more camera modules are received in a plurality of mounting spaces. The receiving module and one or more camera modules are received in different mounting spaces in a one-to-one manner. The transmitter module is located around the decorative part. In other words, the receiving module and one or more camera modules are located inside the decorative part and surrounded by the decorative part, and the transmitting module is located outside the decorative part.

[0019] In this embodiment, since the transmitter module and the receiver module can be individually assembled and the relationship between them can be flexible, the decorative part can be used to decorate the receiver module and one or more camera modules, and no longer surround the transmitter module. , so that the decorative portion, the receiving module, one or more camera modules, and the transmitting module are arranged in a more diverse manner.

[0020] Since a part of the decorative part extends beyond the electronic device, and the receiving module and one or more camera modules that are decorated with the decorative part are similar or even similar in appearance, the decorative part, the receiving module, and one or more camera modules can be basically symmetrically distributed on the electronic device, so that the electronic device has a harmonious appearance and is more aesthetically pleasing. The decorative part can also prevent problems such as reduced structural strength and easy deformation caused by excessively large volume due to an excessively large number of devices that need to be surrounded.

[0021] In an implementation, the receiving module and one or more camera modules are located in the first direction, the receiving module and the transmitting module are located in the second direction, and the second direction is the same as the first direction, or the second direction is perpendicular to the first direction. For example, the first direction and the second direction are the width directions of the electronic device or the length directions of the electronic device. Alternatively, one of the first direction and the second direction is the width direction of the electronic device, and the other is the length direction of the electronic device.

[0022] In this embodiment, the receiving module, one or more camera modules, and the transmitting module are arranged in a variety of ways so that the electronic device can have various appearance forms with high flexibility.

[0023] The direction of extension (that is, the direction of the output of the cable of the receiver module) of the connection end of the receiver module can be flexibly set based on the location of the transmitter module and the locations of the elements on the printed circuit board. For example, the extension direction of the connecting end of the receiver module may be perpendicular to the second direction. In this case, the connecting end of the receiving module and the transmitting module is attached to the same surface of the printed circuit board. Alternatively, the direction of extension of the connecting end of the receiver module may coincide with the second direction. In this case, the connecting end of the receiver module and the transmitter module can be attached to two surfaces of the printed circuit board facing each other. The direction of extension of the connecting ends of one or more camera modules may be the same as or different from the direction of extension of the connecting end of the receiving module. It is not strictly limited in this app.

[0024] In one implementation, the distance between the receiving axis of the receiving module and the transmitting axis of the transmitting module is in the range of 0.5 mm to 30 mm. In this case, the receiving axis and the transmitting axis are closest to each other to ensure that the coverage between the transmitting field of view and the receiving field of view is relatively high, so that the performance of the TOF is relatively good.

[0025] In one embodiment, the TOF module further includes a control chip (driver chip). The control chip is attached to the side of the circuit board facing away from the transmitter module. The projection of the control microcircuit on the printed circuit board partially or completely overlaps part of the projection of the transmitting module on the printed circuit board. The fact that the projection of the control chip on the printed circuit board completely overlaps the projection of the transmitting module on the printed circuit board means that one completely falls into the area of the other.

[0026] In this embodiment, since the projection of the control chip on the PCB partially or completely overlaps part of the projection of the transmitter module on the PCB, the control chip and the transmitter module, respectively, are attached in an approximately opposite manner to the two sides of the PCB facing each other, so that the cables between the control chip and the transmission module are relatively short, and the parasitic inductance is relatively small, which ensures that the quality of the pulse waveform of the detection optical signal emitted by the transmission module is relatively good, so as to increase the signal-to-noise ratio.

[0027] Optionally, the TOF module further includes a plurality of matching electronics. The plurality of matching electronic elements include, but are not limited to, a capacitor, an inductor, a resistor, and the like. The plurality of matching electronics can reduce the parasitic inductance between the control chip and the transmission module to ensure the waveform integrity of the detection optical signal emitted by the transmission module. A plurality of matching electronics is attached to the side of the circuit board facing away from the transmitter module. A plurality of matching electronic elements are located around the control chip. The projection of a plurality of matching electronic elements on the printed circuit board may partially or completely overlap a portion of the projection of the transmitter module on the printed circuit board.

[0028] In one implementation, the transmitter module includes a holder, a transmitter, and a diffuser. The holder has top and bottom surfaces opposite each other. The bottom surface of the holder faces the printed circuit board. The holder forms a transmission cavity. The transfer cavity is located inside the holder. The holder additionally has an installation groove. The mounting groove is recessed from the upper surface of the holder in a direction close to the lower surface of the holder. The mounting groove communicates with the transmission cavity. The transmitter is configured to emit an optical detection signal. The transmitter is received into the transmission cavity and attached to the holder. The transmitter may be a vertical cavity surface laser. In this case, it is not necessary to add a collimator lens inside the transmission module, so that the manufacturing cost of the transmission module is lower and the manufacturing complexity is less. The diffuser is attached to the holder and closes the transmission cavity. The diffuser is located in the mounting groove. The diffuser is configured to increase the viewing angle of the optical detection signal.

[0029] In this embodiment, the viewing angle of the transmitting field of view of the transmitter may be in the range of 15° to 25°. For example, the viewing angle of the transmitting field of view of the transmitter may be designed as 21°±3°. The transmitting module can increase the viewing angle of the transmitting field of view of the transmitter by means of the diffuser, so that the transmitting field of view of the transmitting module has a relatively large viewing angle. In other words, the diffuser can scatter the laser beam at a small angle to the viewing angle required by the TOF module. Since the transmitting module has a relatively large viewing angle, the problem is that the coverage between the transmitting field of view and the receiving field of view is reduced due to the relatively large distance between the transmitting axis of the transmitting module and the receiving axis of the receiving module can be avoided, so that the distance between the transmitting axis of the transmitter module and the reception axis of the receiver module can be larger than that of the conventional TOF module, thereby further improving the layout flexibility of the transmitter module and the receiver module.

[0030] In one implementation, the holder is made of an aluminum nitride ceramic material. Because the thermal conductivity of aluminum nitride ceramic material is better than that of other ceramic material, and the difference between the coefficient of thermal expansion (CTE) of the holder and the transmitter is smaller, the CTE of the holder can still match the CTE of the transmitter and keep good durability, even if the transmitter is constantly heated, to ensure the reliability of the TOF module.

[0031] In one implementation, the transmitter module further includes an adhesive adhesive. An adhesive adhesive is bonded between the holder and diffuser. The adhesive adhesive is provided with one or more ventilation holes. One or more vents communicate with the transmission cavity on the outside of the transmission module. Since the transmitter module must withstand high heat at a high temperature of approximately 260 °C when welding to a printed circuit board, one or more vents can allow air that expands when heated in the transmission cavity to flow out of the transmitter module to avoid destruction of the transmitter module structure from - due to the fact that the air in the transmission cavity raises the diffuser during the welding process.

[0032] According to a second aspect, an embodiment of the present invention provides an electronic device including a controller and the aforementioned camera assembly. The controller is electrically connected to the printed circuit board. In this embodiment of the invention, the receiving module, the transmitting module and the controller are electrically connected to the printed circuit board, so that signal transmission can be carried out through the circuitry on the printed circuit board. The controller can obtain the distance between the object to be measured and the TOF module by calculating the difference between the time or phases at which the TOF module emits the detection optical signal and receives the induction optical signal. In this application, the TOF module can be applied to distance detection, face recognition, profile unlock, gesture recognition, object simulation, 3D games, smart home or other environment.

