RU2009120673A - METHOD FOR COOLING SEMICONDUCTOR HEAT-DETECTING ELECTRONIC COMPONENTS THROUGH BIMETALLIC THERMOELECTRIC ELECTRODES - Google Patents
METHOD FOR COOLING SEMICONDUCTOR HEAT-DETECTING ELECTRONIC COMPONENTS THROUGH BIMETALLIC THERMOELECTRIC ELECTRODES Download PDFInfo
- Publication number
- RU2009120673A RU2009120673A RU2009120673/28A RU2009120673A RU2009120673A RU 2009120673 A RU2009120673 A RU 2009120673A RU 2009120673/28 A RU2009120673/28 A RU 2009120673/28A RU 2009120673 A RU2009120673 A RU 2009120673A RU 2009120673 A RU2009120673 A RU 2009120673A
- Authority
- RU
- Russia
- Prior art keywords
- heat
- bimetallic
- electronic components
- cooling
- generating
- Prior art date
Links
Abstract
Способ охлаждения полупроводниковых тепловыделяющих электронных компонентов через биметаллические термоэлектрические электроды, состоящий в охлаждении электронных компонентов через электроды, выполненные в виде биметаллических проводников, отличающийся тем, что для повышения эффективности процесса охлаждения тепловыделяющего кристалла электронного компонента используется место спая термоэлектрических электродов, находящихся в непосредственном контакте с тепловыделяющим кристаллом, причем при пропускании тока через этот спай от первого металлического электрода ко второму металлическому электроду можно сформировать охлаждение на локальном участке тепловыделяющего кристалла. A method of cooling semiconductor heat-generating electronic components through bimetallic thermoelectric electrodes, comprising cooling electronic components through electrodes made in the form of bimetallic conductors, characterized in that to increase the efficiency of the cooling process of the heat-generating crystal of the electronic component, the junction of thermoelectric electrodes in direct contact with the heat-generating electrode is used crystal, and when passing current through this junction from the first metal electrode to the second metal electrode, it is possible to form cooling in a local area of the heat-generating crystal.
Claims (1)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
RU2009120673/28A RU2449417C2 (en) | 2009-06-01 | 2009-06-01 | Method for cooling solid-state heat-generating electronic components via bimetal thermoelectric electrodes |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
RU2009120673/28A RU2449417C2 (en) | 2009-06-01 | 2009-06-01 | Method for cooling solid-state heat-generating electronic components via bimetal thermoelectric electrodes |
Publications (2)
Publication Number | Publication Date |
---|---|
RU2009120673A true RU2009120673A (en) | 2010-12-10 |
RU2449417C2 RU2449417C2 (en) | 2012-04-27 |
Family
ID=46297716
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
RU2009120673/28A RU2449417C2 (en) | 2009-06-01 | 2009-06-01 | Method for cooling solid-state heat-generating electronic components via bimetal thermoelectric electrodes |
Country Status (1)
Country | Link |
---|---|
RU (1) | RU2449417C2 (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104185360B (en) * | 2014-08-18 | 2017-05-24 | 深圳市华星光电技术有限公司 | Printed circuit board and design method thereof |
RU2667360C1 (en) * | 2017-03-29 | 2018-09-19 | федеральное государственное автономное образовательное учреждение высшего образования "Национальный исследовательский университет "Высшая школа экономики" | Method for providing passive heat receptor of mobile device processing unit or laptop computer based on diamond-copper composite material and device for its implementation |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
SE350874B (en) * | 1970-03-05 | 1972-11-06 | Asea Ab | |
SU1614148A1 (en) * | 1988-01-13 | 1990-12-15 | Каунасский Политехнический Институт Им.Антанаса Снечкуса | Device for cooling microelectronic units |
JP2000228754A (en) * | 1999-02-05 | 2000-08-15 | Fujitsu General Ltd | Cooler for liquid crystal projector |
JP2001018257A (en) * | 1999-07-02 | 2001-01-23 | Canon Inc | Injection molding mold, injection molding machine, and injection molding method |
JP2004101160A (en) * | 2002-09-12 | 2004-04-02 | Hisao Shimono | Micro portable air-conditioning appliance |
-
2009
- 2009-06-01 RU RU2009120673/28A patent/RU2449417C2/en not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
RU2449417C2 (en) | 2012-04-27 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
ATE554631T1 (en) | ELECTRICAL HEATING DEVICE AND HEAT GENERATING ELEMENT OF AN ELECTRIC HEATING DEVICE | |
EA201490205A1 (en) | METHOD OF MANUFACTURING WINDOW GLASS WITH ELECTRIC CONNECTING ELEMENT | |
EP2779230A3 (en) | Power overlay structure and method of making same | |
PH12017500341A1 (en) | Solar cell and method for producing thereof | |
JP2011044696A5 (en) | Method for manufacturing semiconductor device | |
TW200636956A (en) | Heterogeneous thermal interface for cooling | |
IN2014DN08029A (en) | ||
TW200951392A (en) | Plasma-driven cooling heat sink | |
GB2530675A (en) | Integrated thermoelectric cooling | |
JP2011009352A5 (en) | Semiconductor device | |
JP2013033812A5 (en) | ||
EP2475236A3 (en) | Power Switching Circuitry | |
EA201990574A1 (en) | PCB FOR CONNECTING THE BATTERY ELEMENTS AND THE BATTERY BATTERY | |
EP2894682A3 (en) | Thermoelectric module and heat conversion device using the same | |
IN2014DN10401A (en) | ||
EA201891963A3 (en) | SYSTEM AND METHOD OF COOLING POWER ELECTRONIC DEVICES | |
FR2965404B1 (en) | METHOD OF MANUFACTURING A THERMO ELECTRICAL DEVICE, PARTICULARLY FOR GENERATING AN ELECTRICAL CURRENT IN A MOTOR VEHICLE. | |
JP2013219348A5 (en) | ||
GB201214295D0 (en) | Thermoelectric module and method for producing a thermoelectric module | |
WO2014191893A3 (en) | Electrical machine | |
WO2012036465A3 (en) | Led light source structure with high illuminating power and improved heat dissipating characteristics | |
RU2009120673A (en) | METHOD FOR COOLING SEMICONDUCTOR HEAT-DETECTING ELECTRONIC COMPONENTS THROUGH BIMETALLIC THERMOELECTRIC ELECTRODES | |
CL2016000668A1 (en) | Solar cell comprising: substrate; semiconductor region disposed in or on the substrate; and conductive contact disposed in the semiconductor region that includes mechanically deformed metal particles; and method to make a solar cell | |
WO2012145147A3 (en) | Vertical junction field effect transistors with improved thermal characteristics and methods of making | |
RU2013109250A (en) | IP COOLING DEVICE |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | The patent is invalid due to non-payment of fees |
Effective date: 20110819 |
|
NF4A | Reinstatement of patent |
Effective date: 20130410 |
|
QB4A | Licence on use of patent |
Free format text: LICENCE Effective date: 20130716 |
|
MM4A | The patent is invalid due to non-payment of fees |
Effective date: 20140602 |