RU203464U1 - Heat-loaded electronic device - Google Patents

Abstract

The utility model relates to the field of airborne and ground-based radio-electronic transmitting and receiving apparatus and equipment. The technical result is an increase in the density of the arrangement of the electronic device with a greater dissipating power. It is achieved by the fact that in the device the heat sink base with side walls is made in the form of a lower block installed on the heat sink surface, and the cover is made in the form of an upper block, on the outer upper surface of which a radiator is located. The blocks contain sets of printed circuit boards and are electrically connected to each other using flexible mounting located in the switching area, while the boards with heat-loaded elements in the blocks are spaced in such a way that those in the lower block are located on the inner surface of the block, which is in contact with the outer side with the heat sink base , and boards with heat-loaded elements located in the upper block are located on the inner upper surface of the block, which is in contact with the outside of the heatsink. 1 wp f-ly, 4 dwg

Description

The utility model relates to the field of on-board and ground-based radio-electronic transmitting and receiving equipment and equipment and can be used in the design of on-board analog and digital devices with power supplies, for example, as part of power supply systems, thermal control systems and systems for transmitting commands and power distribution, as well as as part of mobile and stationary means in receiving and transmitting equipment and other configurations.

Known electronic unit, selected for analogue, with natural air cooling [Patent No. 2246806 RF, IPC N05K 1/00, N05K 7/20. Radioelectronic unit / V.N. Korulin et al. // Inventions. Utility models. Publ. 02/20/2005. Bul. No. 5]. The unit includes a heat sink housing with upper and lower inner compartments, which are separated from each other by a heat-conducting screen made in the form of two chassis arranged one above the other with a gap, which has thermal contact with the housing. The lower compartment houses a heat-resistant electronic unit with a gap in relation to the lower surface of the lower chassis, made to reflect thermal radiation. The upper compartment houses a heat-sensitive electronic unit with thermal contact with the upper chassis. The part of the body that encloses the upper compartment is equipped with perforations.

The disadvantages of this design are low heat dissipation parameters and weight and size characteristics associated with providing cooling only due to natural air circulation in the upper compartment through the housing openings.

The best heat dissipation is provided by the design of the radio electronic unit with the placement of heat-loaded radio elements on the heat-removing layer of printed circuit boards, where the metal body of the block is formed by heat-removing layers of printed circuit boards, and the walls of the body are equipped with cooling fins [Patent No. 2406282 RF, IPC N05K 7/20. Electronic unit with heat sink and shielding / Smirnov P.V. et al. // Inventions. Utility models. Publ. 10.12.2010. Bul. №34], selected for the analogue. A design feature is the separate placement of heat-loaded and non-heat-loaded elements, which will limit the effect of elevated temperatures on the latter.

The disadvantage of this design is that the heat dissipation is carried out due to the cooling fins, which are formed only on the side surfaces of the case and have a small area. This design is difficult to install and adjust due to the need to place the boards on top of each other, which makes it difficult to access the internal elements.

The known design of the radioelectronic unit with heat dissipation by the entire outer surface of the case, due to the application on the outer surface of the case of a coating with anisotropic thermal conductivity and the placement of radioelements so that non-heat-loaded radioelements are placed inside the case, and heat-loaded from its outer side [Patent No. 2374792 RF, IPC N05K 1 / 00, Н05К 7/20. Radio-electronic unit and method of its cooling / Kuzin G.K. et al. // Inventions. Utility models. Publ. 11/27/2009. Bul. №33], selected for the analogue.

The disadvantages of this design are low mechanical strength and the inability to seal the unit when placing heat-loaded elements on the outer side of the case.

The closest in technical essence and the achieved result to the proposed technical solution is the electronic unit [Patent No. 2671852 RF, IPC N05K 7/20, N05K 1/18. Heat-loaded radio-electronic unit / Shumskikh I.Yu. et al. // Inventions. Utility models. Publ. 11/07/2018. Bul. No. 31], selected for the prototype.

