PL442428A1 - Tyrystor przełączany światłem i sposób wytwarzania takiego tyrystora - Google Patents
Tyrystor przełączany światłem i sposób wytwarzania takiego tyrystoraInfo
- Publication number
- PL442428A1 PL442428A1 PL442428A PL44242822A PL442428A1 PL 442428 A1 PL442428 A1 PL 442428A1 PL 442428 A PL442428 A PL 442428A PL 44242822 A PL44242822 A PL 44242822A PL 442428 A1 PL442428 A1 PL 442428A1
- Authority
- PL
- Poland
- Prior art keywords
- layer
- thyristor
- type conductivity
- counting
- electrically connected
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F30/00—Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors
- H10F30/20—Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors the devices having potential barriers, e.g. phototransistors
- H10F30/21—Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors the devices having potential barriers, e.g. phototransistors the devices being sensitive to infrared, visible or ultraviolet radiation
- H10F30/26—Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors the devices having potential barriers, e.g. phototransistors the devices being sensitive to infrared, visible or ultraviolet radiation the devices having three or more potential barriers, e.g. photothyristors
- H10F30/263—Photothyristors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/80—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials
- H10D62/81—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials of structures exhibiting quantum-confinement effects, e.g. single quantum wells; of structures having periodic or quasi-periodic potential variation
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
- H10D84/01—Manufacture or treatment
- H10D84/0112—Integrating together multiple components covered by H10D8/00, H10D10/00 or H10D18/00, e.g. integrating multiple BJTs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
- H10D84/01—Manufacture or treatment
- H10D84/02—Manufacture or treatment characterised by using material-based technologies
- H10D84/03—Manufacture or treatment characterised by using material-based technologies using Group IV technology, e.g. silicon technology or silicon-carbide [SiC] technology
- H10D84/038—Manufacture or treatment characterised by using material-based technologies using Group IV technology, e.g. silicon technology or silicon-carbide [SiC] technology using silicon technology, e.g. SiGe
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/10—Integrated devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F71/00—Manufacture or treatment of devices covered by this subclass
- H10F71/127—The active layers comprising only Group III-V materials, e.g. GaAs or InP
- H10F71/1278—The active layers comprising only Group III-V materials, e.g. GaAs or InP comprising nitrides, e.g. GaN
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F77/00—Constructional details of devices covered by this subclass
- H10F77/10—Semiconductor bodies
- H10F77/12—Active materials
- H10F77/124—Active materials comprising only Group III-V materials, e.g. GaAs
- H10F77/1248—Active materials comprising only Group III-V materials, e.g. GaAs having three or more elements, e.g. GaAlAs, InGaAs or InGaAsP
- H10F77/12485—Active materials comprising only Group III-V materials, e.g. GaAs having three or more elements, e.g. GaAlAs, InGaAs or InGaAsP comprising nitride compounds, e.g. InGaN
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F77/00—Constructional details of devices covered by this subclass
- H10F77/10—Semiconductor bodies
- H10F77/14—Shape of semiconductor bodies; Shapes, relative sizes or dispositions of semiconductor regions within semiconductor bodies
- H10F77/146—Superlattices; Multiple quantum well structures
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F77/00—Constructional details of devices covered by this subclass
- H10F77/20—Electrodes
- H10F77/206—Electrodes for devices having potential barriers
- H10F77/241—Electrodes for devices having potential barriers comprising ring electrodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
