EA201500731A1 - ELECTRONIC MODULE COMPONENT METHOD THAT PROVIDES IMPROVED HEAT AND BULK PARAMETERS - Google Patents

ELECTRONIC MODULE COMPONENT METHOD THAT PROVIDES IMPROVED HEAT AND BULK PARAMETERS

Info

Publication number
EA201500731A1
EA201500731A1 EA201500731A EA201500731A EA201500731A1 EA 201500731 A1 EA201500731 A1 EA 201500731A1 EA 201500731 A EA201500731 A EA 201500731A EA 201500731 A EA201500731 A EA 201500731A EA 201500731 A1 EA201500731 A1 EA 201500731A1
Authority
EA
Eurasian Patent Office
Prior art keywords
circuit board
printed circuit
electronic module
provides improved
improved heat
Prior art date
Application number
EA201500731A
Other languages
Russian (ru)
Inventor
Евгений Александрович Букварев
Татьяна Викторовна Букварева
Алексей Александрович Кузин
Original Assignee
Федеральное государственное бюджетное образовательное учреждение высшего профессионального образования "Нижегородский государственный технический университет им. Р.Е. Алексеева"
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Федеральное государственное бюджетное образовательное учреждение высшего профессионального образования "Нижегородский государственный технический университет им. Р.Е. Алексеева" filed Critical Федеральное государственное бюджетное образовательное учреждение высшего профессионального образования "Нижегородский государственный технический университет им. Р.Е. Алексеева"
Publication of EA201500731A1 publication Critical patent/EA201500731A1/en

Links

Abstract

Изобретение относится к области электротехники и может применяться для охлаждения группы тепловыделяющих элементов, размещенных на печатной плате, а также отвода тепла с самой печатной платы. Техническим результатом является обеспечение эффективного отвода тепла от группы тепловыделяющих элементов, размещенных на печатной плате при минимизации объемов конструкции, рассеивание тепла в окружающее пространство при отсутствии необходимости использования внутри устройства принудительной циркуляции воздуха, обеспечение электромагнитного экранирования печатной платы с установленными электронными компонентами при ограничениях по толщине устройства.The invention relates to the field of electrical engineering and can be used to cool a group of fuel elements placed on a printed circuit board, as well as the removal of heat from the printed circuit board itself. EFFECT: provision of efficient heat removal from a group of fuel elements placed on a printed circuit board while minimizing construction volumes, dissipating heat into the surrounding space when there is no need to use inside a forced air circulation device, providing electromagnetic shielding of a printed circuit board with installed electronic components with limitations on the thickness of the device .

EA201500731A 2014-12-16 2015-05-18 ELECTRONIC MODULE COMPONENT METHOD THAT PROVIDES IMPROVED HEAT AND BULK PARAMETERS EA201500731A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
RU2014150921/07A RU2603014C2 (en) 2014-12-16 2014-12-16 Method of assembling an electronic module, which provides improved thermal and overall dimensions

Publications (1)

Publication Number Publication Date
EA201500731A1 true EA201500731A1 (en) 2016-06-30

Family

ID=56194173

Family Applications (1)

Application Number Title Priority Date Filing Date
EA201500731A EA201500731A1 (en) 2014-12-16 2015-05-18 ELECTRONIC MODULE COMPONENT METHOD THAT PROVIDES IMPROVED HEAT AND BULK PARAMETERS

Country Status (2)

Country Link
EA (1) EA201500731A1 (en)
RU (1) RU2603014C2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
RU203464U1 (en) * 2020-07-17 2021-04-06 Российская Федерация, от имени которой выступает Государственная корпорация по атомной энергии "Росатом" Heat-loaded electronic device

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
RU2161384C1 (en) * 1999-05-13 2000-12-27 Фонд Сертификации "Энергия" Apparatus for temperature stabilization of electronic equipment
TW578981U (en) * 2001-11-30 2004-03-01 Foxconn Prec Components Co Ltd Heat dissipating assembly
US7051790B2 (en) * 2003-12-19 2006-05-30 Asia Vital Component Co., Ltd. Protect cover for a radiator
RU2361378C2 (en) * 2007-08-13 2009-07-10 Открытое акционерное общество "Научно-производственный комплекс "ЭЛАРА" Cooling device
RU2374792C1 (en) * 2008-05-16 2009-11-27 Открытое акционерное общество "Научно-производственный комплекс "ЭЛАРА" имени Г.А. Ильенко" (ОАО "ЭЛАРА") Radio electronic unit and cooling method thereof
RU85285U1 (en) * 2009-03-06 2009-07-27 Открытое акционерное общество "Научно-производственный комплекс "ЭЛАРА" имени Г.А. Ильенко" (ОАО "ЭЛАРА") DEVICE FOR REMOVING HEAT FROM THE PCB

Also Published As

Publication number Publication date
RU2603014C2 (en) 2016-11-20
RU2014150921A (en) 2016-07-10

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