RU2534954C2 - Device for cpu cooling using subliming - Google Patents

Abstract

FIELD: radio engineering, communication.

SUBSTANCE: invention pertains to radio electronics and can be used for controlling the temperature of contemporary computer CPUs. The device contains CPU heat transfer system using thermal module and cooler. There is a subliming system installed between thermal module and radiator. The said system comprises a rotating drum with the substance to be sublimed and two slots. The lower slot is used to transfer heat from thermal module to rotating drum, where subliming is performed. The upper slot is used to transfer heat from the drum to cooler.

EFFECT: higher CPU cooling efficiency.

1 dwg

Description

The invention relates to electronics and can be used to normalize the temperature of the processors of modern computers.

At present, a cooler installed on it, consisting of a radiator and a fan, is used to cool the computer processor [1]. But the use of such a cooler has several disadvantages:

1. does not allow to provide the necessary level of dust protection;

2. not able to provide temperatures below room temperature and is not acceptable for temperature control;

3. The inertia of cooling.

The closest analogue of the present invention is a device [2]. It uses a thermal module and a container with a melting substance to cool the processor. The use of such a cooling system does not provide sufficiently uniform heat dissipation over the area of the processor casing.

The aim of the invention is to provide a device that allows for efficient cooling of a computer processor.

The solution to this problem is possible when using semiconductor thermoelectric devices based on elements, in principle, the operation of which is based on the Peltier effect - thermoelectric modules (thermo modules).

The proposed design is a simple and reliable device for providing the required temperature regime of the processor (Figure 1).

This device contains a thermal module 2 for cooling the processor 1, a sublimation system consisting of a rotating drum 4, in which the sublimation substance is located, and two grooves, lower 3 and upper 5, a cooler 6 for removing heat from the sublimation system.

In the process, the thermal module 2 cools the processor 1 and transfers the heat removed from it to the sublimation system. Then, heat passes through the lower groove 3 into the rotating drum 4. The substance located in the rotating drum evaporates. Vapors of the substance settle in the upper part of the rotating drum, which has a lower temperature, and crystallize. In this case, heat is transferred to the upper groove 5 of the sublimation system and then, through the cooler 6, to the environment. The newly formed crystallized substance in the upper part of the drum during its rotation moves to the lower part (the area of contact with the lower groove). Then the substance is heated again and the whole described process is repeated. Thus, the sublimation of a substance in a rotating drum is cyclically repeated and the removal of heat generated by the processor continues.

The use of this cooling scheme will ensure efficient heat removal from the processor. At the same time, the inertia of thermal stabilization of the processor is significantly reduced and uniform heat dissipation is ensured over the area of the processor casing.

Literature

1. Kapinos V.I., Antonov G.V. Temperature control system by controlling the speed of an asynchronous electric fan drive. - Questions of radio electronics. Ser. TRTO, 1980, issue 2.

2. Japanese Patent No. 3192799, cl. H05K 7/20, publ. 08/22/1991.

3. Zorin I.V., Zorina Z.L. Thermoelectric refrigerators and generators. L .: Energy, 1973.

Claims (1)

A device for cooling a computer processor using sublimation, comprising a system for removing heat from the computer processor by means of a thermal module and a cooler, characterized in that between the thermal module and the radiator there is a sublimation system consisting of a rotating drum in which the sublimation substance is located, and two grooves, the upper and lower, while the lower groove serves to remove heat from the thermal module and transfers it to the rotating drum, in which sublimation takes place, and the upper groove serves to remove heat from the drum and to transmit it in the cooler, from which heat is removed.