RU206203U1 - Laser module - Google Patents

Abstract

The utility model relates to the design of optoelectronic laser modules, in particular, to the design of high-precision narrow-band laser modules with fiber-optic output and passive cooling. The laser module contains a split heat sink housing made of a heat-conducting material and including a box-shaped base part 1 made with the possibility of mutual fixation with a laser diode 7 functionally connected to each other fixed on the bottom 6 of the base part 1 and fixed on the support elements of the base part 1 by a multilayer printed unit 5 containing conductive 13, 14 and electrically insulating layers 15, functional fuel elements 21 and means for drainage of heat to the heat sink housing, an interface and power connector 11 and a fiber optic output of an optical signal 9, located in the corresponding windows 10 of the base part 1, and a cover 2, mentioned the supporting elements of the base part 1 are made in the form of an inner peripheral step 4 to adjoin the printed circuit assembly 5, the printed circuit assembly 5 includes n> 1 heat-conducting layers 17, electrically isolated in the inner part of the printed circuit assembly, the outer layers include an electrically insulated heat conductor peripheral surface elements 12, and heat-conducting rod elements 19 are introduced into the printed circuit assembly 5 in the area of its contact with the peripheral step 4 of the base part 1 of the housing, connecting the said heat-conducting layers 17 and electrically insulated heat-conducting peripheral surface elements 12 of the outer layers 13. Technical result - improving the quality of radiation from a high-precision narrow-band laser module. 6 ill.

Description

The utility model relates to the design of optoelectronic laser modules, in particular, to the design of high-precision narrow-band laser modules with fiber-optic output and passive cooling.

A high-precision fiber-optic laser module is known from the prior art, containing a box-shaped housing, to the inner wall of which a heat-generating pipe is welded, a heat-dissipating ring is welded to the outer side of the heat-generating pipe, a heat-conducting silica gel base is installed in the lower part of the housing through bolts, and a heat-conducting silica gel base is installed at the lower end of the convex heat release ring through bolts a metal gasket, a support sleeve is welded to the upper end of the metal gasket, and an exhaust fan is fixedly installed in the support sleeve; a heat dissipation pipe is made in the lower part of the body; a heat sink ring is made on the heat dissipation pipe; the heat dissipation pipe is connected to a heat conductive silica gel base at the bottom of the body; in the lower part of the base of the heat-conducting silica gel there is a metal support for the gasket, in the lower part of the metal gasket there is a support sleeve, an exhaust fan is installed in the support sleeve, the air flow is introduced into the heat dissipation pipe through the exhaust fan, the collection and dissipation of heat is carried out through the heat dissipation pipe (patent CN No. 210744442, publ. 06/12/2020).

The known technical solution has a sufficiently effective heat dissipation system, however, it is unacceptable in most optoelectronic laser modules due to the significant dimensions due to the use of dimensional auxiliary cooling equipment.

In the prior art, a high-precision fiber-optic laser module is known, mounted in a housing, which is driven and mounted next to its driver. To reduce the effect of the heat generated by the driver on the laser, the housing includes a passive heat sink on which the driver is installed, while the heat generated by the driver is dissipated by the passive heat sink (US patent No. 7804867, publ. 09/28/2010).

Unlike the previously considered analogue, this design is very compact, but it has a significant drawback. Since the heat generated by the driver is transferred to the passive heat sink element convectively through the in-house air mass, the heat exchange is not efficient enough, which negatively affects the performance / quality parameters of the laser module, such as accuracy, stability, and reliability.

The closest to the claimed technical solution - a prototype - is a laser module, which includes a split heat sink housing made of a heat-conducting material and including a box-shaped base part made with the possibility of mutual fixation with functionally interconnected laser diode fixed at the bottom of the base part, fixed on the support elements of the base part with a multilayer printed circuit assembly containing conductive and electrically insulating layers, functional fuel elements and means of heat sinking to the heat sink housing in the form of developed convective heat exchange surfaces, an interface and power connector and a fiber-optic output of an optical signal located in the corresponding windows of the base part, and a cover (Site of JSC "LLS" https://lenlasers.ru/ [Electronic resource]. -Access mode: https://lenlasers.ru/product/drajver-dlya-lazernyh-diodov-qc8x1x6x/ with internal link https: // lenlasers .ru / upload / iblock / 994 / QC8x1x6x.LLS.pdf and up additionally https: //lenlasers.ш/product/draj ver-dlya-lazernyh-diodov-tipa-14-pin-babochka /, unlimited (free) - 04/26/2021).

The disadvantages of the prototype should include the same disadvantages as in the above analogue, namely, low quality due to the complexity of providing (without the use of additional technical means, such as, for example, a forced ventilation system, additional cooling devices, etc.) of a narrow strip laser radiation with a width of less than 10 kHz due to ineffective heat removal from the functional elements of the printed circuit assembly, which entails excessive and / or uneven heating of the functional elements of the printed circuit assembly, leads to a thermal imbalance in the operation of the printed circuit assembly and the laser diode and, as a consequence, an increase in thermal noise of the control system laser diode with concomitant broadening of the laser radiation band.