BRIEF DESCRIPTION OF THE DRAWINGS

[0033] FIG. 1 is a schematic structural diagram of an electronic device in a first embodiment of the invention according to an embodiment of the invention of the present application;

[0034] FIG. 2 is a schematic diagram of the relative position of the camera assembly and the front panel of the electronic device shown in FIG. 1 in implementation;

[0035] FIG. 3 is a schematic diagram of the relative position of the camera assembly and the front panel of the electronic device shown in FIG. 1 in another implementation;

[0036] FIG. 4 is a schematic diagram of the relative position of the camera assembly and the front panel of the electronic device shown in FIG. 1 in yet another implementation;

[0037] FIG. 5 is a schematic diagram of the relative position of the camera assembly and the front panel of the electronic device shown in FIG. 1 in yet another implementation;

[0038] FIG. 6 is a schematic structural diagram of an electronic device in a second embodiment of the invention according to an embodiment of the invention of the present application;

[0039] FIG. 7 is a schematic block diagram of the camera module and front panel of the electronic device shown in FIG. 6 in implementation;

[0040] FIG. 8 is a sectional view of a structural part of the electronic device shown in FIG. 6 along the line AA in the implementation;

[0041] FIG. 9 is a schematic exploded view of a portion of the structure shown in FIG. eight;

[0042] FIG. 10 is a schematic exploded view of a portion of the structure of the camera assembly of the electronic device shown in FIG. 6;

[0043] FIG. 11 is a rear view of the electronic device shown in FIG. 6 in implementation;

[0044] FIG. 12 is a rear view of the electronic device shown in FIG. 6 in another implementation;

[0045] FIG. 13 is a rear view of the electronic device shown in FIG. 6 in yet another implementation;

[0046] FIG. 14 is a rear view of the electronic device shown in FIG. 6 in yet another implementation;

[0047] FIG. 15 is an exploded schematic view of a portion of a transmission module in the structure shown in FIG. eight;

[0048] FIG. 16 is a bottom view of the transmission module shown in FIG. ten; as well as

[0049] FIG. 17 is a plan view of the transmission module shown in FIG. ten.

DESCRIPTION OF EMBODIMENTS

[0050] Implementations of the present invention are described below with reference to the accompanying drawings in implementations of the present invention.

[0051] Referring to FIG. 1, fig. 1 is a schematic block diagram of an electronic device 100 in the first embodiment of the invention according to an embodiment of the invention of the present application. The electronic device 100 in this application may be a mobile phone, a tablet computer, an e-book reader, a laptop computer, an automobile device, a wearable device, and the like. An embodiment of the invention will be described using an example in which the electronic device 100 is a mobile phone. The width direction of the electronic device 100 is defined as X, the length direction of the electronic device 100 is defined as Y, and the thickness direction of the electronic device 100 is defined as Z. The X width direction, the Y length direction, and the Z thickness direction are perpendicular to each other.

[0052] The electronic device 100 includes a housing 10 and a display 20. The housing 10 may include a back cover 101 and a bezel 102. The bezel 102 is connected to the periphery of the back cover 101. The bezel 102 and the back cover 101 may be configured as a single whole or can form a single structure by assembly. The display 20 is mounted on the side which is the front panel 102 and faces away from the back cover 101. The display 20 combines a display function with a touch function. The display 20 includes a display panel and a front cover covering the display panel. The display panel may be a Liquid Crystal Display (LCD), an organic light-emitting diode (OLED) display or a micro light-emitting diode (micro LED) display panel. The front cover can be a protective glass (cover glass, CG).

[0053] The electronic device 100 further includes a controller 30 and a camera assembly 40. The controller 30 is located inside the housing 10. The camera assembly 40 is installed in the housing 10. The entire camera assembly 40 is received within the housing 10, or most of the camera assembly 40 is received within the housing 10. The camera assembly 40 is configured to acquire an image to generate a corresponding image signal. The controller 30 is electrically connected to the camera node 40, and the controller 30 is configured to process the image signal of the camera node 40. The controller 30 may be the main chip on the motherboard of the electronic device 100.

[0054] In the environment in which the electronic device 100 is used, the front cover is defined to face the front of the electronic device 100, and the back cover 101 is defined to face the back of the electronic device 100. In this embodiment, camera assembly 40 may acquire an image from the back of electronic device 100. In another embodiment of the invention, camera assembly 40 may acquire an image in front of electronic device 100.

[0055] Referring to FIG. 2 - fig. 5, fig. 2 is a schematic diagram of the relative position of the camera assembly 40 and the front panel 102 of the electronic device 100 shown in FIG. 1 in implementation; fig. 3 is a schematic diagram of the relative position of the camera assembly 40 and the front panel 102 of the electronic device 100 shown in FIG. 1 in another implementation; fig. 4 is a schematic diagram of the relative position of the camera assembly 40 and the front panel 102 of the electronic device 100 shown in FIG. 1 in yet another implementation; and fig. 5 is a schematic diagram of the relative position of the camera assembly 40 and the front panel 102 of the electronic device 100 shown in FIG. 1 in yet another implementation.

[0056] The camera assembly 40 includes a time of flight (TOF) module 1 and a circuit board 2. On the circuit board 2, space 21 is provided to avoid. The printed circuit board 2 may be the main board of the electronic device 100 or part of the main board of the electronic device 100. The printed circuit board 2 may be a rigid printed circuit board or a combined rigid/flexible printed circuit board. The TOF module 1 includes a transmitter module 11 and a receiver module 12. The transmitter module 11 is configured to emit an optical detection signal. The optical detection signal may be infrared light. The receiving module 12 is configured to receive an induction optical signal generated after the detection optical signal is reflected from an object to be measured. The optical induction signal conveys information about the depth of field of the object to be measured. The receiver module 12 may be a camera module. The receiving module 12 and the transmitting module 11 are individually assembled. The receiving module 12 is located in the avoidance space 21, and the connecting end 121 of the receiving module 12 is attached to the printed circuit board 2. The receiving module 12 is electrically connected to the printed circuit board 2 through the connecting end 121. The transmitting module 11 is located around the receiving module 12 and attached to the printed circuit board. 2.

[0057] The receiving module 12, the transmitting module 11, and the controller 30 are electrically connected to the printed circuit board 2, so that signal transmission can be realized through a circuit on the printed circuit board 2. The controller 30 can obtain the distance between the object to be measured and the TOF module 1 by calculating the difference between times or phases in which the TOF module 1 emits the detection optical signal and receives the induction optical signal. For example, the digital signal processing (DSP) module in the controller 30 may process the data output from the TOF module 1 to output the final desired depth image. In this application, the TOF module 1 can be applied to distance detection, face recognition, profile unlock, gesture recognition, object simulation, 3D games, smart home or other environment.

