RU2687316C2 - Способ монтажа светодиодных светильников - Google Patents
Способ монтажа светодиодных светильников Download PDFInfo
- Publication number
- RU2687316C2 RU2687316C2 RU2016109349A RU2016109349A RU2687316C2 RU 2687316 C2 RU2687316 C2 RU 2687316C2 RU 2016109349 A RU2016109349 A RU 2016109349A RU 2016109349 A RU2016109349 A RU 2016109349A RU 2687316 C2 RU2687316 C2 RU 2687316C2
- Authority
- RU
- Russia
- Prior art keywords
- copper
- led
- thickness
- electrodes
- printed
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims abstract description 14
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 53
- 229910052802 copper Inorganic materials 0.000 claims abstract description 52
- 239000010949 copper Substances 0.000 claims abstract description 51
- 239000000758 substrate Substances 0.000 claims abstract description 15
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 8
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 6
- 238000009434 installation Methods 0.000 claims abstract description 6
- 229910000679 solder Inorganic materials 0.000 claims description 2
- 239000000853 adhesive Substances 0.000 claims 1
- 230000001070 adhesive effect Effects 0.000 claims 1
- 229910052751 metal Inorganic materials 0.000 abstract description 9
- 239000002184 metal Substances 0.000 abstract description 9
- 238000005530 etching Methods 0.000 abstract description 7
- 238000004519 manufacturing process Methods 0.000 abstract description 7
- 239000011889 copper foil Substances 0.000 abstract description 4
- 239000013078 crystal Substances 0.000 abstract description 4
- 230000006866 deterioration Effects 0.000 abstract description 2
- 230000004907 flux Effects 0.000 abstract description 2
- 239000000463 material Substances 0.000 abstract description 2
- 238000005476 soldering Methods 0.000 abstract description 2
- 239000002313 adhesive film Substances 0.000 abstract 2
- 238000004026 adhesive bonding Methods 0.000 abstract 1
- 230000000694 effects Effects 0.000 abstract 1
- 238000009413 insulation Methods 0.000 abstract 1
- 239000000126 substance Substances 0.000 abstract 1
- 239000010408 film Substances 0.000 description 11
- 239000010410 layer Substances 0.000 description 10
- 239000012790 adhesive layer Substances 0.000 description 3
- 238000003698 laser cutting Methods 0.000 description 3
- 238000004364 calculation method Methods 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 230000007423 decrease Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 238000005554 pickling Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000008929 regeneration Effects 0.000 description 1
- 238000011069 regeneration method Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V21/00—Supporting, suspending, or attaching arrangements for lighting devices; Hand grips
- F21V21/005—Supporting, suspending, or attaching arrangements for lighting devices; Hand grips for several lighting devices in an end-to-end arrangement, i.e. light tracks
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/10—Arrangement of heat-generating components to reduce thermal damage, e.g. by distancing heat-generating components from other components to be protected
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
- H05K3/202—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using self-supporting metal foil pattern
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Led Device Packages (AREA)
- Fastening Of Light Sources Or Lamp Holders (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
RU2016109349A RU2687316C2 (ru) | 2016-03-16 | 2016-03-16 | Способ монтажа светодиодных светильников |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
RU2016109349A RU2687316C2 (ru) | 2016-03-16 | 2016-03-16 | Способ монтажа светодиодных светильников |
Publications (3)
Publication Number | Publication Date |
---|---|
RU2016109349A RU2016109349A (ru) | 2017-09-21 |
RU2016109349A3 RU2016109349A3 ( ) | 2019-04-10 |
RU2687316C2 true RU2687316C2 (ru) | 2019-05-13 |
Family
ID=59930884
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
RU2016109349A RU2687316C2 (ru) | 2016-03-16 | 2016-03-16 | Способ монтажа светодиодных светильников |
Country Status (1)
Country | Link |
---|---|
RU (1) | RU2687316C2 ( ) |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5857767A (en) * | 1996-09-23 | 1999-01-12 | Relume Corporation | Thermal management system for L.E.D. arrays |
EP2190012A1 (en) * | 2007-09-13 | 2010-05-26 | Omron Corporation | Apparatus with heating part |
RU2570652C1 (ru) * | 2014-07-15 | 2015-12-10 | Владимир Вячеславович Павлов | Интегрированный блок для светодиодного светильника и способ его изготовления |
US9255702B2 (en) * | 2010-08-02 | 2016-02-09 | Osram Opto Semiconductors Gmbh | LED lighting module for vehicle headlight |
US9417494B2 (en) * | 2011-12-23 | 2016-08-16 | Samsung Electronics Co., Ltd. | Display module and display apparatus having the same |
US9587814B2 (en) * | 2010-04-21 | 2017-03-07 | Cooper Technologies Company | LED luminaire assembly |
US9657924B2 (en) * | 2012-01-12 | 2017-05-23 | Longwide Technology Inc. | LED 3D curved lead frame of illumination device |
US20180049308A1 (en) * | 2015-03-09 | 2018-02-15 | Ledlitek Co., Ltd | Flexible circuit board assembly for led lamp |
-
2016
- 2016-03-16 RU RU2016109349A patent/RU2687316C2/ru not_active IP Right Cessation
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5857767A (en) * | 1996-09-23 | 1999-01-12 | Relume Corporation | Thermal management system for L.E.D. arrays |
EP2190012A1 (en) * | 2007-09-13 | 2010-05-26 | Omron Corporation | Apparatus with heating part |
US9587814B2 (en) * | 2010-04-21 | 2017-03-07 | Cooper Technologies Company | LED luminaire assembly |
US9255702B2 (en) * | 2010-08-02 | 2016-02-09 | Osram Opto Semiconductors Gmbh | LED lighting module for vehicle headlight |
US9417494B2 (en) * | 2011-12-23 | 2016-08-16 | Samsung Electronics Co., Ltd. | Display module and display apparatus having the same |
US9657924B2 (en) * | 2012-01-12 | 2017-05-23 | Longwide Technology Inc. | LED 3D curved lead frame of illumination device |
RU2570652C1 (ru) * | 2014-07-15 | 2015-12-10 | Владимир Вячеславович Павлов | Интегрированный блок для светодиодного светильника и способ его изготовления |
US20180049308A1 (en) * | 2015-03-09 | 2018-02-15 | Ledlitek Co., Ltd | Flexible circuit board assembly for led lamp |
Also Published As
Publication number | Publication date |
---|---|
RU2016109349A (ru) | 2017-09-21 |
RU2016109349A3 ( ) | 2019-04-10 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | The patent is invalid due to non-payment of fees |
Effective date: 20190611 |