RU2014117546A - MULTILAYER CERAMIC BOARD COOLING DEVICE - Google Patents

MULTILAYER CERAMIC BOARD COOLING DEVICE Download PDF

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Publication number
RU2014117546A
RU2014117546A RU2014117546/07A RU2014117546A RU2014117546A RU 2014117546 A RU2014117546 A RU 2014117546A RU 2014117546/07 A RU2014117546/07 A RU 2014117546/07A RU 2014117546 A RU2014117546 A RU 2014117546A RU 2014117546 A RU2014117546 A RU 2014117546A
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RU
Russia
Prior art keywords
ceramic layers
cooling device
board
multilayer ceramic
channels
Prior art date
Application number
RU2014117546/07A
Other languages
Russian (ru)
Other versions
RU2605432C2 (en
Inventor
Сергей Борисович Сунцов
Валерий Александрович Деревянко
Original Assignee
Открытое акционерное общество "Информационные спутниковые системы" имени академика М.Ф. Решетнева"
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Publication date
Application filed by Открытое акционерное общество "Информационные спутниковые системы" имени академика М.Ф. Решетнева" filed Critical Открытое акционерное общество "Информационные спутниковые системы" имени академика М.Ф. Решетнева"
Priority to RU2014117546/07A priority Critical patent/RU2605432C2/en
Publication of RU2014117546A publication Critical patent/RU2014117546A/en
Application granted granted Critical
Publication of RU2605432C2 publication Critical patent/RU2605432C2/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

1. Устройство охлаждения многослойной керамической платы, состоящее из герметичной полости внутри керамических слоев платы, образованной пористой структурой с совокупностью каналов, отличающееся тем, что пористая структура имеет вид пористой металлической ленты (например, медной), содержащей внутренние каналы и помещенной между верхними керамическими слоями.2. Устройство охлаждения многослойной керамической платы, состоящее из герметичной полости внутри керамических слоев платы, образованной пористой структурой с совокупностью каналов, отличающееся тем, что часть пористой металлической ленты установлена в верхних керамических слоях в местах теплоотводов от электрорадиоэлементов, а оставшаяся часть в изогнутом состоянии в нижних керамических слоях.3. Устройство охлаждения многослойной керамической платы по п. 2, отличающееся тем, что пористая металлическая лента в верхних керамических слоях соединена с теплоотводами электрорадиоэлементов с помощью тепловых перемычек.1. The cooling device of a multilayer ceramic board, consisting of a sealed cavity inside the ceramic layers of the board, formed by a porous structure with a set of channels, characterized in that the porous structure has the form of a porous metal tape (for example, copper) containing internal channels and placed between the upper ceramic layers .2. A cooling device for a multilayer ceramic board, consisting of a sealed cavity inside the ceramic layers of the board, formed by a porous structure with a set of channels, characterized in that a part of the porous metal tape is installed in the upper ceramic layers in the places of heat sinks from the electrical elements, and the remaining part in a bent state in the lower ceramic layers. 3. A cooling device for a multilayer ceramic board according to claim 2, characterized in that the porous metal strip in the upper ceramic layers is connected to the heatsinks of the electrical radio elements using thermal jumpers.

Claims (3)

1. Устройство охлаждения многослойной керамической платы, состоящее из герметичной полости внутри керамических слоев платы, образованной пористой структурой с совокупностью каналов, отличающееся тем, что пористая структура имеет вид пористой металлической ленты (например, медной), содержащей внутренние каналы и помещенной между верхними керамическими слоями.1. The cooling device of a multilayer ceramic board, consisting of a sealed cavity inside the ceramic layers of the board, formed by a porous structure with a set of channels, characterized in that the porous structure has the form of a porous metal tape (for example, copper) containing internal channels and placed between the upper ceramic layers . 2. Устройство охлаждения многослойной керамической платы, состоящее из герметичной полости внутри керамических слоев платы, образованной пористой структурой с совокупностью каналов, отличающееся тем, что часть пористой металлической ленты установлена в верхних керамических слоях в местах теплоотводов от электрорадиоэлементов, а оставшаяся часть в изогнутом состоянии в нижних керамических слоях.2. The cooling device of a multilayer ceramic board, consisting of a sealed cavity inside the ceramic layers of the board, formed by a porous structure with a set of channels, characterized in that a part of the porous metal tape is installed in the upper ceramic layers in the places of heat sinks from the electrical elements, and the remaining part in a bent state in lower ceramic layers. 3. Устройство охлаждения многослойной керамической платы по п. 2, отличающееся тем, что пористая металлическая лента в верхних керамических слоях соединена с теплоотводами электрорадиоэлементов с помощью тепловых перемычек. 3. The cooling device for a multilayer ceramic board according to claim 2, characterized in that the porous metal strip in the upper ceramic layers is connected to the heatsinks of the radio electronic elements by means of thermal jumpers.
RU2014117546/07A 2014-04-29 2014-04-29 Multilayer ceramic plate cooling device RU2605432C2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
RU2014117546/07A RU2605432C2 (en) 2014-04-29 2014-04-29 Multilayer ceramic plate cooling device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
RU2014117546/07A RU2605432C2 (en) 2014-04-29 2014-04-29 Multilayer ceramic plate cooling device

Publications (2)

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RU2014117546A true RU2014117546A (en) 2015-11-10
RU2605432C2 RU2605432C2 (en) 2016-12-20

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Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020005094A1 (en) * 2018-06-29 2020-01-02 Общество с ограниченной ответственностью "Теркон-КТТ" Passive thermal control system based on a loop heat pipe
RU189664U1 (en) * 2018-10-25 2019-05-30 Федеральное государственное бюджетное образовательное учреждение высшего образования "Московский авиационный институт (национальный исследовательский университет)" The receiving and transmitting module AFAR with a heat sink base in the form of a flat heat pipe
RU190079U1 (en) * 2019-02-26 2019-06-18 Акционерное общество "Концерн "Созвездие" Onboard equipment case
RU190948U1 (en) * 2019-03-12 2019-07-17 Акционерное общество "Концерн "Созвездие" Onboard equipment case

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3402003A1 (en) * 1984-01-21 1985-07-25 Brown, Boveri & Cie Ag, 6800 Mannheim PERFORMANCE SEMICONDUCTOR MODULE
SU1325963A1 (en) * 1985-05-23 1991-08-07 Истринское Отделение Всесоюзного Электротехнического Института Им.В.И.Ленина Electronic module
SU1751830A1 (en) * 1990-01-22 1992-07-30 Ивановский энергетический институт им.В.И.Ленина Semiconductor device
RU53072U1 (en) * 2005-04-06 2006-04-27 Федеральное государственное унитарное предприятие "Научно-исследовательский институт Научно-производственное объединение "ЛУЧ" (ФГУП "НИИ НПО "ЛУЧ") DEVICE FOR COOLING AND THERMOSTATING SEMICONDUCTOR DEVICES
RU2510732C2 (en) * 2012-08-02 2014-04-10 Федеральное государственное бюджетное учреждение науки Институт теплофизики им. С.С. Кутателадзе Сибирского отделения Российской академии наук (ИТ СО РАН) Light-emitting diode module cooling system

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