[0058] In this embodiment, the receiving module 12 and the transmitting module 11 are individually assembled. The receiving module 12 has a receiving field of view (not shown in the figure) and a receiving axis 122, and the receiving axis 122 is the central axis of the receiving field of view. The transmission module 11 has a transmission field of view (not shown in the figure) and a transmission axis 111, and the transmission axis 111 is the central axis of the transmission field of view. Optionally, the distance between the receiving axis 122 of the receiving module 12 and the transmitting axis 111 of the transmitting module 11 is in the range of 0.5 mm (mm) to 30 mm. The reception axis 122 and the transmission axis 111 are closest to each other to ensure that the coverage between the transmitting field of view and the receiving field of view is relatively high, so that the performance of the TOF module 1 is relatively good.

[0059] In this embodiment, since the receiving module 12 is located in the avoidance space 21, and the connecting end 121 of the receiving module 12 is attached to the circuit board 2, the receiving module 12 and the transmitting module 11 can be close to each other. , so that the distance between the receiving axis 122 and the transmitting axis 111 is small enough to meet the performance requirements of the TOF module 1. In addition, the receiving module 12 and the transmitting module 11 are individually assembled, and there is no direct installation between the receiving module 12 and the transmitting module 11 or direct connection. Therefore, the transmission module 11 and the reception module 12 are arranged more flexibly, and a plurality of arrangement structures can be formed. Examples are shown below.

[0060] As shown in FIG. 2, the transmission axis 111 of the transmission module 11 and the reception axis 122 of the reception module 12 are located in the width X direction of the electronic device 100. The transmission module 11 is located on the right side of the reception module 12. As shown in FIG. 3, the transmission axis 111 of the transmission module 11 and the reception axis 122 of the reception module 12 are located in the width X direction of the electronic device 100. The transmission module 11 is located on the left side of the reception module 12. As shown in FIG. 4, the transmission axis 111 of the transmission module 11 and the reception axis 122 of the reception module 12 are arranged in the Y-length direction of the electronic device 100. The transmission module 11 is located on the upper side of the reception module 12. As shown in FIG. 5, the transmission axis 111 of the transmission module 11 and the reception axis 122 of the reception module 12 are arranged in the Y-length direction of the electronic device 100. The transmission module 11 is located on the underside of the reception module 12.

[0061] Referring to FIG. 1 in the implementations shown in FIG. 2 - fig. 3, a transmission area 1011 corresponding to the transmission unit 11 and a reception area 1012 corresponding to the reception unit 12 are provided on the back cover 101. ways, so that the electronic device 100 to which the camera assembly 40 is connected, the application may have many forms of appearance (also called industrial design, industrial design, etc.). In other words, the camera assembly 40 can be applied to a variety of electronic devices that have different appearance shapes. The camera assembly 40 is widely applicable. Since electronic devices that have many different appearance shapes, the same camera assembly 40 can be used, and it is not necessary to repeatedly design the TOF modules 1 in different shapes based on different appearance shapes, thereby reducing the development and production costs of electronic devices.

[0062] It can be understood that the structured light module is currently used as a depth camera module on some electronic devices. The structured light module includes a transmitting end and a receiving end. Based on the detection principles of the structured light module, the central distance between the transmitting end and the receiving end must be at least 25mm to ensure the normal operation of the structured light module. Since the distance determination accuracy of the structured light module mainly depends on the brightness of the flashes, the accuracy is relatively high when the structured light module performs depth ranging at a small distance. For example, if the distance from the object is approximately 40 cm, the accuracy can reach 1%. However, accuracy can be significantly reduced when applied over long distances. Therefore, the structured light module can only be configured to detect the object to be measured (for example, the user's face) which is relatively close to and in front of the electronic device, and during depth measurement, the distance does not exceed 1 m. In this application, the detection range of the TOF module 1 is much larger than the detection range of the structured light module, so that the TOF module 1 can not only be configured to detect an object to be measured at a short distance, but also to detect an object to be measured at a long distance. In one embodiment of the invention, the TOF module 1 is configured to detect a short range object to be measured or a long range object to be measured which is at the rear of the electronic device 100. In this case, the electronic device 100 may also include a structured light module, configured to detect an object to be measured at a short distance in front of the electronic device 100. In another embodiment of the invention, the TOF module 1 is configured to detect an object to be measured at a short distance or an object to be measured at a long distance that is in front of the electronic device 100. In this In this case, the electronic device 100 no longer has a structured light module.

[0063] Optionally, the avoidance space 21 may be a through hole or slot located on the circuit board 2. The receiver module 12 is located in the avoidance space 21 so that the receiver module 12 can reuse some or all of the thickness of the circuit board space 2, the node 40 of the camera is made more compact, and the size of the camera assembly 40 in the Z direction of the thickness of the electronic device 100 is smaller.

[0064] Referring to FIG. 6 and FIG. 7, fig. 6 is a schematic structural diagram of an electronic device 100 in a second embodiment according to an embodiment of this application; and fig. 7 is a schematic block diagram of the camera module 3 and front panel 102 of the electronic device 100 shown in FIG. 6 in implementation. Some technical content that is in this embodiment and is the same as in the first embodiment is not described again. The specific construction details of the camera assembly 40 in this application are mainly described in the second embodiment of the invention. The technical solutions and related technical features in the second embodiment of the invention can be combined with the first embodiment of the invention when there is no conflict.

[0065] The camera assembly 40 further includes one or more camera modules 3. The camera module 3 may be a color lens (also called an RGB lens), a black and white lens, a wide angle lens, or a zoom lens. One or more camera modules 3 are arranged in the avoidance space 21, and the connecting ends 31 of one or more camera modules 3 are attached to the printed circuit board 2. One or more camera modules 3 can co-operate with the TOF module 1. module 1 is combined with the image captured by the colored lens, the three-dimensional profile of the object to be measured can be represented graphically in which different colors represent different distances. The accompanying drawing of the present invention is shown in an example in which the camera assembly 40 includes one camera module 3.

[0066] In this embodiment, one or more camera modules 3 may be located parallel to the receiver module 12. Optionally, the receiver module 12 and one or more camera modules 3 are located in the first direction. The receiving module 12 and the transmitting module 11 are located in the second direction. The second direction is the same as the first direction. For example, the first direction and the second direction are the X directions of the width of the electronic device 100 or the Y directions of the length of the electronic device 100. As shown in FIG. 7, the first direction is the X width direction of the electronic device 100, and the second direction is also the X width direction of the electronic device 100. In another embodiment, the second direction may be perpendicular to the first direction. For example, one of the first direction and the second direction is the X direction of the width of the electronic device 100, and the other is the Y direction of the length of the electronic device 100.

[0067] In another embodiment of the invention, one or more of the camera modules 3 and the receiver module 12 may be arranged in another manner, for example, in the form of a matrix, triangle, quadrilateral, circle, or the like.

[0068] Optionally, the direction of extension (ie, the cable exit direction of the receiver module 12, as well as the direction from the photosensitive chip to the connector of the receiver module 12) of the connecting end 121 of the receiver module 12 may be flexible. is set based on the location of the transmitter module 11 and the layout of the elements on the printed circuit board 2. For example, the extension direction of the connecting end 121 of the receiver module 12 may be perpendicular to the second direction. In this case, the connecting end 121 of the receiving module 12 and the transmitting module 11 are attached to the same surface of the printed circuit board 2. Alternatively, the extension direction of the connecting end 121 of the receiving module 12 may coincide with the second direction. In this case, the connecting end 121 of the receiving module 12 and the transmitting module 11 can be attached to two surfaces of the printed circuit board 2 that face each other. The directions of extension of the connecting ends of one or more modules 3 of the camera may be the same as or different from the direction of extension of the connecting end 121 of the receiving module 12. This is not strictly limited in this application.

