RU2008111742A - Электронный модуль с двойным интерфейсом связи, в частности, для пластиковой карты с микрочипом - Google Patents

Электронный модуль с двойным интерфейсом связи, в частности, для пластиковой карты с микрочипом Download PDF

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RU2008111742A
RU2008111742A RU2008111742/09A RU2008111742A RU2008111742A RU 2008111742 A RU2008111742 A RU 2008111742A RU 2008111742/09 A RU2008111742/09 A RU 2008111742/09A RU 2008111742 A RU2008111742 A RU 2008111742A RU 2008111742 A RU2008111742 A RU 2008111742A
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electronic module
electrical contacts
terminal block
module
antenna
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RU2008111742/09A
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RU2412483C2 (ru
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Оливье АРТИГ (FR)
Оливье АРТИГ
Энри БОКСИА (FR)
Энри БОКСИА
Оливье БРЮНЕ (FR)
Оливье БРЮНЕ
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Смарт Пэкэджинг Солюшнс (Спс) (Fr)
Смарт Пэкэджинг Солюшнс (Спс)
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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07766—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card comprising at least a second communication arrangement in addition to a first non-contact communication arrangement
    • G06K19/07769—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card comprising at least a second communication arrangement in addition to a first non-contact communication arrangement the further communication means being a galvanic interface, e.g. hybrid or mixed smart cards having a contact and a non-contact interface
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B42—BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
    • B42D—BOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
    • B42D25/00—Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof
    • B42D25/30—Identification or security features, e.g. for preventing forgery
    • B42D25/305—Associated digital information
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B42—BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
    • B42D—BOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
    • B42D25/00—Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof
    • B42D25/40—Manufacture
    • G—PHYSICS
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    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
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    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07743—External electrical contacts
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
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    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
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    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773—Antenna details
    • G06K19/07775—Antenna details the antenna being on-chip
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
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    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773—Antenna details
    • G06K19/07777—Antenna details the antenna being of the inductive type
    • G06K19/07779—Antenna details the antenna being of the inductive type the inductive antenna being a coil
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H01L2224/48228—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item the bond pad being disposed in a recess of the surface of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/49105—Connecting at different heights
    • H01L2224/49109—Connecting at different heights outside the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00011—Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Manufacturing & Machinery (AREA)
  • Credit Cards Or The Like (AREA)
  • Details Of Aerials (AREA)
  • Near-Field Transmission Systems (AREA)

Abstract

1. Электронный модуль (11) с двойным интерфейсом связи, в частности, для пластиковой карты с микроэлектронным чипом, содержащий с одной стороны подложку (27), снабженную клеммной колодкой электрических контактов (17), обеспечивающих функционирование путем непосредственного электрического контакта с контактами считывающего устройства, а с другой стороны модуль содержит антенну, сформированную по меньшей мере одним витком (13), клеммы которой связаны с клеммами микроэлектронного чипа, расположенного на поверхности модуля, причем витки (13) антенны расположены по существу за пределами зоны, перекрытой электрическими контактами (17), отличающийся тем, что содержит множество узких выступов (33), расположенных за пределами зоны размещения электрических контактов (17) клеммной колодки на поверхности подложки (27), противоположной поверхности, на которой расположены витки антенны. ! 2. Электронный модуль (11) по п.1, отличающийся тем, что узкие выступы (33) расположены на периферийной части электронного модуля и нависают над зоной расположения витков (13) антенны. ! 3. Электронный модуль (11) по п.2, отличающийся тем, что узкие выступы (33) являются металлическими и изготавливаются в процессе изготовления электрических контактов (17) клеммной колодки. ! 4. Электронный модуль (11) по п.3, отличающийся тем, что узкие выступы (33) имеют по существу форму радиусов, проходящих от электрических контактов (17) клеммной колодки в направлении периферийной части модуля, причем общая площадь поверхности узких выступов (33) является относительно небольшой по сравнению с площадью поверхности контактов (17) клеммной колодки. ! 5. Электронный модуль (11) по любому из �

Claims (11)