The technical problem solved by the claimed technical solution is the elimination of the above disadvantages by minimizing the thermal effect on the quality of the laser radiation of the laser module.

The technical result is to improve the quality of radiation from a high-precision narrow-band laser module.

The problem is solved, and the claimed technical result is achieved by the fact that in a laser module containing a split heat sink housing made of a thermally conductive material and including a box-shaped base part made with the possibility of mutual fixation with functionally interconnected laser diode fixed at the bottom of the base part, fixed on the reference elements of the base part with a multilayer printed circuit assembly containing conductive and electrically insulating layers, functional fuel elements and means for drainage of heat to the heat sink housing, an interface and power connector and a fiber-optic output of an optical signal located in the corresponding windows of the base part, and a cover, said support elements of the base part are made in the form of an inner peripheral step for adjoining the printed circuit assembly, the printed circuit assembly includes n≥1 heat-conducting layers, electrically isolated in the inner part of the printed circuit assembly, the outer layers include electrically insulated heat-conducting peripheral surface elements, and heat-conducting rod elements are introduced into the printed circuit assembly in the zone of its contact with the peripheral step of the base part of the housing, connecting the said heat-conducting layers and electrically insulated heat-conducting peripheral surface elements of the outer layers; heat sinking body in the form of electrically insulated heat-conducting surface elements formed in the conductive layers of the printed circuit assembly, and heat-conducting rod elements are introduced into the latter, connecting the said heat-conducting surface elements with heat-conducting layers; in addition, it is advisable to design the heat sink means to the heat sink body in the form of electrically insulated heat-conducting surface elements formed in the outer layers of the printed circuit assembly in the zone of contact with the heat-generating elements, and heat is introduced into the printed circuit assembly conductive bar elements connecting said heat-conducting surface elements with heat-conducting layers.

The claimed technical solution is illustrated by the following conventional schematic images:

FIG. 1 - isometric view of the laser module;

FIG. 2 - box-shaped base part of the housing without laser diode and printed circuit assembly, plan view;

FIG. 3 - box-shaped base part of the housing with installed laser diode and printed circuit assembly, plan view;

FIG. 4 - printed circuit assembly from the side of contact with the peripheral border of the base part of the housing, plan view;

FIG. 5 - section a-a in Fig. 4;

FIG. 6 - section b-b in fig. 5.

Numerical positions in the presented conventional images indicate the following:

1 - the base part of the body;

2 - housing cover;

3 - screw (3 ^I - threaded hole for screw 3);

4 - peripheral step;

5 - multilayer printed circuit assembly;

6 - the bottom of the box-shaped base part 1;

7 - laser diode;

8 - electrical outlet;

9 - fiber optic output of the optical signal;

10 - window;

11 - interface and power connector;

12 - electrically insulated heat-conducting peripheral surface elements of the outer layers of the multilayer printed circuit assembly;

13 - outer conductive layers;

14 - internal conductive layers;

15 - electrically insulating layers;

16 - conductive rod elements;

17 - heat-conducting layers;

18 - electrically insulated windows;

19 - heat-conducting rod elements;

20 - conductive tracks;

21 - functional fuel elements;

22 - electrically insulated heat-conducting surface elements;

23 - electrically insulated heat-conducting elements.

As shown in FIG. 1, the claimed laser module is made on the basis of a split heat sink housing made of a thermally conductive material containing a box-shaped base part 1 and a cover 2 made with the possibility of mutual fixation by means of, for example, screws 3.

According to the invention, in the box-shaped base part 1, a peripheral step 4 (Fig. 2) is made, intended for thermal contact with the printed circuit assembly 5, the design of which will be presented below. The bottom 6 of the box-shaped base part 1 is used to install a laser diode 7 on it (Fig. 3, the design is similar to the prototype and therefore is not described in detail within the framework of this application). The laser diode 7 is electrically connected to the printed circuit assembly 5 by means of electrical leads 8 (Fig. 3, the design is similar to the prototype or otherwise known and therefore is not described in detail within the framework of this application). The laser diode 7 has a fiber optic output of the optical signal 9 passing through one of the windows 10 in the box-shaped base part 1. External electrical connections of the printed circuit assembly 5 are carried out through the interface and power connector 11 located in the second window 10 (Fig. 3, execution is similar to the prototype or otherwise known and therefore not described in detail in the framework of this application).

According to the invention, as noted above, the printed circuit assembly 5 has thermal contact with the peripheral step 4 of the box-shaped base part 1 made of a material with high thermal conductivity (for example, copper, brass, aluminum, etc.). The specified thermal contact is provided by the presence of electrically insulated heat-conducting peripheral surface elements 12, which can be, depending on the design features of the laser module and / or its components, either continuous / closed or intermittent / fragmentary.

