RU104889U1 - UNIT FOR MULTI-ROW CUTTING - Google Patents

Abstract

 A unit for multi-row cutting of semiconductor materials, containing two coils, each with its own drive, with one thin elastic element wound around them at different ends, two multi-grooved rollers on parallel, spatially spaced axes, in the grooves of which are multi-row laying from one roller to another, covering both the rollers placed the inter-roller part of the thin elastic element, guide rollers and the workpiece attachment unit, made with the possibility of movement in the vertical and horizontal planes, cast which is equipped with two nodes for applying an abrasive to a thin elastic element, providing alternate application of an abrasive at the beginning of supply of a thin elastic element and located symmetrically outside the inter-roller part of the thin elastic element, the technical thread being used as a thin elastic element, and the workpiece attachment unit is equipped with a mechanism oscillations for communicating to the workpiece oscillatory movements in the horizontal plane.

Description

A multi-row cutting unit refers to technological equipment used for cutting semi-conductor materials such as silicon, germanium, ruby, and quartz onto plates.

A known machine for cutting semiconductor materials into sheet blanks (copyright certificate SU No. 179650, IPC B 24b) with reciprocating movement of cutting blades.

The main disadvantage of the machine is the incomplete regulation of the efforts of the tension of the cutting blades with spacer screws, due to the difficulty of ensuring the unity of the points of application of the reaction of the supports.

Known cutting device (Zaporizhsky V.P., Lapshinov B.A. Processing of semiconductor materials. M: Vye. Shk., 1988, p. 59-62), operating using the reciprocating movement of the cutting mechanism, the lever mechanism of cutting and wire feed mechanism.

The disadvantages of the device include the fact that the vertical swing of the wire at the entrance to the roller increases the cut error, and the feed mechanism, according to the law of motion, helps to lengthen the working wire and its overvoltage from the force of gravity.

As a prototype adopted device for multi-row cutting. (Patent RU No. 90007 U1, IPC B26D 3/28, B26D 5/02). The device is designed for multi-row cutting of hard, brittle materials (sapphire, silicon, quartz, ruby, etc.) and contains two coils located on the base, each with its own electric drive, one abrasive wire (thin elastic element) wound at different coils two multi-grooved rollers on parallel, spatially spaced axes, in the gutters of which multi-row laying from one roller to another is placed the inter-roller part of the wire, the rollers guiding the wire and the attachment unit of the cut sample. The mount of the sample has the ability to move the rear end of the sample in horizontal and vertical planes.

The disadvantage of the prototype is the low quality of the cut plates and low productivity, due to the fact that the rollers are mounted cantilever with low stiffness, do not provide the desired winding speed and the actual winding speed, as a result of changes in the friction force of the thread in the grooves.

The objective of the utility model is to increase cutting performance and surface quality.

The problem is achieved in that the unit for multi-row cutting, containing two coils, each with its own drive, with one thin elastic element wound around them at different ends; two multi-grooved rollers on parallel, spatially spaced axes, in the grooves of which multi-row laying from one roller to another with the coverage of both rollers contains the inter-roller part of a thin elastic element; guide rollers and a workpiece attachment unit, configured to move in the horizontal and vertical planes, according to a utility model, is equipped with two nodes for applying an abrasive to a thin elastic element, providing alternate application of an abrasive at the beginning of supply of a thin elastic element and located symmetrically outside the inter-roller part of the thin elastic element moreover, a technical thread is used as a thin elastic element, and the workpiece attachment unit is equipped with an oscillation mechanism for communication workpiece oscillatory movements in the horizontal plane.

The technical result of the claimed utility model is to constantly restore the cutting ability of the technical thread, by updating the abrasive on the thread, and to prevent jamming of the thread, through the use of an oscillation mechanism that provides a resonant mode of cutting the workpiece. The result is improved cutting performance and improved surface quality of the cut.

The figure shows a functional diagram of the unit for multi-row cutting.