The radio electronic unit consists of a heat sink base (item 1 of Fig. 1) and a set of parallel flat printed circuit boards (item 2 and item 3 of FIG. 1), electrically connected to each other (item 8 of FIG. 1), while the printed circuit boards (item 2 of Fig. 1) are installed on a heat sink base, above which additional printed circuit boards (item 3 of FIG. 1) with electric radio elements (item 4 of FIG. 1), fastening elements (item 12 of FIG. 1) are also placed. The lateral sides of the heat sink base (item 1 of Fig. 1) are heat sinks (item 5 of FIG. 1), on the side of which the heat sink base has protrusions (item 6 of FIG. 1), on which the heat transfer plate is fixed (item 7 of FIG. . 1) under additional printed circuit boards, while on the heat-conducting plate, in addition to its attachment points, a heat-absorbing coating is applied, electrically insulating additional printed circuit boards from the heat-conducting plate, and heat-loaded elements are installed as close as possible to the places where the heat-conducting plate is attached, while the heat-dissipating base, on which is fixed the cover (pos. 9 in Fig. 1) is fixed to the mounting surface (pos. 10 in Fig. 1) through a heat-conducting paste (pos. 11 in Fig. 1).

The disadvantage of the above invention is that the inner heat-conducting plate has a small thickness and contact area with the heat-dissipating base, which significantly limits the heat flux from the heat-generating elements located on the plate, while the cover, which has a larger surface area and volume than the plate, does not participate in heat transfer process. In addition, plate-mounted PCBs must be single-sided, which increases the number of boards and board-to-board electrical connections.

The technical result of the utility model is to increase the density of the arrangement of the electronic device with a greater dissipating power.

The technical result is achieved in that the heat-loaded radio-electronic device, including a set of printed circuit boards and fastening elements, consists of two blocks mounted on top of each other, which are the supporting structures of the radio-electronic device, forming its body, and which are electrically connected to each other using flexible mounting, located in the switching area, or the cut-in connector. The blocks contain printed circuit boards with thermally loaded electrical radio elements and double-sided printed circuit boards with non-thermally loaded elements. The case of the lower unit is made with the possibility of placing on its inner bottom surface of the printed circuit boards with heat-loaded electric radio elements, and the outer bottom side is in contact with the heat-dissipating base. The housing of the upper block is made with the possibility of placing on its inner upper surface of the printed circuit boards with heat-loaded electric radio elements, and its outer upper side is a radiator. In this case, boards with non-heat-loaded elements in blocks are installed on the sides of the block cases opposite to boards with heat-loaded elements.

In addition, each block is sealed and has additional printed circuit boards that do not require sealing, placed in a leaky volume between the upper and lower blocks inside the total volume formed by the walls of their cases so that the upper outer surface of the lower block is the bottom of the leaky compartment, and the lower outer the surface of the upper block is a lid.

The prototype device is illustrated in figure 1.

FIG. 1 shows a general view of the prototype device, where the designations are introduced:

1 - heat sink base (surface);

2 - printed circuit boards;

3 - additional printed circuit boards;

4 - electric radio elements;

5 - heat sinks;

6 - projections on which the heat sink plate is fixed;

7 - heat sink plate;

8 - connection of printed circuit boards and additional printed circuit boards by flexible volumetric wiring;

9 - cover;

10 - mounting surface;

11 - heat-conducting paste;

12 - fasteners.

The claimed device is illustrated by the following figures.

FIG. 2 shows the claimed device in assembled form, where the designations are introduced:

13 - the first block (top);

14 - second block (bottom);

15 - heat sink base (surface);

16 - radiator;

17 - side cover covering the switching area.

FIG. 3 shows a general view of the device, where:

18 - upper wall of the lower block;

19 - printed circuit boards;

20 - heat-loaded elements (electric radio elements);

21 - bottom wall of the upper block;

22 - heat-loaded elements (electric radio elements);

23 - fastening elements.

FIG. 4 shows a cross-section of the device.

