RU2256946C2 - Thermo-electric device for thermal adjustment of computer processor with use of melting substance - Google Patents

Abstract

FIELD: electric engineering.

SUBSTANCE: device has computer system block, thermoelectric module, cooling system block, heat drain for draining heat from thermoelectric module to environment, heat guide for draining heat from cooled computer system block, thermoelectric module for thermostatting of processor, container with melting substance, heat guide for draining heat from thermoelectric module, processor, power block.

EFFECT: higher reliability, higher efficiency, broader functional capabilities.

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Description

The invention relates to electronics and can be used to normalize the temperature of the processors of modern computers.

Currently, a cooling fan is used to cool the computer processor [1]. But the use of a fan has several disadvantages:

1. the fan does not allow to provide the necessary level of dust protection;

2. the fan is not able to provide temperatures above room temperature and is not acceptable for temperature control;

3. The fan is inertial.

An analogue of this invention is a device [2]. It uses a thermoelectric module to cool the processor. But this device does not use a container with a melting substance, and to cool the computer system unit, it is not a thermoelectric module that is used, but a fan that does not allow changing the temperature in the computer system unit.

The aim of the invention is to provide a device to provide thermal control of the computer.

The solution to this problem is possible using semiconductor thermoelectric devices based on elements, in principle, the operation of which is based on the Peltier effect - thermoelectric modules.

The proposed design is a simple and reliable device to ensure the required temperature regime of the computer system unit (see drawing).

This device comprises a computer system unit 1, a thermoelectric module 2, a cooling system unit, a heat sink 3 for removing heat from the thermoelectric module to the environment, a heat sink 4 for removing heat from the cooled system unit of the computer, a thermoelectric module 5 intended for thermostating the processor, a container with consumable substance 6, heat sink 7 for removing heat from the thermoelectric module, processor 8, power supply 9.

During operation of the computer, the container with the melting substance 6 absorbs the heat generated by the processor 8. On the other hand, the container with the melting substance 6 is cooled by the thermoelectric module 5. The temperature of the melting substance remains constant. The heat sink 7 removes heat from the thermoelectric module 5 into the air in the volume of the system unit. At the same time, thermoelectric module 2 cools the air in the volume of the computer system unit by means of heat sink 4 from the cold junctions of thermoelectric module 2. And heat sink 3 removes heat from the hot junctions of thermoelectric module 2.

For the computer, it is most important to provide the required temperature mode of the processor. In the proposed device to maintain the required temperature of the processor, a thermoelectric module and a container with a melting substance are used. Some metals and their alloys, some crystalline hydrates can serve as such a substance. Organic substances such as paraffin, lauric, palmitic, elaidic acids, which have better technological and operational properties compared to other melting substances, are especially promising with the use of structural fillers that increase their effective thermal conductivity.

A container with a melting substance is cooled on one side and heated on the other. The high thermal conductivity of the melting substance provides effective heat removal from the processor and thereby allows the cooling system to more accurately respond to the occurrence of thermal loads in the processor. At the same time, the entire volume of the computer system unit is cooled by another thermoelectric module.

The use of this cooling scheme will allow observing the temperature regime in the processor with greater accuracy. This significantly reduces the inertia of thermal stabilization of the processor.

Literature:

1. Kapinos V.I., Antonov G.V. Temperature control system by controlling the speed of an asynchronous electric fan drive. - Questions of radio electronics. Ser. TRTO, 1980, no. 2.

2. Japanese Patent No. 3192799, cl. H 05 K 7/20, publ. 08/22/1991.

3. Zorin I.V., Zorina Z.L. Thermoelectric refrigerators and generators. L .: Energy, 1973.

Claims (1)

A thermoelectric device for thermoregulating a computer processor using a melting substance, comprising a system for removing heat from the computer processor by means of a thermoelectric module, characterized in that it contains a container with a melting substance brought into thermal contact with the processor, which during operation of the computer removes heat from the processor from one side and, on the other hand, it is cooled by a thermoelectric module, from which, in turn, heat is removed by a metal heat sink to the air in the volume of the computer system unit, while the system for cooling the computer system unit is operating, which consists of a thermoelectric module that cools the air in the computer system unit, a heat sink that removes heat from the cooled computer system unit to the thermoelectric module, and a heat sink that removes heat from the thermoelectric module into the environment.