[0069] Optionally, a collection area 1013 corresponding to one or more camera modules 3 is further provided on the back cover 101. In this embodiment, since the receiving module 12 and the transmitting module 11 are individually assembled, the receiving module 12, the transmitting module 11, and the camera module 3 are arranged in a variety of ways, and, respectively, the transmission area 1011, the reception area 1012, and the collection area 1013, which are on the back cover 101 are also arranged in a variety of ways, so that the electronic device 100 in which the camera assembly 40 is applied can have a variety of appearances. In other words, the camera assembly 40 can be applied to a variety of electronic devices that have different appearance shapes. The camera assembly 40 is widely applicable.

[0070] Referring to FIG. 8 to FIG. 10, fig. 8 is a sectional view of a structural part of the electronic device 100 shown in FIG. 6 along the line AA in the implementation; fig. 9 is a schematic exploded view of a portion of the structure shown in FIG. eight; and fig. 10 is a schematic exploded view of a portion of the structure of the camera assembly 40 of the electronic device 100 shown in FIG. 6. The implementation shown in FIG. 8 corresponds to the implementation shown in FIG. 7.

[0071] Optionally, the camera assembly 40 further includes a camera bracket 4 located in the avoidance space 21 . The camera bracket 4 has a plurality of receiving slots 41 spaced apart from each other. The opening directions of the plurality of receiving slots 41 are the same. The receiving module 12 and one or more camera modules 3 are received in a plurality of receiving slots 41 in a one-to-one manner. The receiving module 12 and one or more camera modules 3 are arranged at a distance from each other to avoid collision and damage due to accidental impact.

[0072] In this embodiment, the receiving module 12 and one or more camera modules 3 are received in a plurality of receiving slots 41 of the camera assembly 40 and fixed against the camera bracket 4. The camera bracket 4 is located in the avoidance space 21, so that the receiving module 12 and one or more camera modules 3 are located in the avoidance space 21. The receiver module 12, one or more camera modules 3, and the camera bracket 4 can achieve modularity through a separate assembly process before the overall assembly process of the camera assembly 40 is performed, thereby simplifying the steps of the overall assembly process of the camera assembly 40 and reducing assembly complexity.

[0073] The receiving module 12 and one or more camera modules 3 may be adhesively attached to the bottom walls 411 of the plurality of receiving slots 41 through an adhesive member to be secured against the camera bracket 4. The camera bracket 4 may be made of a material with high thermal conductivity, such as copper, aluminum foil, stainless steel, or other metallic material. The adhesive element may be doped with thermally conductive particles (eg, graphite particles or metal particles) or made from a thermally conductive adhesive material.

[0074] In this embodiment, the heat radiated by the receiver module 12 and one or more camera modules 3 can be conducted to the camera bracket 4 through the adhesive member, and the heat is removed by the camera bracket 4 to ensure reliable operation of the camera assembly 40.

[0075] The camera bracket 4 further has a plurality of connection recesses 42. The plurality of connection recesses 42 communicate with the plurality of receiving slots 41 on the outside of the camera bracket 4 in a one-to-one manner. The connecting end 121 of the receiving module 12 and the connecting ends 31 of one or more camera modules 3 extend from the plurality of receiving slots 41 through the plurality of connecting recesses 42 in a one-to-one manner to be attached to the printed circuit board 2.

[0076] Optionally, the camera assembly 40 further includes a mounting bracket 5. The mounting bracket 5 may be used as a middle panel of the electronic device 100, or may be part of the middle panel of the electronic device 100. The mounting bracket 5 is fixed against the bezel 102 of the electronic device 100 (see Fig. 6). The mounting bracket 5 and the front panel 102 may be integral or integral with the entire front panel 102.

[0077] The printed circuit board 2 is attached to the mounting bracket 5. The printed circuit board 2 can be attached to the mounting bracket 5 by means of the latch 6. For example, the mounting bracket 5 includes a first surface 51 and a second surface 52 that are opposite each other. The mounting bracket 5 has a mounting protrusion 53 and a mounting hole 54. The mounting protrusion 53 protrudes from the first surface 51. The mounting hole 54 is recessed on the top surface 531 of the mounting protrusion 53 and is spaced from the first surface 51 in a direction close to the second surface 52. The circuit board 2 can abut the top surface 531 of the mounting protrusion 53. The connection hole 22 corresponding to the mounting hole 54 is located on the circuit board 2. The retainer 6 passes through the connection hole 22 and exits into the mounting hole 54, so that the circuit board 2 is tightly attached to the mounting bracket 5 The retainer 6, the connection hole structure 22, and the mounting hole structure 54 form a fastening structure. Between the printed circuit board 2 and the mounting bracket 5, a plurality of groups of mounting structures can be formed. A plurality of groups of fastening structures can be scattered around the peripheral area of the printed circuit board 2 so that the printed circuit board 2 is more stably attached to the fastening bracket 5.

[0078] The mounting bracket 5 has a mounting groove 55. The mounting groove 55 is recessed from the first surface 51 in a direction close to the second surface 52. The camera bracket 4 is fixed in the mounting groove 55. The bottom surface 43 of the camera bracket 4 facing away from the receiving groove 41 may abut against the bottom wall 551 of the mounting slot 55 to achieve a relationship therebetween. Between the bottom wall 551 of the mounting groove 55 and the bottom surface 43 of the camera bracket 4, a concave-convex matching structure can be located. For example, the protruding convex block 56 may be located on the bottom wall 551 of the mounting slot 55. The concave slot 44 may be located on the bottom surface 43 of the camera bracket 4. The convex block 56 extends into the groove 44 so that the camera bracket 4 is fixed against the mounting bracket 5. In another embodiment of the invention, the groove is located on the bottom wall 551 of the mounting groove 55 and the convex block is located on the bottom surface 43 of the camera bracket 4. The convex block fits into the groove so that the camera bracket 4 is fixed against the mounting bracket 5.

[0079] In this embodiment, since the circuit board 2 is attached to the mounting bracket 5, and the camera bracket 4 is also attached to the mounting bracket 5, the positional relationship between the circuit board 2 and the camera bracket 4 is achieved by the mounting bracket 5, so that the positional relationship between the receiving unit 12 mounted on the camera arm 4 and the transmitting unit 11 attached to the circuit board 2 is reached, and the positional relationship between the transmitting field of view and the receiving field of view is stable. In this case, reliable operation of the TOF module 1 can be ensured, and operation of the camera unit 40 is relatively good.

