CN109415252A - 用于封装部件的方法与设备 - Google Patents
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Abstract
本发明涉及一种用于气密封装部件的方法和设备,该部件使用至少一种气体放电灯、对光透明的无机材料和光吸收无机介质。相比于有机材料或有机介质,随着合适的选择,无机材料或无机介质保证了对氧气、水蒸气和反应气体的极低水平的渗透性。封装发生在不超过一秒的时间内。此外,部件的平均温度仅轻微增加,从而甚至可以封装具有温度敏感区域的部件。
Description
本发明涉及一种用于气密地封装部件的方法和设备。部件装置(例如,传感器、显示屏、光伏模组或微电子器件)必须受到保护免受诸如水蒸气、氧气或反应性气体的环境影响。
在很多情况下,例如在OLED的显示屏中,该部件由等面积的玻璃板覆盖着并粘接在该区域边缘的部件上。在这种情况下使用的粘合剂可以是环氧树脂,其通过紫外光活化进行聚合。与玻璃板相比,环氧树脂对水蒸气或氧气的渗透性低但不可忽略,从而在OLED的显示屏的情况下,还必须在封装中额外引入吸气剂以保护部件多年免受氧气或环境湿度的影响。
在用于汽车或飞机的硅制转速传感器中,尤其,良好的真空是在部件表面上产生高质量的小块振动的条件,并因此实现位置变化的测量精度。为了这一目的,使用吸气剂的环氧树脂是不够的,从而,例如,用玻璃焊剂代替有机粘合剂。由于添加硼、氧化铅和其他材料,玻璃焊剂是一种具有特别低(例如400℃)软化温度的玻璃。对于封装,首先,具有玻璃焊剂的膏剂通过屏幕印刷施加到玻璃板的边缘,并随后在诸如300℃的温度下通过干燥清除膏剂的有机粘合剂和溶剂。此后,在真空室将玻璃板挤压到具有部件的振动块的表面上,并且导致位于其之间的玻璃焊剂通过红外辐射器熔化。在真空冷却后,甚至在真空炉通气之后,部件和玻璃板之间的空间以及因此振动块的紧邻环境仍然被抽空。这个方法的不足在于,部件和玻璃板两者均达到与玻璃焊剂相同的温度。此外,加热和冷却时间通常持续许多分钟,并从而对具有高吞吐量的生产是一种妨碍。
由于高熔化温度,玻璃焊剂不适用于在传统炉中OLED显示屏的封装,因为该有机材料不承受高于约100℃的温度。对于许多类型的部件,存在显著低于玻璃焊剂的熔化温度的温度限制,特别是如果它们包含有机材料的情况下。
在美国专利申请US 2004/207314A1“Glass Package that is HermeticallySealed with a Frit and Method of Fabrication(用玻璃原料气封的玻璃封装及其制造方法)”中,描述了这样的方法,该方法通过脉冲激光将玻璃焊剂快速加热到熔点。在这种情况下,基质的加热和冷却发生得迅速以致用于封装的部件和玻璃板都没有显著升温。该方法的不足在于玻璃焊剂的连续加热,即,通常的点状激光束导致了玻璃焊剂的点状加热。为完成封装,激光束必须扫描穿过玻璃焊剂的整个表面。在这种情况下已经证实,某一扫描速度必须与相应的激光功率保持一致,以使热机械张力保持低于使用的材料和部件的断裂极限。这实际上限制了生产中的吞吐量,特别是如果它涉及诸如光伏模组之类的大型部件或与旋转速率传感器一样的高件数。
在该专利申请中提到用红外灯作为激光的取代物。例如,只有比激光低多个数量级的每单位面积光功率可以使用这些灯实现。从而,用于熔化玻璃焊剂所需的曝光时间相应增加到至少一秒到几秒。因此,由于热传导,在玻璃焊剂和部件的温度敏感区域之间必须保持数毫米到几厘米的距离,以便在后者中不超过应用程序特定的最大温度。从而,红外灯不包括在其中指定了与OLED一样的高温度敏感性和良好的面积利用率和/或高产量的组合的应用中。
本发明的目的是一种用于加热玻璃焊剂或其它光吸收无机装置的方法,用于借助于玻璃板或其它透光无机材料对部件进行气密封装。在这种情况下,按照在上述专利申请US2004/207314A1中使用激光进行封装,部件的温度敏感区域大体上不会加热到超过室温。生产中的吞吐量将比使用激光的封装中大数倍。
