PT3134772T - Aparelho de fotolitografia que compreende sistema de projeção para controlo do tamanho de imagem - Google Patents

Aparelho de fotolitografia que compreende sistema de projeção para controlo do tamanho de imagem

Info

Publication number
PT3134772T
PT3134772T PT157168493T PT15716849T PT3134772T PT 3134772 T PT3134772 T PT 3134772T PT 157168493 T PT157168493 T PT 157168493T PT 15716849 T PT15716849 T PT 15716849T PT 3134772 T PT3134772 T PT 3134772T
Authority
PT
Portugal
Prior art keywords
control
projection system
image size
photolithography apparatus
photolithography
Prior art date
Application number
PT157168493T
Other languages
English (en)
Inventor
Charles Dilworth Donald
Original Assignee
Kulicke & Soffa Liteq B V
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kulicke & Soffa Liteq B V filed Critical Kulicke & Soffa Liteq B V
Publication of PT3134772T publication Critical patent/PT3134772T/pt

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/70616—Monitoring the printed patterns
    • G03F7/70641—Focus
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70258—Projection system adjustments, e.g. adjustments during exposure or alignment during assembly of projection system
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B15/00—Optical objectives with means for varying the magnification
    • G02B15/14—Optical objectives with means for varying the magnification by axial movement of one or more lenses or groups of lenses relative to the image plane for continuously varying the equivalent focal length of the objective
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70058—Mask illumination systems
    • G03F7/7015—Details of optical elements

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electromagnetism (AREA)
  • Lenses (AREA)
  • Lens Barrels (AREA)
  • Manufacturing & Machinery (AREA)
PT157168493T 2014-04-23 2015-04-22 Aparelho de fotolitografia que compreende sistema de projeção para controlo do tamanho de imagem PT3134772T (pt)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP14165611 2014-04-23

Publications (1)

Publication Number Publication Date
PT3134772T true PT3134772T (pt) 2018-04-13

Family

ID=50542861

Family Applications (1)

Application Number Title Priority Date Filing Date
PT157168493T PT3134772T (pt) 2014-04-23 2015-04-22 Aparelho de fotolitografia que compreende sistema de projeção para controlo do tamanho de imagem

Country Status (9)

Country Link
US (1) US9939734B2 (pt)
EP (1) EP3134772B1 (pt)
JP (1) JP6626495B2 (pt)
KR (1) KR20160141861A (pt)
CN (1) CN106462077B (pt)
PT (1) PT3134772T (pt)
SG (1) SG11201608670PA (pt)
TW (1) TWI657316B (pt)
WO (1) WO2015162147A1 (pt)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI791216B (zh) * 2020-05-09 2023-02-01 荷蘭商Ａｓｍｌ荷蘭公司 判定用於基板上之圖案的部分之度量
CN117647880B (zh) * 2024-01-29 2024-04-05 长春长光智欧科技有限公司 浸液式高数值孔径宽谱段显微物镜光学系统

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5117255A (en) * 1990-09-19 1992-05-26 Nikon Corporation Projection exposure apparatus
US5610754A (en) 1994-08-09 1997-03-11 Gheen; Gregory Method and apparatus for photolithography by rotational scanning
US6312859B1 (en) * 1996-06-20 2001-11-06 Nikon Corporation Projection exposure method with corrections for image displacement
JP2001117213A (ja) 1999-08-10 2001-04-27 Nikon Corp フォトマスク、該フォトマスクの製造方法、該フォトマスクを扱う投影露光装置、及び投影露光方法
EP1341221A1 (en) 2000-11-22 2003-09-03 Nikon Corporation Aligner, aligning method and method for fabricating device
CN101135864A (zh) 2000-12-28 2008-03-05 株式会社尼康 曝光方法及设备以及器件制造方法
JP2003068622A (ja) * 2001-08-28 2003-03-07 Canon Inc 露光装置及びその制御方法並びにデバイスの製造方法
JP4191923B2 (ja) 2001-11-02 2008-12-03 株式会社東芝 露光方法および露光装置
US20050243295A1 (en) * 2004-04-30 2005-11-03 Asml Netherlands B.V. Lithographic apparatus and device manufacturing

Also Published As

Publication number Publication date
KR20160141861A (ko) 2016-12-09
TW201602733A (zh) 2016-01-16
US20170123329A1 (en) 2017-05-04
EP3134772B1 (en) 2018-03-14
CN106462077B (zh) 2019-01-25
JP2017514184A (ja) 2017-06-01
WO2015162147A1 (en) 2015-10-29
CN106462077A (zh) 2017-02-22
EP3134772A1 (en) 2017-03-01
SG11201608670PA (en) 2016-11-29
JP6626495B2 (ja) 2019-12-25
TWI657316B (zh) 2019-04-21
US9939734B2 (en) 2018-04-10

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