RU2304390C2 - Method for preparing of wafer products - Google Patents

Abstract

FIELD: food-processing industry, in particular, production of confectioneries such as wafer products.

SUBSTANCE: method involves preparing wafer dough; forming wafer dough and baking; preparing filler by mixing receipt components; spreading filler onto wafer sheets; forming disk-shaped sheets from wafer dough, said sheets having thickness of 2-4 mm and diameter of 9-10 cm; cutting resultant wafer sheets into two layers; providing spreading of filler by applying hot filler onto one wafer layer, followed by closing of wafer layer containing filler spread thereon with second wafer layer, and pressing said layers by applying single pressing force from the top onto resultant product; cooling and packaging ready products; using stretchable milk-and-fat caramelized mass as filler.

EFFECT: simplified method, reduced processing time due to eliminating the process for spreading of filler on vast surface of wafer sheet and also the process of cutting wafer sheet, and improved quality of wafer product due to avoiding the possibility of breaking the structure of wafer product.

Description

The invention relates to the food industry, to its confectionery industry, and in particular to methods for the production of wafer products.

A known method for the production of wafers, involving the preparation of fillings by mixing the recipe components, the preparation of wafer dough, its molding and baking, spreading the fillings on wafer sheets with the formation of layers and cutting into individual products (Confectionery Handbook. Raw materials and technology for confectionery production. 1966, p. 502- 513).

A known method for the production of wafers, including the preparation of wafer dough, its molding and baking, preparation of the filling by mixing the recipe components, spreading the filling on wafer sheets (RU, 2103875, class A21D 13/08, 1998).

The disadvantages of the known methods are the complexity of the technology for preparing products due to the difficulty of spreading the filling on the wafer sheet during the formation of wafer layers and cutting the layers with the filling, as well as the limited storage time of about two months and insufficiently stable quality indicators.

The technical result to which this invention is directed is to simplify the method and reduce the time of the technological process by eliminating the application of spreading the filling on the large surface of the wafer layer, eliminating the cutting of the wafer layer, expanding the range of wafer products, improving their quality, in particular indicators such as piquant taste and appearance, and increase the shelf life of wafer products without delamination of their structure.

To achieve the specified technical result in a method for the production of wafer products, including the preparation of wafer dough, its molding and baking, preparation of the filling by mixing the recipe components, spreading the filling on wafer sheets, according to the invention, wafer dough is formed into 2-4 mm thick disc-shaped sheets 8-10 cm, the resulting wafer sheets are cut into 2 layers, the filling is smeared by applying hot filling on one wafer layer, then the wafer layer is covered with the beginning with a second waffle layer and press them by pressing once on top of the obtained product, then cool and pack the finished products, and as a filling use a stretching milk-fat caramelized mass.

The essence of the method is illustrated in the following examples.

Example 1. Prepare a waffle dough. All necessary prescription components are loaded into the whipping machine, including melange, phosphatides, vegetable oil, salt, soda and granulated sugar, premium wheat flour. From a wafer dough, sheets of a disk-shaped form with a thickness of 2 mm and a diameter of 8 cm are formed. The resulting products are baked. Cut them into 2 layers. In parallel, they prepare the filling by mixing and boiling the recipe components to obtain a stretching milk-fat caramelized mass. The filling is smeared by applying hot filling on one wafer layer, then cover the wafer layer with the filling with a second waffle layer and press them by pressing once on top of the resulting product. Cool and pack finished products.

Example 2. Carried out analogously to example 1, only from the wafer dough form sheets of a disk-shaped shape with a thickness of 4 mm and a diameter of 10 cm

The proposed method is simpler in comparison with the prototype, because it eliminates the laborious methods of spreading the filling on a large surface of the wafer layer and slicing the wafer layer. The range of wafer products is expanding, their quality is improving and their appearance is improving due to strength properties.

The resulting waffle products have a piquant taste due to the use of a stretching milk-fat caramelized mass as a filling.

The shelf life of wafer products is higher than the known prototype.

Claims (1)

Method for the production of wafer products, including the preparation of wafer dough, its molding and baking, the preparation of the filling by mixing the recipe components, the spreading of the filling on the wafer sheets, characterized in that the wafer dough is formed into disk-shaped sheets 2-4 mm thick and 8-10 cm in diameter the obtained wafer sheets are cut into 2 layers, the filling is smeared by applying hot filling on one wafer layer, then the wafer layer with the filling is covered with a second wafer layer and pressed by one pressing once on top of the product obtained, cool and pack the finished product, and as the filling use a stretching milk-fat caramelized mass.