RU169866U1 - Installation for opening plastic cases of electro-radioelements - Google Patents

Abstract

A useful model relates to the field of investigation of failures of electro-radioelements (ERI) and can be used in destructive physical analysis of semiconductor devices to determine the cause of defects in electronic components or to study the designs of devices of various manufacturers. The installation for opening plastic cases of ERI consists of a stage with a lid under which there is a mask with the instrument under study, a heating mantle, one or more flasks with reagents, a mixer, control valves according to the number of count flasks with reagents, vacuum pump, vacuum regulator, containers for waste acids, and water tanks for the neutralization of acid vapors.

Description

IPC C08J 7/14, B44C 1/22, H01L 21/00

Installation for opening plastic cases of electro-radioelements

The utility model relates to the field of investigation of failures of electro-radioelements (ERI) and can be used in destructive physical analysis of semiconductor devices to determine the cause of marriage in electronic components or to study the design of devices of various manufacturers.

Currently, integrated circuit chips (ICs) are most often placed in polymer cases. In the polymer case, the chip is surrounded on all sides by a hardened polymer, such as epoxy resin, polyurethane, polyvinyl chloride. Chemical decapsulation of a chip in a polymer case is based on precision chemical etching of the polymer using concentrated (fuming) nitric acid or heated concentrated (fuming) sulfuric acid. These acids dissolve almost all commonly used polymers (capsulants). Smoky nitric acid completely removes the capsule, but at the same time leaves the protective layers of the chip connecting wires intact. If copper is used for the connecting wires, then fuming sulfuric acid is used for the final etching.

To decapsulate a chip in a polymer case, there is a series of modern equipment manufactured by various manufacturers, usually used to decapsulate a chip in the analysis of IC failures. Products on the market are NSC firms (Japan) - models PA103, PS-102S and others, Nisene technology Group (USA) - model JetEtch and others.

The equipment of these companies has a high degree of automation, allows you to switch from one acid to another during the etching process, mix them in the required proportion, change the acid concentration, create a turbulent acid flow to ensure fast and accurate decapsulation.

The disadvantages of mass-produced devices are their high complexity and, as a consequence, a very high cost, which complicates the widespread use of these devices in the analysis of ERI failures.

A known decapsulator of plastic housings of electronic devices (patent US 5783098, Nisene Technology Group., Publication July 21, 1998) includes sources of etching solution, an etching chamber with a movable cover, inside of which there is a plate with the device under study, a pump for pumping a certain the amount of etching solution in the injection head and to remove the etching solution from the etched cavity. The injector head and the electronic device assembly are mounted on the etching chamber. The system also includes a waste tank, where they come from the pickling chamber.

The disadvantage of this device is the lack of heating of the etching solution and the need to use a chemically resistant pump designed for pumping acids.

The closest analogue of the proposed technical solution is an apparatus for decapsulation of plastic cases of microcircuits (Patent for invention US9059184, RKD Engineering, publication June 16, 2015), which provides the pump with a mixture of etching acids in the form of high-speed microdosed pulses from any one or from a combination of etchant sources in flasks , heating and temperature control of the etchant by passing the etchant mixture through a serpentine passage in a metal block with a controlled temperature, and ensures Achu mixture pickling acids from the block temperature-controlled via a supply conduit to dekapsuliruemoy surface of the integrated circuit.

The disadvantage of this technical solution is the complex design of the heat exchanger used to control the temperature of the supplied pickling solution and the need to use an expensive acid-resistant pump.

The technical result solved by the claimed utility model is to simplify the design of the decapsulator.

The proposed installation for opening ERI cases consists of a stage with a lid (1), under which there is a mask (2) with the device under study, a heating mantle (3), one or more flasks with reagents (4,5), a mixer (6), and adjusting taps (7.8) by the number of flasks with reagents, a vacuum pump (9), a vacuum regulator (10), a flask for waste acids (11), a flask with water to neutralize acid fumes (12) and connecting tubes (13) (Fig .one).

The surface of the stage is made of fluoroplastic (chemically resistant material) and has at least one hole for creating and supplying the etchant directly to the etching zone of the ERI, holes for supplying and removing the etchant, an opening for placing the mask and the hole - the zone for collecting and removing reaction products. The subject table is closed by a lid, under which there is a mask under the ERI.

The heating element is either a heating mantle, a chemically stable fluid stream heater for temperature-controlled to 260 ° ^C.

As a vacuum pump, any suction pump can be used, capable of creating a pressure differential at the inlet sufficient to pick up the etchant.

The mixer is a part with a free internal volume, having several inputs and one output.

A set of valves made of chemically resistant material should provide the ability to completely block the flow of reagents.

The vacuum regulator is a gear type device that can control the pressure drop.

Reagent flasks must be chemically resistant as well as resistant to reduced pressure.

The mask under the ERI is a removable part of the stage for a specific type of ERI.

The connecting tubes are made of chemically resistant material, for example, fluoroplastic or fluorine rubber.

Installation works as follows:

Before decapsulation begins, depending on the type of semiconductor device under study, a combination of etching acids is determined, the reaction temperature is set and set using a heating device, and the ratio of etching components is established using control valves.

Then the vacuum pump is turned on, which creates a vacuum in the system, and provides the necessary flow of acids from the flasks to the inlet of the mixer, from the output of which the etching solution is fed into the stage in the reaction zone in the microcircuit housing and the subsequent removal of waste acids and neutralization of their vapors is provided.

The vacuum regulator controls the reaction rate.

The use of a vacuum pump allows to simplify the design and as a result to obtain secondary effects: to avoid the operation of its elements with aggressive fluids and, accordingly, increase the reliability of the installation, reduce its cost and requirements for chemical resistance of a significant part of the materials used.

Claims (1)

Installation for opening plastic cases of electro-radio elements, containing a stage with a lid, under which is a mask with an electro-radio element, a heating mantle, flasks with reagents, a pump, a mixer, control valves for the number of flasks with reagents, flasks for waste acids and flasks with water to neutralize acid vapors, while the flasks with reagents are located on the mantle and connected via tubes having control valves to the inputs of the mixer, the outlet of which is connected by tubes and with the entrance of the stage, while the output of the stage is connected via a tube to the input of the spent acid tank, the output of which is connected via the pipe to the inlet of the flask to neutralize acid vapor, characterized in that the pump is made vacuum and the regulator is connected to its input a vacuum connected through a tube to the outlet of the flask with water to neutralize the acid vapor.

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