PT3468933T - Método e dispositivo para encapsular componentes - Google Patents

Método e dispositivo para encapsular componentes

Info

Publication number
PT3468933T
PT3468933T PT177354024T PT17735402T PT3468933T PT 3468933 T PT3468933 T PT 3468933T PT 177354024 T PT177354024 T PT 177354024T PT 17735402 T PT17735402 T PT 17735402T PT 3468933 T PT3468933 T PT 3468933T
Authority
PT
Portugal
Prior art keywords
encapsulating components
encapsulating
components
Prior art date
Application number
PT177354024T
Other languages
English (en)
Original Assignee
Leander Kilian Gross
Mascha Elly Gross
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Leander Kilian Gross, Mascha Elly Gross filed Critical Leander Kilian Gross
Publication of PT3468933T publication Critical patent/PT3468933T/pt

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C27/00—Joining pieces of glass to pieces of other inorganic material; Joining glass to glass other than by fusing
    • C03C27/06—Joining glass to glass by processes other than fusing
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C27/00—Joining pieces of glass to pieces of other inorganic material; Joining glass to glass other than by fusing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C27/00—Joining pieces of glass to pieces of other inorganic material; Joining glass to glass other than by fusing
    • C03C27/005—Joining pieces of glass to pieces of other inorganic material; Joining glass to glass other than by fusing with compositions containing more than 50% lead oxide by weight
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C3/00—Glass compositions
    • C03C3/04—Glass compositions containing silica
    • C03C3/062—Glass compositions containing silica with less than 40% silica by weight
    • C03C3/07—Glass compositions containing silica with less than 40% silica by weight containing lead
    • C03C3/072—Glass compositions containing silica with less than 40% silica by weight containing lead containing boron
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
    • C03C8/24—Fusion seal compositions being frit compositions having non-frit additions, i.e. for use as seals between dissimilar materials, e.g. glass and metal; Glass solders
    • C03C8/245—Fusion seal compositions being frit compositions having non-frit additions, i.e. for use as seals between dissimilar materials, e.g. glass and metal; Glass solders containing more than 50% lead oxide, by weight

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Ceramic Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Optics & Photonics (AREA)
  • Electroluminescent Light Sources (AREA)
  • Vessels And Coating Films For Discharge Lamps (AREA)
  • Discharge Lamps And Accessories Thereof (AREA)
PT177354024T 2016-06-14 2017-06-14 Método e dispositivo para encapsular componentes PT3468933T (pt)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102016110868.5A DE102016110868A1 (de) 2016-06-14 2016-06-14 Verfahren und Vorrichtung zur Verkapselung von Bauteilen

Publications (1)

Publication Number Publication Date
PT3468933T true PT3468933T (pt) 2020-10-21

Family

ID=59285147

Family Applications (1)

Application Number Title Priority Date Filing Date
PT177354024T PT3468933T (pt) 2016-06-14 2017-06-14 Método e dispositivo para encapsular componentes

Country Status (13)

Country Link
US (1) US11152590B2 (pt)
EP (1) EP3468933B1 (pt)
JP (1) JP7168455B2 (pt)
KR (1) KR102259257B1 (pt)
CN (1) CN109415252B (pt)
DE (1) DE102016110868A1 (pt)
DK (1) DK3468933T3 (pt)
ES (1) ES2829074T3 (pt)
HU (1) HUE051233T2 (pt)
MY (1) MY193097A (pt)
PL (1) PL3468933T3 (pt)
PT (1) PT3468933T (pt)
WO (1) WO2017216261A1 (pt)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114709293B (zh) * 2022-04-02 2023-03-31 晟高发新能源发展(江苏)有限公司 一种柔性光伏组件的封装装置及封装方法

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2909173A1 (de) * 1979-03-08 1980-09-11 Krautkraemer Gmbh Haltevorrichtung fuer eine laseranordnung
TW517356B (en) * 2001-10-09 2003-01-11 Delta Optoelectronics Inc Package structure of display device and its packaging method
US6998776B2 (en) * 2003-04-16 2006-02-14 Corning Incorporated Glass package that is hermetically sealed with a frit and method of fabrication
DE102005044523A1 (de) * 2005-09-16 2007-03-29 Schott Ag Verfahren zum Verbinden von Elementen mit Glaslot
US7537504B2 (en) * 2005-12-06 2009-05-26 Corning Incorporated Method of encapsulating a display element with frit wall and laser beam
US7597603B2 (en) * 2005-12-06 2009-10-06 Corning Incorporated Method of encapsulating a display element
US7800303B2 (en) * 2006-11-07 2010-09-21 Corning Incorporated Seal for light emitting display device, method, and apparatus
US20080213482A1 (en) * 2007-03-01 2008-09-04 Stephan Lvovich Logunov Method of making a mask for sealing a glass package
KR101565183B1 (ko) * 2008-02-28 2015-11-02 코닝 인코포레이티드 유리 외피 실링 방법
KR100926622B1 (ko) * 2008-03-17 2009-11-11 삼성모바일디스플레이주식회사 프릿을 이용한 기밀 밀봉 장치 및 기밀 밀봉 방법
US8202407B1 (en) * 2009-01-06 2012-06-19 Arthur Don Harmala Apparatus and method for manufacturing polycarbonate solar cells
US8440479B2 (en) * 2009-05-28 2013-05-14 Corning Incorporated Method for forming an organic light emitting diode device
CN102280434B (zh) * 2010-06-12 2014-07-30 财团法人工业技术研究院 真空气密的有机封装载体与传感器组件封装结构
WO2011158873A1 (ja) * 2010-06-16 2011-12-22 旭硝子株式会社 電子デバイス
CN102754524B (zh) * 2010-07-23 2015-09-02 株式会社日本有机雷特显示器 显示面板及其制造方法
JP2012033589A (ja) * 2010-07-29 2012-02-16 Ushio Inc 化合物半導体の製造方法
JP5918607B2 (ja) * 2011-04-15 2016-05-18 株式会社半導体エネルギー研究所 ガラス封止体の作製方法
JP5947098B2 (ja) * 2011-05-13 2016-07-06 株式会社半導体エネルギー研究所 ガラス封止体の作製方法および発光装置の作製方法
DE102012107468B4 (de) * 2012-08-15 2016-03-24 Von Ardenne Gmbh Gasentladungslampe mit einem Mantelrohr und einem darin gestützten Lampenrohr
KR102439308B1 (ko) * 2015-10-06 2022-09-02 삼성디스플레이 주식회사 표시장치

Also Published As

Publication number Publication date
EP3468933B1 (de) 2020-09-16
PL3468933T3 (pl) 2021-04-06
JP7168455B2 (ja) 2022-11-09
CN109415252A (zh) 2019-03-01
JP2019519934A (ja) 2019-07-11
US20190157611A1 (en) 2019-05-23
DE102016110868A9 (de) 2018-03-08
EP3468933A1 (de) 2019-04-17
MY193097A (en) 2022-09-26
DE102016110868A1 (de) 2017-12-14
US11152590B2 (en) 2021-10-19
WO2017216261A1 (de) 2017-12-21
CN109415252B (zh) 2023-06-09
KR20190017989A (ko) 2019-02-20
HUE051233T2 (hu) 2021-03-01
KR102259257B1 (ko) 2021-05-31
ES2829074T3 (es) 2021-05-28
DK3468933T3 (da) 2020-12-07

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