The printed circuit unit 5 includes external 13 and internal 14 conductive layers separated by electrically insulating layers 15, while the interlayer electrical connections are provided through conductive rod elements 16 made in the printed circuit assembly. layers 17, electrically isolated located in the inside of the printed circuit assembly 5 (Fig. 5 and Fig. 6). If the rod elements 16 intersect the heat-conducting layers 17, electrically insulated windows 18 are formed in the latter. The heat-conducting layers 17 are connected "by heat" to the elements 12 by means of heat-conducting rod elements 19 located outside the zones of intersection with the conductive tracks 20 (Fig. 3 is conventionally shown single track 20, in general, the execution of the tracks does not differ from the prototype, is not the subject of this utility model and does not require additional explanations / images) of conductive layers 13 and 14.

Thus, the claimed technical solution, in fact, realizes a radiator integrated into a multilayer printed circuit board, excellently taking the thermal load from the functional heat-generating elements 21 and efficiently removing excess heat to the heat-dissipating body. In this case, the printed circuit assembly 5 (its printed circuit board) ceases to be a heat accumulator carried by the elements 21, since the aforementioned heat is removed "from the inside" of the printed circuit board along the highly efficient heat removal chain formed by the claimed technical solution: layers 17 - elements 19 - elements 12 - base part 1 - cover 2. In this case, the efficiency of heat removal has the potential to increase due to an increase in the number of layers 17 and the use of an electrically insulating material with high thermal conductivity, for example, a heat-conducting ceramic made of aluminum oxide or nitride as the material of layers 15.

In the dependent claims of the utility model, particular cases of the implementation of an essential feature of an independent claim are disclosed, namely, means of heat sink to the heat sink body, which cannot be implemented within the framework of the above prototype and / or analogue and / or other solutions outside the stated one.

As noted above, in the prototype, the means of heat sinking to the heat sink body is formed by the development of the area of the "receiving" surfaces of convective heat transfer and their heat capacity, provided by the mass inertia. This approach entails a significant increase in the mass and size parameters of the laser module, which is simply unacceptable in a number of applications.

One of the particular technical solutions that allows you to form an effective heat sink from the elements 21 to the heat sink housing is the formation on the outer layers 13 of the printed circuit assembly 5 in the contact zone with the elements 21 of electrically insulated heat-conducting surface elements 22, which are connected "by heat" by means of heat-conducting rod elements 19 with heat-conducting layers 17 - the beginning of the previously considered heat-removing chain: layers 17 - elements 19 - elements 12 - base part 1 - cover 2 (Fig. 5).

Another particular technical solution that allows you to form an effective heat sink from the heat-consuming internal conductive layers 14, it is proposed to implement the heat sink means to the heat-dissipating body in the form of electrically insulated heat-conducting elements 23 formed in the conductive layers 14 of the printed circuit assembly 5, connected "by heat" by means of heat-conducting rod elements 19 with heat-conducting layers 17 - the beginning of the previously considered heat-removing chain: layers 17 - elements 19 - elements 12 - base part 1 - cover 2 (Fig. 5).

In addition to the organization of effective heat removal described above, the rest of the claimed technical solution works in accordance with the functionality laid down in it, similar to the prototype and does not need additional explanations.

The experiments carried out confirmed the high efficiency of the claimed technical solution, a decrease in thermal noise by 15% or more compared to the prototype and, as a consequence, the ability to narrow the line of the laser radiation band to values less than 10 kHz.

Thus, the foregoing allows us to conclude that the technical problem - minimizing the thermal effect on the quality of laser radiation of the laser module - has been solved, and the claimed technical result - improving the radiation quality of a high-precision narrow-band laser module - has been achieved.

Claims (3)

1. A laser module containing a split heat sink housing made of a heat-conducting material and including a box-shaped base part made with the possibility of mutual fixation with a laser diode, which is functionally connected to each other and fixed on the bottom of the base part, fixed on the support elements of the base part by a multilayer printed circuit containing conductive and electrically insulating layers, functional fuel elements and means of heat sinking to the heat sink housing, interface and power connector and optical fiber output of the optical signal located in the corresponding windows of the base part, and a cover, characterized in that said support elements of the base part are made in the form of an inner peripheral step for adjoining a printed circuit assembly to it, the printed circuit assembly includes n≥1 heat-conducting layers, electrically insulated located in the inner part of the printed circuit assembly, the outer layers include electrically insulated heat-conducting peripheral surfaces the remaining elements, and heat-conducting rod elements are introduced into the printed circuit assembly in the zone of its contact with the peripheral step of the base part of the housing, connecting the said heat-conducting layers and electrically insulated heat-conducting peripheral surface elements of the outer layers. 2. The laser module according to claim 1, characterized in that the heat sink means to the heat sink housing is made in the form of electrically insulated heat-conducting surface elements formed in the conductive layers of the printed circuit assembly, and heat-conducting rod elements are introduced into the latter, connecting said heat-conducting surface elements with heat-conducting layers. 3. The laser module according to claim 1, characterized in that the heat sink means to the heat sink housing is made in the form of electrically insulated heat-conducting surface elements formed in the outer layers of the printed circuit assembly in the contact zone with the fuel elements, and heat-conducting rod elements are introduced into the printed circuit assembly, connecting said heat-conducting surface elements with heat-conducting layers.

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