- H10P14/38—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials characterised by treatments done after the formation of the materials
- H10P14/3822—Controlling the interface between substrate and epitaxial layer, e.g. by ion implantation followed by annealing
Landscapes
- Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
- Thyristors (AREA)
Abstract
Tyrystor zawiera półprzewodnikową warstwową strukturę epitaksjalną (2-6), wykonaną z azotków metali III grupy i naniesioną na podłoże krystaliczne (1), oraz pierwszy (7) i drugi terminal prądowy (8). W strukturze tej (2-6) pierwszą warstwą, licząc od wspomnianego podłoża krystalicznego (1), jest dolna warstwa (2) o przewodnictwie typu n, połączona elektrycznie z drugim terminalem prądowym (8), a ostatnią warstwą w tej strukturze jest górna warstwa o przewodnictwie typu p, połączona elektrycznie z pierwszym terminalem prądowym (7). Pomiędzy dolną warstwą (2) o przewodnictwie typu n i górną warstwą o (6) przewodnictwie typu p znajduje się zespół trzech warstw (3-5), który tworzą, licząc od podłoża krystalicznego (1), dolna warstwa niedomieszkowana (3), warstwa wytwarzająca ładunki piezoelektryczne (4), o przerwie energetycznej niższej niż przerwa energetyczna pozostałych warstw (2, 3, 5, 6) struktury epitaksjalnej, oraz górna warstwa niedomieszkowana (5). Strukturę warstwową tyrystora wytwarza się z azotków metali z grupy III w procesie wzrostu epitaksjalnego z wiązek molekularnych z użyciem plazmy azotowej PAMBE.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PL442428A PL442428A1 (pl) | 2022-09-30 | 2022-09-30 | Tyrystor przełączany światłem i sposób wytwarzania takiego tyrystora |
| EP23199813.9A EP4345919A1 (en) | 2022-09-30 | 2023-09-26 | Light-triggered thyristor and method of fabrication of such thyristor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PL442428A PL442428A1 (pl) | 2022-09-30 | 2022-09-30 | Tyrystor przełączany światłem i sposób wytwarzania takiego tyrystora |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| PL442428A1 true PL442428A1 (pl) | 2024-04-02 |
Family
ID=88511497
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PL442428A PL442428A1 (pl) | 2022-09-30 | 2022-09-30 | Tyrystor przełączany światłem i sposób wytwarzania takiego tyrystora |
Country Status (2)
| Country | Link |
|---|---|
| EP (1) | EP4345919A1 (pl) |
| PL (1) | PL442428A1 (pl) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2004061923A1 (en) * | 2002-12-27 | 2004-07-22 | General Electric Company | Gallium nitride crystal, homoepitaxial gallium-nitride-based devices and method for producing same |
| US20120091465A1 (en) * | 2010-10-13 | 2012-04-19 | Soraa, Inc. | Method of Making Bulk InGaN Substrates and Devices Thereon |
| JP2017152542A (ja) * | 2016-02-24 | 2017-08-31 | ユニークチップス合同会社 | 光駆動半導体素子 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE1048359B (pl) | 1952-07-22 | |||
| US4806997A (en) | 1985-06-14 | 1989-02-21 | AT&T Laboratories American Telephone and Telegraph Company | Double heterostructure optoelectronic switch |
| EP0273344B1 (en) | 1986-12-22 | 1992-10-14 | Nec Corporation | A pnpn thyristor |
| US5539217A (en) | 1993-08-09 | 1996-07-23 | Cree Research, Inc. | Silicon carbide thyristor |
| JP3692867B2 (ja) * | 1999-11-05 | 2005-09-07 | 豊田合成株式会社 | Iii族窒化物系化合物半導体素子 |
-
2022
- 2022-09-30 PL PL442428A patent/PL442428A1/pl unknown
-
2023
- 2023-09-26 EP EP23199813.9A patent/EP4345919A1/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2004061923A1 (en) * | 2002-12-27 | 2004-07-22 | General Electric Company | Gallium nitride crystal, homoepitaxial gallium-nitride-based devices and method for producing same |
| US20120091465A1 (en) * | 2010-10-13 | 2012-04-19 | Soraa, Inc. | Method of Making Bulk InGaN Substrates and Devices Thereon |
| JP2017152542A (ja) * | 2016-02-24 | 2017-08-31 | ユニークチップス合同会社 | 光駆動半導体素子 |
Also Published As
| Publication number | Publication date |
|---|---|
| EP4345919A1 (en) | 2024-04-03 |
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