PL426531A1 - Sposób wytwarzania ścieżki koralikowej na powierzchni substratu, system do wytwarzania takiej ścieżki i jej zastosowanie oraz zestaw - Google Patents

Sposób wytwarzania ścieżki koralikowej na powierzchni substratu, system do wytwarzania takiej ścieżki i jej zastosowanie oraz zestaw

Info

Publication number
PL426531A1
PL426531A1 PL426531A PL42653118A PL426531A1 PL 426531 A1 PL426531 A1 PL 426531A1 PL 426531 A PL426531 A PL 426531A PL 42653118 A PL42653118 A PL 42653118A PL 426531 A1 PL426531 A1 PL 426531A1
Authority
PL
Poland
Prior art keywords
substrate
bead
microcapillary
suspension
producing
Prior art date
Application number
PL426531A
Other languages
English (en)
Other versions
PL235124B1 (pl
Inventor
Zbigniew ROZYNEK
Agnieszka MAGDZIARZ
Original Assignee
Magdziarz Agnieszka Cadenas
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Magdziarz Agnieszka Cadenas filed Critical Magdziarz Agnieszka Cadenas
Priority to PL426531A priority Critical patent/PL235124B1/pl
Priority to US17/262,437 priority patent/US11856709B2/en
Priority to PCT/PL2019/000063 priority patent/WO2020027673A1/en
Priority to EP19773202.7A priority patent/EP3831171B1/en
Publication of PL426531A1 publication Critical patent/PL426531A1/pl
Publication of PL235124B1 publication Critical patent/PL235124B1/pl

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/097—Inks comprising nanoparticles and specially adapted for being sintered at low temperature
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0286—Programmable, customizable or modifiable circuits
    • H05K1/0293—Individual printed conductors which are adapted for modification, e.g. fusable or breakable conductors, printed switches
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0212—Resin particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0215—Metallic fillers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0218—Composite particles, i.e. first metal coated with second metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0221—Insulating particles having an electrically conductive coating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0242—Shape of an individual particle
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0242—Shape of an individual particle
    • H05K2201/0257—Nanoparticles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0263—Details about a collection of particles
    • H05K2201/0272—Mixed conductive particles, i.e. using different conductive particles, e.g. differing in shape
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0121—Patterning, e.g. plating or etching by moving electrode
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0126—Dispenser, e.g. for solder paste, for supplying conductive paste for screen printing or for filling holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/105—Using an electrical field; Special methods of applying an electric potential
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1131—Sintering, i.e. fusing of metal particles to achieve or improve electrical conductivity
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/163—Monitoring a manufacturing process
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/20—Electrodes
    • H10F77/206—Electrodes for devices having potential barriers
    • H10F77/211—Electrodes for devices having potential barriers for photovoltaic cells

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Nanotechnology (AREA)
  • Dispersion Chemistry (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)
  • Photovoltaic Devices (AREA)
  • Hybrid Cells (AREA)

Abstract

Zgłoszenie przedstawione na rysunku dotyczy sposobu wytwarzania ścieżki koralikowej na powierzchni substratu, w którym przygotowuje się zawiesinę cząstek w cieczy, przygotowaną zawiesinę dostarcza się w sposób ciągły do co najmniej jednej przewodzącej elektrycznie mikrokapilary, tworzy się i utrzymuje menisk wypukły zawiesiny na wylotowym końcu mikrokapilary znajdującej się nad i/lub pod powierzchnią substratu, do mikrokapilary doprowadza się zmienne napięcie elektryczne z uformowaniem struktury koralikowej pomiędzy meniskiem zawiesiny a powierzchnią substratu, oraz przemieszcza się mikrokapilarę względem substratu i/lub substrat względem mikrokapilary układając cząstki uformowanej struktury koralikowej na powierzchni substratu z wytworzeniem ścieżki koralikowej na tej powierzchni i jednocześnie odbudowując wspomnianą strukturę koralikową uformowaną pomiędzy meniskiem zawiesiny a powierzchnią substratu. Zgłoszenie dotyczy również systemu do realizacji przedmiotowego sposobu oraz zastosowania ścieżki koralikowej wytworzonej tym sposobem do wytwarzania elektrod w ogniwach fotowoltaicznych, nowej generacji odzieży, elementów elektroniki, w tym elektroniki elastycznej, sztucznych wici, materiałów fotonicznych, materiałów optomechanicznych, oraz do regeneracji uszkodzonych ścieżek z cząstek na powierzchni substratu. Zgłoszenie dotyczy także zestawu obejmującego substrat oraz ścieżkę koralikową wytworzoną na jego powierzchni przedmiotowym sposobem.
PL426531A 2018-08-02 2018-08-02 Sposób wytwarzania ścieżki koralikowej na powierzchni substratu, system do wytwarzania takiej ścieżki i jej zastosowania oraz zestaw PL235124B1 (pl)

