PL73356B2 - - Google Patents

Download PDF

Info

Publication number
PL73356B2
PL73356B2 PL154537A PL15453772A PL73356B2 PL 73356 B2 PL73356 B2 PL 73356B2 PL 154537 A PL154537 A PL 154537A PL 15453772 A PL15453772 A PL 15453772A PL 73356 B2 PL73356 B2 PL 73356B2
Authority
PL
Poland
Prior art keywords
current
carriers
temperature
deposition
semiconductor material
Prior art date
Application number
PL154537A
Other languages
English (en)
Polish (pl)
Other versions
PL73356B1 (Sortimente
Original Assignee
Siemens Aktiengesellschaft
Filing date
Publication date
Priority claimed from DE19712116746 external-priority patent/DE2116746C3/de
Application filed by Siemens Aktiengesellschaft filed Critical Siemens Aktiengesellschaft
Publication of PL73356B1 publication Critical patent/PL73356B1/xx
Publication of PL73356B2 publication Critical patent/PL73356B2/pl

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C01INORGANIC CHEMISTRY
    • C01BNON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B33/00Silicon; Compounds thereof
    • C01B33/02Silicon
    • C01B33/021Preparation
    • C01B33/027Preparation by decomposition or reduction of gaseous or vaporised silicon compounds other than silica or silica-containing material
    • C01B33/035Preparation by decomposition or reduction of gaseous or vaporised silicon compounds other than silica or silica-containing material by decomposition or reduction of gaseous or vaporised silicon compounds in the presence of heated filaments of silicon, carbon or a refractory metal, e.g. tantalum or tungsten, or in the presence of heated silicon rods on which the formed silicon is deposited, a silicon rod being obtained, e.g. Siemens process
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/22Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
    • C23C16/24Deposition of silicon only
PL154537A 1972-04-04 PL73356B2 (Sortimente)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19712116746 DE2116746C3 (de) 1971-04-06 1971-04-06 Verfahren zum Herstellen von Halbleiterstäben durch thermische Zersetzung einer Halbleiterverbindung

Publications (2)

Publication Number Publication Date
PL73356B1 PL73356B1 (Sortimente) 1974-08-30
PL73356B2 true PL73356B2 (Sortimente) 1974-08-31

Family

ID=

Similar Documents

Publication Publication Date Title
US3146123A (en) Method for producing pure silicon
US4565598A (en) Method and apparatus for controlling diameter in Czochralski crystal growth by measuring crystal weight and crystal-melt interface temperature
US3171755A (en) Surface treatment of high-purity semiconductor bodies
EP0896952A1 (de) Verfahren zur Herstellung von hochreinem Siliciumgranulat
KR20010080078A (ko) SiC 벌크 단결정 제조 방법
US3120451A (en) Pyrolytic method for precipitating silicon semiconductor material
JP2013523594A (ja) 単結晶半導体材料の生成
US5006317A (en) Process for producing crystalline silicon ingot in a fluidized bed reactor
US3980042A (en) Vapor deposition apparatus with computer control
CN107555439B (zh) 多晶硅生长电流自动控制方法和装置
ES8603289A1 (es) Una instalacion de control para un reactor de polimerizaciontubular de olefinas
PL73356B2 (Sortimente)
US3736158A (en) Czochralski-grown spinel for use as epitaxial silicon substrate
JPS59190292A (ja) 半導体シリコン単結晶の抵抗率制御方法
Rozenshtein et al. Experimental study of the D+ H2 (ν= 1) reaction
US5160765A (en) Process for the metallization of ceramics and apparatus for carrying out the process
JP2650003B2 (ja) 化学的気相成長法によるシリコン単結晶の製造方法およびその原料クロロシラン類中の超微量元素と製造されたシリコン単結晶中の超微量元素の分別定量方法
US3558376A (en) Method for controlled doping by gas of foreign substance into semiconductor materials
DK142625B (da) Fremgangsmaade og apparat til fremstilling af halvlederstave ved termisk spaltning af en halvlederforbindelse
Clarke et al. Pure and doped indium phosphide by vapour phase epitaxy
US3160476A (en) Process of producing compact boron, particularly in monocrystalline form
US3342715A (en) Method of manufacturing gaseous hydrides in adjustable amounts, method of using such hydrides and device for carrying out such methods
US3328199A (en) Method of producing monocrystalline silicon of high purity
US4217154A (en) Method for control of an open gallium diffusion
US3341359A (en) Process for pyrolytically precipitating elemental semiconductor substance