光通常是指可以由人眼记录的光谱范围内的电磁波,即约380nm至780nm的波长范围。这个光谱范围还可以用于吸光、反光和透明材料。在某些情况下,将这个光谱范围扩展到在其上直接相邻的电磁波长范围可以是合理的。例如,卤素灯的发射峰约为920nm,其中小紫外部件还包括在发射光谱中,即,波长小于380nm。硅酸盐玻璃通常是透明的,超出了人眼的可视范围。
光透明无机材料还包括蓝宝石,即,氧化铝的晶体形式、以及陶瓷,例如氮化铝或铝氮氧化物。除玻璃焊剂的整个阵列外,光吸收装置还包括金属合金或纯金属层制成的焊剂。例如,可以将200nm的铝或金薄层施加到玻璃板上,该玻璃板分别加热到580℃或370℃时与硅制部件形成共晶键。在这种情况下,具体的加工温度低于铝或金的熔点。
本发明的上述目的通过使用至少一种气体放电灯实现,该灯在高光照强度下使加热时间在约0.1ms(作为闪光灯运行)到约1000ms(使用连续功率运行)范围。例如,具有2m电弧长度的多轴闪光灯可以彼此平行布置在一个平面上,以单独分装大面积的OLED电视或光伏模组。多个转速传感器还可以布置在一个平面上,该平面平行地排列成闪光灯场,以同时封装所有的传感器。从而,相比于使用激光或还在传统炉中的封装,可能在生成中得到数倍吞吐量。
图1示出了根据本发明设备的排列(100)的非等比例的截面视图,该排列避免了整个部件(110)的暴露并/或将由气体放电灯(150)发出的光(160)限制在具有光吸收无机装置(140)的区域上。该光吸收装置(140)(例如50μm厚的玻璃焊剂)在先前的加工步骤中(未示出)应用到对光透明的无机材料(130)上,例如,用于封装的玻璃板。部件(110)的阴影由载体材料制成的透明掩模(170)执行,例如石英玻璃。掩模(170)配备有非透明反光层(180),其仅在少数点(190)中断或开启,从而发出的光(160)可以入射到该光吸收装置(140)的这些点处用于加热。因此,部件(例如OLED显示屏)的温度敏感区域(120)不会曝光或仅进行不明显的加热。在诸如光伏模组的大面积部件情况下,可以节省远离开口(190)的气体放电灯(150)。理想地,掩模(170)用于在封装处理中将材料(130)按压在部件(110)上。在这种情况下,部件(110)位于衬底上(未示出)。实验已经证实,如果由部件(110)上材料(130)的重力引入的压紧力不够,该按压对气密封装是有利的。这尤其适用于诸如传感器的小部件的情况。作为掩模(170)的光反射层(180)的替代,还可以使用光吸收层。光吸收层可以增加气体放电灯的光效,但是随后掩模(170)需要更好地冷却,特别是在高吞吐量的生产中。
附图标记列表
100:根据本发明的设备
110:部件
120:部件的温度敏感区域
130:无机光透明材料
140:光吸收无机装置
150:气体放电灯
160:由气体放电灯发出的光
170:掩模
180:掩模上的光反射层
190:掩模的光反射层中的开口
权利要求书(按照条约第19条的修改)
1.一种使用无机光透明材料和使用无机光吸收装置封装部件的方法,其特征在于,利用至少一个气体放电灯将光吸收装置加热持续不超过1秒的时间,以将部件气密键合到光透明材料上。
2.根据权利要求1所述的方法,其特征在于,所述无机光透明材料是硅酸盐玻璃。
3.根据权利要求1所述的方法,其特征在于,所述无机光吸收装置是玻璃焊剂、金属合金制成的焊料或金属层。
4.根据权利要求1所述的方法,其特征在于,所述部件包括至少一个传感器、一个显示屏或用于光伏器件或微电子器件的一个半导体。
5.根据权利要求1所述的方法,其特征在于,所述部件的平均温度由于封装过程上升不超过80℃。
6.根据权利要求1所述的方法,其特征在于,所述气体放电灯作为闪光灯运行或使用连续功率。