[0080] Optionally, the camera assembly 40 further includes a decorative part 7. The decorative part 7 is mounted on the back cover 101 (see FIG. 7). The decorative part 7 is located on one side of the receiving module 12, which receives the optical induction signal. The decorative part 7 includes a decorative ring 71 and a protective plate 72. The decorative ring 71 has an upper surface 711 and a lower surface 712 which are opposite each other. A recessed limit slot 713 is located on the upper surface 711 of the decorative ring 71. The protective plate 72 is installed in the limit groove 713 and rests against the bottom wall 7131 of the restrictive groove 713. The decorative part 7 is provided with a plurality of mounting spaces 714. A plurality of mounting spaces 714 are provided in the decorative ring 71. The mounting spaces 714 communicate with the restrictive slot 713 on the bottom surface 712 of the decorative ring 71. The protective plate 72 may have a plurality of light-transmitting regions 721 that are spaced apart from each other, and a light-protective region 722 that is arranged around the plurality of light-transmitting regions 721. The plurality of light-transmitting regions 721 are respectively located in a plurality of mounting spaces 714. In an embodiment of the invention, the protective panel 72 is an integrated composite panel including translucent plates that form a plurality of light transmissions. covering areas 721, and a light shielding plate that defines the light shielding region 722. In another embodiment, the protective panel 72 includes a glass substrate and a light barrier coating that is located on the glass substrate and faces the bottom wall 7131 of the restrictive slot 713. Part of the light barrier coating, located on a plurality of light-transmitting areas 721, is located with a cavity. In yet another embodiment of the invention, the protective panel 72 is primarily made of a transparent material. The bottom wall 7131 of the restrictive groove 713 is provided with a plurality of gaps that communicate with the mounting space 714, and the plurality of gaps correspond to the light-transmitting regions 721. .

[0081] The receiver module 12 and one or more camera modules 3 are received in multiple mounting spaces 714. The receiver module 12 and one or more camera modules 3 are received in different mounting spaces 714 in a one-to-one manner. The receiving module 12 and one or more camera modules 3 collect light through a respective light transmitting area 721. The transmitting module 11 is located around the decorative part 7. In other words, the receiving module 12 and one or more camera modules 3 are located inside the decorative part 7 and surrounded by the decorative part 7 , and the transmitter module 11 is located outside the decorative part 7.

[0082] The receiving area 1012 and the collection area 1013 of the back cover 101 may be combined into one area 1014, and the area 1014 may be a through hole (indicated below as 1014). The decorative part 7 is mounted on the through hole 1014. The decorative ring 71 includes a main body part 715 and a restrictive part 716. A plurality of mounting spaces 714 are located on the main body part 715. The restrictive portion 716 is connected to the periphery of the main body portion 715. The decorative part 7 is installed on the back cover 101. The restrictive part 716 is located on one side of the back cover 101, which faces the circuit board 2. The main body part 715 is located in the through hole 1014, and the main body part 715 protrudes from the outer surface 1015, which is back cover 101 and facing away from the circuit board 2. In this case, the decorative portion 7 can reuse the space of the back cover 101, which is in the Z thickness direction of the electronic device 100, and the receiving module 12 and one or more camera modules 3 can also recycle use the space occupied by the back cover 101 in the Z thickness direction of the electronic device 100, helping to reduce the size of the electronic device 100 in the Z thickness direction so that the electronic device 100 becomes thinner.

[0083] In this embodiment, since the transmitter module 11 and the receiver module 12 can be individually assembled and the arrangement between them can be flexible, the decorative part 7 can be used to decorate the receiver module 12 and one or more camera modules 3 and no longer surround the transmission module 11 so that the decorative portion 7, the reception module 12, one or more camera modules 3 and the transmission module 11 are arranged in a more diverse manner.

[0084] For example:

with reference to FIG. 11 - fig. 14, fig. 11 is a rear view of the electronic device 100 shown in FIG. 6 in implementation; fig. 12 is a rear view of the electronic device 100 shown in FIG. 6 in another implementation; fig. 13 is a rear view of the electronic device 100 shown in FIG. 6 in yet another implementation; and fig. 14 is a rear view of the electronic device 100 shown in FIG. 6 in yet another implementation.

[0085] As shown in FIG. 11, the decorative portion 7 extends in the X width direction of the electronic device 100. In other words, the through hole 1014 and the decorative portion 7 are arranged transversely. A plurality of light-transmitting areas 721 of the protective plate 72 are located in the X width direction of the electronic device 100. Accordingly, one or more camera modules 3 and a receiving module 12 are located in the X width direction of the electronic device 100. The receiving module 12 is located to the right of one or more camera modules 3. In this implementation, the transmission area 1011 is located on the right side of the decorative portion 7 and is located in the arrangement direction of the plurality of light-transmitting areas 721. The location of the transmission module 11 corresponds to the location of the transmission area 1011. The transmitter module 11 is located on the right side of the receiver module 12 and is located at the location of the receiver module 12 and one or more camera modules 3. In another embodiment of the invention, the transmission area (shown in a circle dotted line) may alternatively be located on the top or bottom side of the decorative portion 7. The transmission area and the light transmitting area 721, which is opposite the receiving module 12, are located in the Y direction of the length of the electronic device 100. In this application, the constraint on the relative position of the transmitter module 11, the receiver module 12, and one or more camera modules 3 is a constraint on the relative position of the central axis (eg, receive axis or transmit axis) of the combined viewing angles.

[0086] In this application, the transfer area 1011 of the back cover 101 can be formed in a variety of ways. For example, the back cover 101 includes a glass substrate and a light barrier that is located on the glass substrate and faces one side of the circuit board 2. At least a portion of the light barrier allows invisible light to pass through to form a transmission region 1011. The light barrier may be made of a material that shields visible light and allows invisible light to pass through. Alternatively, the light barrier coating may be made of a material that shields invisible light and forms the transmission region 1011 by thinning a portion of the coating. The light-blocking coating may alternatively use a composite coating, such as a material that allows invisible light to pass through, form the transmission region 1011, and form another region using a different material. Alternatively, the back cover 101 may be made of a metal material to form a through hole in the transmission area 1011, and a translucent plate is disposed in the through hole to allow invisible light to enter.

[0087] As shown in FIG. 12, the decorative portion 7 extends in the width X direction of the electronic device 100. In other words, the through hole 1014 and the decorative portion 7 are transversely disposed. A plurality of light-transmitting areas 721 of the protective plate 72 are located in the X width direction of the electronic device 100. Accordingly, one or more camera modules 3 and a receiving module 12 are located in the X width direction of the electronic device 100. The receiving module 12 is located on the left side of one or more camera modules 3 . In this implementation, the transmission area 1011 is located on the left side of the decorative portion 7 and is located in the arrangement direction of the plurality of light-transmitting areas 721. The location of the transmission module 11 corresponds to the transmission area 1011. The transmitter module 11 is located on the left side of the receiver module 12 and is located at the location of the receiver module 12 and one or more camera modules 3. In another embodiment of the invention, the transmission area (shown in a circle dotted line) may alternatively be located on the top or bottom side of the decorative portion 7. The transmission area and the light transmitting area 721, which is opposite the receiver module 12, are located in the Y direction of the length of the electronic device 100.

[0088] As shown in FIG. 13, the decorative portion 7 extends in the Y length direction of the electronic device 100. In other words, the through hole 1014 and the decorative portion 7 are arranged vertically. A plurality of light-transmitting areas 721 of the protective plate 72 are located in the Y length direction of the electronic device 100. Accordingly, one or more camera modules 3 and a receiving module 12 are located in the Y length direction of the electronic device 100. The receiving module 12 is located on the underside of one or more camera modules 3 . In this implementation, the transmission area 1011 is located on the lower side of the decorative portion 7 and is located in the arrangement direction of the plurality of light-transmitting areas 721. The location of the transmission module 11 corresponds to the transmission area 1011. The transmitter module 11 is located on the underside of the receiver module 12 and is located at the location of the receiver module 12 and one or more camera modules 3. In another embodiment of the invention, the transmission area (shown in a circle dotted line) may alternatively be located on the left or right side of the decorative portion 7. The transmission area and the light transmitting area 721, which is opposite the receiver module 12, are located in the width X direction of the electronic device 100.