1. Электронный модуль (11) с двойным интерфейсом связи, в частности, для пластиковой карты с микроэлектронным чипом, содержащий с одной стороны подложку (27), снабженную клеммной колодкой электрических контактов (17), обеспечивающих функционирование путем непосредственного электрического контакта с контактами считывающего устройства, а с другой стороны модуль содержит антенну, сформированную по меньшей мере одним витком (13), клеммы которой связаны с клеммами микроэлектронного чипа, расположенного на поверхности модуля, причем витки (13) антенны расположены по существу за пределами зоны, перекрытой электрическими контактами (17), отличающийся тем, что содержит множество узких выступов (33), расположенных за пределами зоны размещения электрических контактов (17) клеммной колодки на поверхности подложки (27), противоположной поверхности, на которой расположены витки антенны.
2. Электронный модуль (11) по п.1, отличающийся тем, что узкие выступы (33) расположены на периферийной части электронного модуля и нависают над зоной расположения витков (13) антенны.
3. Электронный модуль (11) по п.2, отличающийся тем, что узкие выступы (33) являются металлическими и изготавливаются в процессе изготовления электрических контактов (17) клеммной колодки.
4. Электронный модуль (11) по п.3, отличающийся тем, что узкие выступы (33) имеют по существу форму радиусов, проходящих от электрических контактов (17) клеммной колодки в направлении периферийной части модуля, причем общая площадь поверхности узких выступов (33) является относительно небольшой по сравнению с площадью поверхности контактов (17) клеммной колодки.
5. Электронный модуль (11) по любому из пп.1-4, отличающийся тем, что электрические контакты (17) клеммной колодки расположены на одной поверхности упомянутой подложки (27), при этом витки (13) антенны расположены на противоположной поверхности подложки.
6. Электронный модуль (11) по п.5, отличающийся тем, что витки (13) антенны расположены в периферийной части модуля, при этом электрические контакты (17) клеммной колодки расположены в центральной области модуля, снаружи по отношению к зоне, ограниченной размещением витков антенны.
7. Электронный модуль (11) по п.1, отличающийся тем, что витки (13) антенны расположены с той же стороны подложки (27), что и микроэлектронный чип, причем электрические контакты (17) клеммной колодки расположены на противоположной стороне подложки.
8. Электронный модуль (11) по п.1, отличающийся тем, что электрические контакты (17) клеммной колодки выполнены таким образом, чтобы соответствовать нормативному документу ISО 7816-2.
9. Электронный модуль (11) по п.1, отличающийся тем, что электрические контакты (17) клеммной колодки расположены на периферийной части модуля, при этом витки (13) антенны расположены в центральной части модуля, снаружи по отношению к зоне, ограниченной размещением электрических контактов (17).
10. Пластиковая карта с микроэлектронным чипом, отличающаяся тем, что содержит электронный модуль (11) по любому из предшествующих пунктов.
11. Пластиковая карта с микроэлектронным чипом по п.10, отличающаяся тем, что дополнительно содержит в корпусе пластиковой карты устройство концентрации или усиления электромагнитных волн, обеспечивающее ориентацию потока электромагнитных волн в направлении витков (13) антенны.
RU2008111742/08A 2005-08-30 2006-08-28 Электронный модуль с двойным интерфейсом связи, в частности, для пластиковой карты с микрочипом RU2412483C2 (ru)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR0508860A FR2890212B1 (fr) 2005-08-30 2005-08-30 Module electronique a double interface de communication, notamment pour carte a puce
FR0508860 2005-08-30

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PT1932104E (pt) 2013-02-13
CN101297308A (zh) 2008-10-29
CY1113910T1 (el) 2016-07-27
RU2412483C2 (ru) 2011-02-20
FR2890212B1 (fr) 2009-08-21
ES2403533T3 (es) 2013-05-20
EP1932104B1 (fr) 2012-11-07
SI1932104T1 (sl) 2013-04-30
PL1932104T3 (pl) 2013-05-31
DK1932104T3 (da) 2013-02-25
US8100337B2 (en) 2012-01-24
MY151796A (en) 2014-07-14
WO2007026077B1 (fr) 2007-05-31
KR101236577B1 (ko) 2013-02-22
CN101297308B (zh) 2012-05-30
US20080245879A1 (en) 2008-10-09
FR2890212A1 (fr) 2007-03-02
EP1932104A1 (fr) 2008-06-18
MA29778B1 (fr) 2008-09-01
KR20080041620A (ko) 2008-05-13
WO2007026077A1 (fr) 2007-03-08

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