7.一种根据上述权利要求中任一项所述的方法设计的用于封装部件(110)的设备(100),所述部件(110)使用无机光透明材料(130),使用无机光吸收装置(140),其特征在于,使用至少一个气体放电灯(150)用于加热装置,以将部件气密键合到光透明材料上,并从而在所述光透明材料和至少一个气体放电灯之间合并掩模(170),以限制与光吸收装置键合的部件的区域上的光入射(160)。
8.根据权利要求7所述的用于封装部件(110)的设备(100),其特征在于,所述气体放电灯(150)设置成闪光运行或连续运行。
9.根据权利要求7或8所述的设备,其特征在于,所述掩模包含对气体放电灯的光透明的载体材料,在其上施加具有开口(190)的光反射层(180)。
10.根据权利要求9所述的设备,其特征在于,所述掩模(170)用于在封装处理中将光透明材料(130)按压在部件(110)上。
Claims (9)
1.一种使用无机光透明材料和使用无机光吸收装置封装部件的方法,其特征在于,利用至少一个气体放电灯将光吸收装置加热持续不超过1秒的时间,以将部件气密键合到光透明材料上。
2.根据权利要求1所述的方法,其特征在于,所述无机光透明材料是硅酸盐玻璃。
3.根据权利要求1所述的方法,其特征在于,所述无机光吸收装置是玻璃焊剂。
4.根据权利要求1所述的方法,其特征在于,所述部件包括至少一个传感器、一个显示屏或用于光伏器件或微电子器件的一个半导体。
5.根据权利要求1所述的方法,其特征在于,所述部件的平均温度由于封装过程上升不超过80℃。
6.根据权利要求1所述的方法,其特征在于,所述气体放电灯作为闪光灯运行。
7.一种封装部件(110)的设备(100),所述部件(110)使用无机光透明材料(130),使用无机光吸收装置(140)并使用至少一个气体放电灯(150)用于加热装置,以将部件气密键合到光透明材料上,其特征在于,在所述光透明材料和至少一个气体放电灯之间合并掩模(170),以限制与光吸收装置键合的部件的区域上的光入射(160)。
8.根据权利要求7所述的设备,其特征在于,所述掩模包含对气体放电灯的光透明的载体材料,在其上施加具有开口(190)的光反射层(180)。
9.根据权利要求8所述的设备,其特征在于,所述掩模(170)用于在封装处理中将光透明材料(130)按压在部件(110)上。
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US20190157611A1 (en) | 2019-05-23 |
DE102016110868A1 (de) | 2017-12-14 |
JP7168455B2 (ja) | 2022-11-09 |
EP3468933A1 (de) | 2019-04-17 |
DE102016110868A9 (de) | 2018-03-08 |
DK3468933T3 (da) | 2020-12-07 |
EP3468933B1 (de) | 2020-09-16 |
MY193097A (en) | 2022-09-26 |
ES2829074T3 (es) | 2021-05-28 |
PL3468933T3 (pl) | 2021-04-06 |
KR20190017989A (ko) | 2019-02-20 |
WO2017216261A1 (de) | 2017-12-21 |
CN109415252B (zh) | 2023-06-09 |
KR102259257B1 (ko) | 2021-05-31 |
US11152590B2 (en) | 2021-10-19 |
PT3468933T (pt) | 2020-10-21 |
HUE051233T2 (hu) | 2021-03-01 |
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