[0089] As shown in FIG. 14, the decorative portion 7 extends in the Y length direction of the electronic device 100. In other words, the through hole 1014 and the decorative portion 7 are arranged vertically. A plurality of light-transmitting areas 721 of the protective plate 72 are located in the Y length direction of the electronic device 100. Accordingly, one or more camera modules 3 and a receiving module 12 are located in the Y length direction of the electronic device 100. The receiving module 12 is located on the upper side of one or more camera modules 3 . In this implementation, the transmission area 1011 is located on the upper side of the decorative portion 7 and is located in the arrangement direction of the plurality of light-transmitting areas 721. The location of the transmission module 11 corresponds to the transmission area 1011. The transmitter module 11 is located on the upper side of the receiver module 12 and is located at the location of the receiver module 12 and one or more camera modules 3. In another embodiment of the invention, the transmission area (shown in a circle dotted line) may alternatively be located on the left or right side of the decorative portion 7. The transmission area and the light transmitting area 721, which is opposite the receiver module 12, are located in the width X direction of the electronic device 100.

[0090] In this embodiment, since a part of the decorative part 7 is exposed outside the electronic device 100, the receiving module 12 and one or more camera modules 3 that are decorated with the decorative part 7 are similar, or even the same in appearance, to the decorative part 7, the receiving module 12 and one or more camera modules 3 can be generally symmetrically distributed on the electronic device 100 so that the electronic device 100 has a harmonious appearance and is more aesthetically pleasing. The decorative part 7 can also prevent problems such as reduced strength of the structure and easy deformation caused by an excessively large volume due to an excessively large number of devices to be surrounded.

[0091] Optionally, referring to FIG. 8 and FIG. 9, the camera assembly 40 further includes a buffer member 8. The buffer member 8 is tightly clamped between the decorative portion 7 and the camera bracket 4. In particular, the buffer member 8 is located between the restrictive portion 716 of the decorative ring 71 and the top surface 45 (opposed to the bottom surface 43) of the camera bracket 4. In this case, the rear cover 101 firmly presses the camera bracket 4 to the mounting bracket 5 by means of the restrictive portion 716 and the buffer member 8, so that the bottom surface 43 of the camera bracket 4 fits snugly against the bottom wall 551 of the mounting groove 55 and the camera bracket 4, one or more modules The 3 cameras mounted on the camera bracket 4 and the receiving module 12 can be fixed inside the housing 10 to avoid component damage due to frequent shaking.

[0092] Optionally, referring to FIG. 8 and FIG. 9, the TOF module 1 further includes a control chip 13. The control chip 13 is attached to the side of the circuit board 2 that faces away from the transmitter module 11'. The projection of the control chip 13 on the printed circuit board 2 partially or completely overlaps part of the projection of the transmitter module 11 on the printed circuit board 2. The fact that the projection of the control chip 13 on the printed circuit board 2 completely overlaps the projection of the transmitter module 11 on the printed circuit board 2 means that one completely hits into the area of another.

[0093] In this embodiment, since the projection of the control chip 13 on the printed circuit board 2 partially or completely overlaps part of the projection of the transmission module 11 on the printed circuit board 2, the control chip 13 and the transmission module 11 are respectively fixed in an approximately opposite way, to the two sides of the printed circuit board 2 that face each other so that the cables between the control chip 13 and the transmission module 11 are relatively short and the parasitic inductance is relatively small, thereby ensuring that the pulse shape quality of the detection optical signal emitted by the transmission module 11 is relatively good for increasing the ratio signal/noise.

[0094] As a result of checking, the value of the inductance between the control chip 13 and the transmission module 11 in this embodiment is less than or equal to 0.3 nanohenry (nH), so that the requirements for using the TOF module 1 can be satisfied.

[0095] In this application, the receiving module 12 includes a lens (lens) and a photosensitive chip (also called an image sensor). The photosensitive chip is configured to convert the optical signal into an image signal. The photosensitive chip can transmit a signal to the control chip 13 to allow the control chip 13 to control the transmission module 11 to emit an optical induction signal.

[0096] In this application, the controller 30 includes a processing chip and a memory chip. The memory chip stores many instructions that can be executed by the processor. A plurality of commands correspond to a plurality of operating modes of the TOF module 1. Each operating mode sets the operating state of the optical induction signal (for example, pulse wave), including the pulse wave frequency (for example, 20 MHz, 50 MHz or 100 MHz), pulse wave integration time, duty cycle pulse wave, corresponding frame rate, etc.

[0097] When the processor receives a trigger signal, the processor calls the appropriate instruction in memory based on the trigger signal and writes the instruction to the photosensitive crystal register. The photosensitive chip sends a corresponding transmission signal to the control chip 13 based on the instruction, and the control chip 13 starts the transmission module 11 based on the transmission signal to emit a corresponding induction optical signal. In this case, the operating state of the optical induction signal corresponds to the start signal. For example, the start signal corresponds to a large aperture photographic effect, the corresponding instruction is the first instruction, and the processor can call the first instruction and write the first instruction to the register of the photosensitive chip. After the register switch is turned on, a corresponding transmission signal is sent to the control chip 13, and the control chip 13 drives the transmission module 11 based on the transmission signal to emit an optical induction signal corresponding to a large aperture photograph.

[0098] Optionally, the mounting bracket 5 further has a notch 57 for avoidance. The avoidance groove 57 is recessed from the first surface 51 in a direction close to the second surface 52. The control chip 13 may partially or completely fit into the avoidance groove 57.

[0099] Optionally, the TOF module 1 further includes a plurality of matching electronics 14. The plurality of matching electronics 14 include, but are not limited to, a capacitor, an inductor, a resistor, and the like. The plurality of matching electronics 14 can reduce the parasitic inductance between the control chip 13 and the transmission module 11 to ensure the waveform integrity of the optical detection signal emitted by the transmission module 11. The plurality of matching electronics 14 are attached to the side of the circuit board 2 that faces away from the transmission module 11. A plurality of matching electronic elements 14 are located around the control chip 13. The projection of a plurality of matching electronic elements 14 on the printed circuit board 2 may partially or completely overlap part of the projection of the transmitting module 11 on the printed circuit board 2. The plurality of matching electronic elements 14 may partially or completely enter the groove 57 avoidance.

[0100] Optionally, referring to FIG. 8 and FIG. 15, fig. 15 is a schematic view of a transmitter module in the structure shown in FIG. eight.

[0101] The transmitter module 11 includes a holder 112, a transmitter 113, and a diffuser 114. The holder 112 has an upper surface 1121 and a lower surface 1122 that are opposite each other. The bottom surface 1122 of the holder 112 faces the printed circuit board 2. The holder 112 forms a transmission cavity 1123. The transfer cavity 1123 is located within the holder 112. The holder 112 further has a mounting slot 1124. The mounting slot 1124 is recessed from the upper surface 1121 of the holder 112 in a direction close to the lower surface 1122 of the holder 112. The mounting slot 1124 communicates with the transfer cavity 1123.

