SU1614148A1 - Device for cooling microelectronic units - Google Patents

Abstract

The invention can be used to cool semiconductor devices. The goal is to improve the weight and size characteristics and increase the density of the layout and installation. The device contains a bimorph piezoceramic vibration exciter 1, made in the form of two piezoceramic plates 2, interconnected by a metal plate 3 with the formation of a base and polarized in thickness in one direction, with electrodes divided in width into several parts 4,5 connected in pairs to different outputs of the two-phase source 6 voltage. The device has plate-shaped resonators in the form of flexible plates 7 of metal, installed and fixed on the base from the side of plate 3 perpendicular to it. On the plate 3 there is an installation platform 8 for the microelectronic unit 9, for example, a semiconductor device. Each flexible plate 7 forms a directed air flow, which removes the heat emitted by the microelectronic unit 9 and arrives at the flexible plates 7 through the plate 3. 2 Il.

Description

:. 1614148

J- The invention relates to cooling devices and can be used most efficiently to cool semiconductor devices 0 computing and electronic equipment.

The purpose of the invention is to improve the overall dimensions and increase the density of the layout and installation.

: Figure 1 shows the cooling device; 2 shows diagrams of the oscillating base of a cooling device. The device for cooling contains a bimorph piezoceramic vibro-excitant 1, made in the form of two piezoceramic plates 2, with |; interconnected by a plate .3 of metal with the formation of a base

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 polarized in thickness in one direction, with electrodes divided in width into several parts

and 5, connected in pairs to different bypass of a two-phase source — for example, 6: 6, respectively, and plate resonators in the form of flexible plastics made of metal, which are installed and fixed on the base from the side of its plate 3 of Opendicul metal It is equipped with an installation platform 8 for accommodating microelectronic interference 9, for example, a semiconductor device, which is located on an astinine 3 made of metal base of a piezoceramic vibro vibration exciter 1.

The device for cooling the microelectronic units works in the following way.

The application of alternating voltage to the electrodes 4 and 5 of piezoceramic. Plates 2 causes oscillatory movements of parts of electrodes 4 and 5 in opposite phases. The oscillation phases of the parts of the electrodes 4 as well as the parts of the electrodes 5 of both piezorescene plates 2 coincide, since both of the said plates 2 are polarized in thickness in one direction. This leads to the bending of the plate 3 of the metal of the base of the bimorph piezoceramic vibration exciter 1, whose forms in the opposite phases are shown on the diagrams (Fig. 2a, b). The front part of the metal plate on the plots is shown by the straight line, since it is motionless at 20

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electrons 30 te 5 (e mva va 2 with a cell and 4q ne la la ke l 45 ternit id bi bi 50 un tint van vib tint cos

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attached to the body of the microelectronic unit 9. At the resonant frequency, a traveling wave is formed due to the oscillation of the base, along the flexible plates of the 7 plate resonators, which function as cooling fins. The oscillations with the free end portion of the flexible plates 7, moving to the left along their right side, form a vacuum where air is drawn in and an air vortex is formed. The end of the flexible plates 7, moving to the right, pushes this vortex, forming another on its left side. Thus, each flexible plate 7 forms a directional air flow, which removes heat emitted by the microelectronic unit 9 and supplied to the flexible plates 7 through the plate 3 of the base of the bimorph piezoceramic exciter 1.

Claims (1)

Invention Formula A device for cooling microelectronic units; containing a bimorph piezoceramic vibration exciter, made in the form of two piezo 5 (ceramic plates interconnected to form a base with a mounting platform and polarized in one direction thickness, with electrodes divided into several parts, which are pairwise connected to different outputs a two-phase voltage source, respectively, and a lamellar resonator, made in the form of a flexible metal plate and connected to a bimorph piezo-ceramic. The exciter, is so that, in order to improve the mass-dimensional characteristics and increase the density of the assembly and installation, it is equipped with additional plates and plate resonators identical to the main one, and the base of the bimorph piezoceramic vibration exciter is equipped with a metal plate mounted on it and Connected with its piezoceramic plates, the flexible plates of the main and additional plate resonators are fixed on the basis of a bimorph piezoceramic vibration exciter from the side of its plate and From the metal perpendicular to the plane of placement of said plate. 51514148 .6 Some of the electrodes of bimorphic piezoelectric electrodes, while installing the ceramic vibration exciter are arranged along the width of their respective on the base platform is located on its metal plate.  electrodes, while installing one on the base platform is located on its metal plate. but FIG. 2