The unit contains two multi-grooved rollers 1 mounted on paired brackets 2 and 3 located on two axes 4 of the base 5. The screw for adjusting the clearance of the rollers 6 is powered by an adjustable drive 7. A technical thread 8 made in accordance with TU 6 is used as a thin elastic element -12-185-95. The technical thread 8, wound on a reel 9, passes through the abrasive application unit 10, the multi-grooved rollers 1 and the abrasive application unit 11 and is fixed on the spool 12. The inter-roller part of the technical thread multi-row laid in the grooves from one roller to another with the coverage of both rollers forms rigidly stretched cutting part. The coil 9 receives rotation from an adjustable drive 13, the coil 12 operates from a follower drive 14. The guide rollers 15 coordinate the movement of the thread. The four-coordinate table 16, on which the workpiece 17 in the prisms 18 is based, is a workpiece mounting unit. The oscillation mechanism 19 is designed to create mechanical vibrations of a given amplitude in the horizontal plane, which are transmitted through the plate 20 to the workpiece 17. The pendulum 21 provides the detection of the resonant mode.

Unit operation.

The workpiece 17 is fixed in the prisms 18 of the four-coordinate table 16. The four-coordinate table has the ability to move in horizontal and vertical planes and an additional rotation option, which provides rotation in the workpiece space, if necessary, to combine the crystallization axis of the single crystal with the axis of the sample shape.

Using an adjustable drive 7 and a screw for adjusting the clearance of the rollers 6, the distance between the workpiece 17 and the multi-grooved rollers 1 is established, which provides the necessary tension force of the cutting part of the thread.

An adjustable drive 13 and a follow-up drive 14 are turned on, while the technical thread 8 starts moving, in the application unit of the abrasive 10 an abrasive is applied to it. The cutting process of the workpiece 17 is carried out using a vertical upward feed of the four-coordinate table 16, after the abrasive is completely applied to the entire inter-roller part of the technical thread. At the same time, mechanical vibrations of a certain amplitude in a horizontal plane are transmitted from the oscillation mechanism 19 through the plate 20 to the workpiece, providing a resonant cutting mode to prevent jamming of the technical 8. The pendulum 21 allows you to track the resonant mode of operation of the unit during cutting due to the natural frequency of oscillation.

The nodes for applying the abrasive 10 and 11 work alternately, and the node closest to the direction of the thread runs until the working length of the thread from the reel 9 to the reel 12 is completely wound. After that, the actuators 13, 14 are switched over, the application of the abrasive 10 unit is turned off and the technical thread starts in the opposite direction, and the unit for applying the abrasive 11 enters the work.

The use of autonomous drives 13 and 14 reduces the impulse of the technical thread 8, due to its uniform tension when slipping in the grooves of the rollers 1 with a varying speed in the areas of the coverage of the roller.

In the inventive unit in comparison with the prototype increases the cutting performance due to:

- the use of a technical thread, the strength of which in breaking stress is several times higher than a steel wire;

- the use of resonant modes of cutting the workpiece, which helps to prevent jamming of the technical thread.

In addition, improves the surface quality of the cut due to:

- continuous restoration of the cutting ability of the technical thread, by updating the abrasive on the thread;

- the use of self-contained drives that ensure that the tension of the technical thread is maintained in a stable mode, depending on the changing natural vibration frequency.

The unit will reduce the loss of expensive materials by reducing the thickness of the cut 1.2-1.3 times.

Claims (1)

A unit for multi-row cutting of semiconductor materials, containing two coils, each with its own drive, with one thin elastic element wound around them at different ends, two multi-grooved rollers on parallel, spatially spaced axes, in the grooves of which are multi-row laying from one roller to another, covering both rollers placed the inter-roller part of the thin elastic element, guide rollers and the workpiece attachment unit, made with the possibility of movement in the vertical and horizontal planes, cast which is equipped with two nodes for applying an abrasive to a thin elastic element, providing alternate application of an abrasive at the beginning of supply of a thin elastic element and located symmetrically outside the inter-roller part of the thin elastic element, the technical thread being used as a thin elastic element, and the workpiece attachment unit is equipped with a mechanism oscillations for communicating to the workpiece oscillatory movements in the horizontal plane.