[0102] The transmitter 113 is configured to emit an optical detection signal. Transmitter 113 is located in transmission cavity 1123 and attached to holder 112. Transmitter 113 may be a vertical cavity surface emitting Laser (VCSEL). In this case, it is not necessary to add a collimator lens inside the transmission module 11, so that the manufacturing cost of the transmission module 11 is lower and the manufacturing complexity is less.

[0103] The diffuser 114 is attached to the holder 112 and closes the transmission cavity 1123. The diffuser 114 is located in the mounting slot 1124. The diffuser 114 is configured to increase the viewing angle of the optical detection signal.

[0104] In this embodiment, the angle of view of the transmitting field of view of the transmitter 113 may be in the range of 15° to 25°. For example, the viewing angle of the transmitting field of view of the transmitter 113 may be designed as 21°±3°. The transmitter module 11 can increase the viewing angle of the transmitting field of view of the transmitter 113 by means of the diffuser 114 so that the transmitting field of view of the transmitter module 11 has a relatively large viewing angle. In other words, the diffuser 114 can scatter the laser beam having a small angle to the angle of view required for the TOF module 1. Since the transmitting module 11 has a relatively large field of view, the problem is that the coverage between the transmitting field of view and the receiving field of view is reduced. due to the relatively large distance between the transmission axis 111 of the transmitting module 11 and the receiving axis 122 of the receiving module 12 can be avoided, so that the distance between the transmitting axis 111 of the transmitting module 11 and the receiving axis 122 of the receiving module 12 can be larger than that of the conventional TOF module. thereby further improving the layout flexibility of the transmitter module 11 and the receiver module 12.

[0105] The viewing angle of the transmitting field of view of the transmitting module 11 may be slightly larger than the viewing angle of the receiving field of view of the receiving module 12. In one embodiment of the invention, the viewing angle of the receiving field of view of the receiving module 12 is 64 ° × 50 the field of view of the transmitting module 11 is 68°×54°. Diffuser 114 is rectangular. The diffuser 114 can spread the 21° field of view of the transmitter 113 to a 68°×54° field of view in a square cone shape.

[0106] Optionally, the transmitter module 11 may be welded to the circuit board 2 using surface mount technology (SMT). The mounting cables may be provided on the holder 112, the transmitter 113 is welded to the holder 112, and the holder 112 is welded to the printed circuit board 2, so that the transmitter 113 is electrically connected to the printed circuit board 2 via the mounting cables. Referring to FIG. 16, fig. 16 is a bottom view of the transmission module 11 shown in FIG. 10. The bottom surface 1122 of the holder 112 is provided with a plurality of pads 1127. A plurality of pads 1127 are welded to the circuit board 2. The plurality of pads 1127 may be configured to transmit different signals.

[0107] The holder 112 may be an integrated ceramic structure. The holder 112 may be made of aluminum nitride (ALN) ceramic material. Since the thermal conductivity of the aluminum nitride ceramic material is better than other ceramic material, and the difference between the coefficient of thermal expansion (CTE) of the holder 112 and the transducer 113 is smaller, the CTE of the holder 112 can still match the CTE of the transmitter. 113 and maintain good strength even if the transmitter 113 is repeatedly heated to ensure the reliable operation of the TOF module 1.

[0108] The transmitter module 11 may further include a photodiode 115 (photo diode, PD). The photodiode 115 is received in the transmission cavity 1123 and fixed on the holder 112. The photodiode 115 is a control component responsible for eye and skin safety and automatic power control. The photodiode 115 is configured to: monitor changes in light in the transmission cavity 1123 of the transmitter module 11, convert the received light into a corresponding current signal, and transmit the current signal to the control chip 13. If the diffuser 114 is missing or broken, the light in the transmission cavity 1123 changes. In this case, the light received by the photodiode 115 changes, and the photodiode 115 can convert the received light into current light in a timely manner and transmit the current light to the control chip 13. The control chip 13 is further configured to compare the current signal with a predetermined threshold. When the current signal exceeds the predetermined threshold value, the TOF module 1 is turned off to prevent the light emitted from the transmission module 11 beyond the limit from harming the safety of the human eye.

[0109] The transmitter module 11 may further include a negative temperature coefficient (NTC) component (not shown in the drawing). The NTC component is received in the transmission cavity 1123 and fixed on the holder 112. The NTC component is configured to: monitor the temperature of the transmitter 113 in real time and transmit data to the control chip 13 in real time. Since, when the temperature exceeds the set temperature (for example, 70°C), the light output of the transmitter 113 can be significantly reduced, resulting in a great loss of depth and accuracy, so the system needs to control the room temperature. in real time. Upon receiving a signal detected by the NTC component and that the temperature is approaching the set temperature, the control chip 13 can control the temperature increase in some ways. For example, the current output is reduced or the TOF module 1 is turned off when the temperature controlled by the NTC component reaches the set temperature (where the temperature is normally higher than the set temperature) by the preset program.

[0110] Optionally, referring to FIG. 9, fig. 15 and FIG. 17, fig. 17 is a plan view of the transmission module 11 shown in FIG. 10. The transmission module 11 may further include an adhesive adhesive 116. The adhesive adhesive 116 is bonded between the holder 112 and the diffuser 114. connection between holder 114 and diffuser 112. Adhesive adhesive 116 is provided with one or more ventilation holes 1161. One or more ventilation holes 1161 communicate with transmission cavity 1123 on the outside of transmission module 11. at a high temperature of approximately 260°C, one or more vents 1161 can allow the air that expands when heated in the transmission cavity 1123 to flow outside the transmission module 11 to avoid the case that the structure of the transmission module 11 is destroyed due to the fact that the air to the floor The transmission shaft 1123 raises the diffuser 114 during welding.

[0111] A recessed region 1128 is formed on the wall surface of the transmission cavity 1123. The recessed area 1128 communicates with the mounting slot 1124 and the transmission cavity 1123. The recessed area 1128 communicates with one or more vents 1161 so that air in the transmission cavity 1123 can flow out of the transmission module 11.

[0112] The top surface 1121 of the holder 112 is provided with one or more marking areas 1126. The marking area 1126 may be in the form of a square, a circle, or a marking line. It is not strictly limited in this application. In this case, the vendor or model of the transmitter module 11 can be determined based on the number of marking areas 1126 to avoid confusion due to the relatively small size of the transmitter module and the similar shape of the package appearance.

[0113] The above description is only specific implementations of this application, but is not intended to limit the scope of protection of this application. Any change or replacement readily detectable by a person skilled in the art within the technical scope disclosed in this application should/should fall within the scope of this application. Implementations in this application and functions in implementations can be mutually combined into a condition without conflict. Therefore, the scope of protection of the present invention should be consistent with the scope of protection of the claims.

[0114] The following are additional embodiments of the present invention. It should be noted that the numbering used in the following section does not necessarily correspond to the numbering of the previous sections.

[0115] Embodiment 1 of the invention. A camera assembly comprising a time-of-flight module and a printed circuit board, wherein space is provided on the printed circuit board to avoid, the time-of-flight module comprises a transmitting module and a receiving module, the transmitting module is configured to emit an optical detection signal, the receiving module is configured to receive an optical induction signal generated after the detection optical signal is reflected by the object to be measured, the receiving module is located in the avoidance space, the connecting end of the receiving module is attached to the circuit board, and the transmitting module is located around the receiving module and attached to the circuit board.