The proposed electronic device shown in FIG. 2-4, consists of two blocks 13 and 14, mounted on top of each other and on the heat-removing surface 15, which are the supporting structures of the electronic device, forming its body. The role of the heat-dissipating surface during onboard placement can be an element of the supporting structure. Blocks 13 and 14 are electrically connected to each other by flexible volumetric mounting located in the switching area closed by the side cover 17 (electrical connection of the blocks is possible using a cut-in connector located inside the housings).

Each of the blocks can be sealed, consist of heat-loaded elements 20 and 22, a set of double-sided printed circuit boards 19, etc. A radiator 16 is made on the outer surface of the upper block 13. The shape and number of fins is selected based on the presence and direction of the blowing and the amount of power dissipated. At the bottom of the block 13 or in the upper part of the block 14, a set of double-sided printed circuit boards with non-thermally loaded elements can be installed (pos. 19 in Fig. 3 and Fig. 4).

The device works as follows. When the heat-loaded radio-electronic device is turned on, the power dissipated by the electric radio elements 20 is transmitted to the lower surface of the housing of the lower unit 14 and then to the heat-removing base of the product due to contact heat exchange between the device housing and the supporting structure. Thermal energy from the elements 22 is transferred to the upper surface of the upper block 13, which is a radiator, and then escapes due to convection from the radiator surface, to a greater extent is dissipated into the environment, and to a lesser extent is transferred to the lower block housing through the side walls. Thus, the supporting structures of the device, which are the most massive parts, are used as heat conductors, and the heat spreads over the outer surfaces of the device, which, in turn, ensures the optimal thermal mode of operation of the printed circuit boards 19 and the device as a whole. To improve heat transfer between the blocks through the side walls at the joints between the block bodies, it is possible to use heat-conducting pastes.

When each block is made sealed, if it is necessary to place additional printed circuit boards that do not require sealing, these boards can be placed in a leaky compartment formed between the upper (pos. 13 in Fig. 2) and lower (pos. 14 in Fig. 2) blocks inside the total volume formed by their walls so that the upper outer surface of the lower block (item 18 in Fig. 3) will be its bottom, and the lower outer surface of the upper block (item 21 in Fig. 3) is a cover.

The proposed heat-loaded electronic device allows, in comparison with the prototype, to increase the density of the layout of the electronic device with a higher dissipating power due to the use of the upper block housing simultaneously as a supporting structure element and a radiator for dissipating heat from heat-loaded elements installed on it into the environment while maintaining short electrical connections between printed circuit boards.

Thus, the claimed technical solution will improve the efficiency of the heat-loaded radio electronic device - to reduce the size and extend the period of its continuous operation by improving heat removal from high-power electrical radio elements, as well as maintainability and manufacturability at the stage of assembly and disassembly.

Claims (2)

1. A heat-loaded radio-electronic device, including a set of printed circuit boards, fastening elements, characterized in that it consists of two blocks mounted on top of each other, which are the supporting structures of the radio-electronic device that form its body, and are electrically connected to each other using flexible mounting located in the switching area, or cut-in connector, the blocks contain printed circuit boards with heat-loaded electrical radio elements and double-sided printed circuit boards with non-heat-loaded elements, the case of the lower block is designed to be placed on its inner lower surface of the printed circuit boards with heat-loaded electrical radio elements located in it, and the outer lower side is in contact with the heat sink base, the body of the upper block is made with the possibility of placing on its inner upper surface of the printed circuit boards with heat-loaded electric radio elements, and its outer upper side is a radiator, while the boards with non-heat-loaded elements in blocks are installed on the sides of the block cases opposite to the boards with heat-loaded elements. 2. The device according to claim. 1, characterized in that each block is sealed and has additional printed circuit boards that do not require sealing, placed in a leaky volume between the upper and lower blocks inside the total volume formed by the walls of their cases so that the upper outer surface of the lower the unit is the bottom of the leaky compartment, and the lower outer surface of the upper unit is the cover.

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