RU2296395C1 - Method for interconnecting microstrip boards - Google Patents

Abstract

FIELD: radio-electronic engineering including radio equipment manufacture.

SUBSTANCE: proposed method for interconnecting microstrip boards includes their mechanical junction, filling of gaps formed in the process with composition incorporating grade B silicone rubber, catalyst K 68, and capacitor titanium dioxide followed by exposure of joined microstrip boards to room temperature for minimum 2 h.

EFFECT: reduced microwave energy loss and standing wave ratio at junction point of microstrip boards.

1 cl, 2 tbl

Description

The invention relates to electronic equipment, in particular to a technology for the manufacture of electronic devices.

A known method of connecting microstrip boards to each other (OST or GOST), based on their mechanical connection, filling the gap formed between the microstrip boards with adhesive “Elastosil 137-83” (TU 6-02-1237-83), including an organosilicon resin (OST 107.460007009- 02 "Adhesives for electronic equipment and communication products. Selection Guide"), and exposure of glued dielectric substrates at room temperature for at least 24 hours.

Closest to the proposed invention is a method for connecting microstrip boards to each other (OST 4GO.054.210-83 “Bonding of metallic and nonmetallic materials. Typical technological operations”), based on their mechanical connection, filling the gap formed between the substrates with the Vixint PK-68 compound comprising silicone rubber SKTN brand B (GOST 14680-79) and catalyst K68 (OST 107.46007-92 "Polymer materials for sealing products of electronic equipment") in the following ratio of components s, g:

Silicone rubber SKTN brand B 90-110 Catalyst K68 2-6

and exposure of the connected microstrip boards at room temperature for at least 24 hours

The disadvantages of these methods are high SWR and large losses of microwave energy at the junction of the microstrip boards.

The technical task of the invention is to reduce the loss of microwave energy and reduce the SWR at the junction of the microstrip boards.

The essence of the invention lies in the fact that the method of connecting microstrip boards to each other includes mechanical joining, filling the gap formed with a composition consisting of SKTN grade B silicone rubber and K68 catalyst, and holding the docked microstrip boards at room temperature for at least 2 hours. New in the invention is that the composition filling the gap between the microstrip boards additionally contains titanium dioxide capacitor, in the following ratio of components, g:

Silicone rubber SKTN brand B 90-110 Catalyst K68 2-6 Capacitor Titanium Dioxide 75-85

The method of attaching microstrip boards to each other is usually used when it is necessary to connect two or more microstrip boards without deteriorating their radio technical characteristics, in particular, increasing SWR and high-frequency energy losses at the junction of one microstrip board with another. To implement the proposed method, dockable microstrip boards are mounted on a flat surface, pressed one end to the other using, for example, a clamping device, and a pre-prepared composition is applied to the joint. The composition is obtained by thorough mixing in a chemical container of silicone rubber SKTN grade B (GOST 14680-79) and condenser titanium dioxide (TU 6-05-1888-80) at a temperature of 25 ± 10 ° С. Then, K68 catalyst (OST 38.03239-81) was added to the resulting mixture, and all were mixed

Table 1 Formulations of the composition of the invention №№ p.p. Components Example 1 Example 2 Example 3 one Silicone rubber 90 one hundred 110 SKTN brand B 2 Catalyst K68 3 four 5 3 Capacitor Titanium Dioxide 75 80 85

The composition is applied, for example, with a lancet at the junction of the microstrip boards and kept for at least 2 hours at room temperature.

table 2 №№ pp Name of radio technical characteristics Example 1 Example 2 Example 3 one. Swr 1.25 <1.1 1,2 2. Loss of microwave energy, dB 0.15 <0.1 0.2

Using the proposed method for connecting microstrip boards to each other, it is possible to virtually eliminate the increase in SWR and the loss of high-frequency energy due to the gap.

Claims (1)

A method of connecting microstrip boards to each other, including mechanical fastening, filling the gap formed with a composition consisting of SKTN grade B silicone rubber and K68 catalyst, and holding at room temperature for at least 2 hours, characterized in that the composition filling the gap between the microstrip boards additionally contains titanium dioxide capacitor in the following ratio of components, g: Silicone rubber SKTN brand B 90-110 Catalyst K 68 2-6 Capacitor Titanium Dioxide 75-85