[0116] Embodiment 2 of the invention. The camera assembly according to Embodiment 1, wherein the camera assembly further comprises one or more camera modules, wherein the one or more camera modules are located in the avoidance space, and the connecting ends of the one or more camera modules are attached to the printed circuit board.

[0117] Embodiment 3 of the invention. The camera assembly according to Embodiment 2, wherein the camera assembly further comprises a camera bracket disposed in the avoidance space, the camera bracket has a plurality of receiving slots spaced apart from each other, and the receiving module and one or more camera modules are received in the plurality of receiving slots in a one-to-one manner.

[0118] Embodiment 4 of the invention. The camera assembly according to Embodiment 3, wherein the camera assembly further comprises a mounting bracket, wherein the printed circuit board is attached to the mounting bracket, the mounting bracket has a mounting groove, and the camera bracket is attached to the mounting groove.

[0119] Embodiment 5 of the invention. The camera assembly according to Embodiment 2, wherein the camera assembly further comprises a decorative part, the decorative part is located on the side of a receiving module that receives an optical induction signal, the decorative part includes a plurality of mounting spaces, the receiving module and one or more camera modules are taken into many mounting spaces, and the transmitter module is located around the decorative part.

[0120] Embodiment 6 of the invention. The camera assembly according to any one of embodiments 2-5 of the invention, wherein the receiving module and one or more camera modules are located in the first direction, while the receiving module and the transmitting module are located in the second direction, and the second direction is the same as the first direction, or the second direction perpendicular to the first direction.

[0121] Option 7 of the invention. The camera assembly according to any one of embodiments 1 to 5, wherein the distance between the receiving axis of the receiving module and the transmitting axis of the transmitting module is in the range of 0.5 mm to 30 mm.

[0122] Embodiment 8 of the invention. The camera assembly according to any one of embodiments 1-5 of the invention, wherein the TOF module further comprises a control chip, wherein the control chip is attached to the side of the printed circuit board facing away from the transmitter module, and the projection of the control chip on the printed circuit board partially or completely overlaps the projection transmitter module on the printed circuit board.

[0123] Embodiment 9 of the invention. The camera assembly according to any one of embodiments 1-5 of the invention, wherein the transmitter module comprises a holder, a transmitter, and a diffuser, wherein the holder forms a transmission cavity, the transmitter is configured to emit an optical detection signal, the transmitter is received into the transmission cavity and attached to the holder, the diffuser attached to the holder and closes the transmission cavity, and the diffuser is configured to increase the viewing angle of the optical detection signal.

[0124] Embodiment 10 of the invention. The camera assembly according to embodiment 9, wherein the holder is made of an aluminum nitride ceramic material.

[0125] Embodiment 11 of the invention. The camera assembly according to embodiment 9, wherein the transmission module further comprises an adhesive adhesive, wherein the adhesive adhesive is bonded between the holder and diffuser, the adhesive adhesive is provided with one or more vents, and the one or more vents are in air communication with the transmission cavity on the outside transmitting module.

[0126] Embodiment 12 of the invention. An electronic device comprising a controller and a camera assembly according to any one of embodiments 1-11 of the invention, wherein the controller is electrically connected to a printed circuit board.

Claims (21)

1. An electronic imaging apparatus comprising a TOF module and a printed circuit board, wherein a hole or a groove is provided on the printed circuit board, the TOF module comprises a transmitting module and a receiving module, wherein the receiving module and the transmitting module are individually assembled, wherein the imaging electronic device further comprises a camera bracket located in the hole or slot, the camera bracket includes a receiving groove, the receiving module is received in the receiving groove, and the receiving module reuses part or all of the PCB thickness space, the connecting end of the receiving module is attached to the printed circuit board , and the transmitter module is located on the printed circuit board next to the receiver module. 2. The electronic imaging apparatus according to claim 1, wherein the electronic imaging apparatus further comprises a camera module, wherein the camera module is disposed in a hole or slot, and the connecting end of the camera module is attached to the printed circuit board. 3. The electronic imaging device according to claim 1, wherein the camera arm comprises a first receiving slot and a second receiving slot, wherein the receiving module is received in the first receiving slot, wherein the electronic device further comprises a camera module, wherein the camera module is received in the second receiving slot. 4. The electronic imaging device according to claim 1, wherein the electronic device further comprises a mounting bracket including a mounting slot, wherein the camera bracket is attached to the mounting slot. 5. The electronic imaging device according to claim 1, in which the receiving module and the camera module are located in the first direction, the receiving module and the transmitting module are located in the second direction, while the second direction coincides with the first direction or the second direction is perpendicular to the first direction. 6. The electronic imaging device according to claim 1, wherein the distance between the receiving axis of the receiving module and the transmission axis of the transmitting module is in the range of 0.5 to 30 mm. 7. The electronic imaging device according to claim 1, wherein the TOF module further comprises a control chip, wherein the control chip is attached to the side of the printed circuit board facing away from the transmitting module, and the projection of the control chip on the printed circuit board partially or completely overlaps the projection of the transmitting module on the printed circuit board. 8. The electronic imaging device according to Claim. 1, in which the transmitting module contains a holder, a transmitter and a diffuser, while the holder forms a transmission cavity, the transmitter is received into the transmission cavity and attached to the holder, the diffuser is attached to the holder and closes the transmission cavity and the diffuser is made with the possibility of increasing the viewing angle of the optical detection signal, while the holder is fixed on the printed circuit board. 9. The electronic imaging apparatus of claim 8, wherein the holder is made of an aluminum nitride ceramic material. 10. The electronic imaging device of claim 8, wherein the transmitter module further comprises an adhesive adhesive, wherein the adhesive adhesive is bonded between the holder and diffuser, the adhesive adhesive is provided with one or more vents, and the one or more vents are in air communication with the cavity transmission outside the transmitter module. 11. The electronic imaging device according to claim 3, wherein the receiving module is attached to the bottom wall of the first receiving slot by means of an adhesive member. 12. The electronic imaging device according to claim 3, wherein the camera module is attached to the bottom wall of the second receiving slot by means of an adhesive member. 13. The electronic imaging apparatus according to claim 1, wherein the camera bracket is made of a metal material. 14. The electronic imaging device according to claim 11, wherein the adhesive member includes thermally conductive particles or the adhesive member is made of a thermally conductive material. 15. The electronic imaging apparatus of claim 3, wherein the camera arm further includes a first connection recess, wherein the connection end of the receiver module extends from the first receiver slot through the first connection recess for attaching to the printed circuit board. 16. The electronic imaging apparatus of claim 3, wherein the camera arm further includes a second connection recess, the connection end of the camera module extending from the second receiving groove through the second connection recess for attaching to the printed circuit board. 17. The electronic imaging apparatus according to claim 1, wherein the connection end of the receiving module and the transmission module are attached to the same side of the circuit board, or the connection end of the reception module and the transmission module are attached to opposite sides of the circuit board. 18. An electronic imaging device according to claim 8, wherein the viewing angle of the transmitter is in the range of 15° to 25°.

Images