Priority Applications (4)

Application Number Priority Date Filing Date Title
PL426531A PL235124B1 (pl) 2018-08-02 2018-08-02 Sposób wytwarzania ścieżki koralikowej na powierzchni substratu, system do wytwarzania takiej ścieżki i jej zastosowania oraz zestaw
US17/262,437 US11856709B2 (en) 2018-08-02 2019-08-01 Process of fabricating a beaded path on the surface of a substrate, a system for fabricating such a path, use thereof, and a kit
PCT/PL2019/000063 WO2020027673A1 (en) 2018-08-02 2019-08-01 Process of fabricating a beaded path on the surface of a substrate, a system for fabricating such a path, use thereof, and a kit
EP19773202.7A EP3831171B1 (en) 2018-08-02 2019-08-01 Process of fabricating a beaded path on the surface of a substrate, a system for fabricating such a path, use thereof, and a kit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PL426531A PL235124B1 (pl) 2018-08-02 2018-08-02 Sposób wytwarzania ścieżki koralikowej na powierzchni substratu, system do wytwarzania takiej ścieżki i jej zastosowania oraz zestaw

Publications (2)

Publication Number Publication Date
PL426531A1 true PL426531A1 (pl) 2020-02-10
PL235124B1 PL235124B1 (pl) 2020-06-01

Family

ID=68000048

Family Applications (1)

Application Number Title Priority Date Filing Date
PL426531A PL235124B1 (pl) 2018-08-02 2018-08-02 Sposób wytwarzania ścieżki koralikowej na powierzchni substratu, system do wytwarzania takiej ścieżki i jej zastosowania oraz zestaw

Country Status (4)

Country Link
US (1) US11856709B2 (pl)
EP (1) EP3831171B1 (pl)
PL (1) PL235124B1 (pl)
WO (1) WO2020027673A1 (pl)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023187222A1 (en) * 2022-04-01 2023-10-05 Fepod Oy Ltd Coating or surface treatment method, substrate and apparatus

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7098163B2 (en) * 1998-08-27 2006-08-29 Cabot Corporation Method of producing membrane electrode assemblies for use in proton exchange membrane and direct methanol fuel cells
JP3975272B2 (ja) * 2002-02-21 2007-09-12 独立行政法人産業技術総合研究所 超微細流体ジェット装置
JP2009513842A (ja) * 2005-10-31 2009-04-02 ザ、トラスティーズ オブ プリンストン ユニバーシティ 電気流体力学的印刷および製造
EP2540661A1 (en) 2011-06-27 2013-01-02 ETH Zurich Method for nano-dripping 1D, 2D, 3D structures on a substrate

Also Published As

Publication number Publication date
US20210235585A1 (en) 2021-07-29
EP3831171A1 (en) 2021-06-09
WO2020027673A1 (en) 2020-02-06
PL235124B1 (pl) 2020-06-01
US11856709B2 (en) 2023-12-26
EP3831171B1 (en) 2022-09-28

Similar Documents

Publication Publication Date Title
US11299816B2 (en) Methods of three-dimensional electrophoretic deposition for ceramic and cermet applications and systems thereof
KR101670131B1 (ko) 코팅 대전층을 포함하는 접촉 대전 발전기 및 그 생성 방법
Yang et al. Highly stretchable PTFE particle enhanced triboelectric nanogenerator for droplet energy harvestings
Felici et al. Electroconvection in insulating liquids with special reference to uni-and bi-polar injection: a review of the research work at the CNRS Laboratory for Electrostatics, Grenoble 1969–1976
CN108336145B (zh) 人工神经元结构及其制备方法、信号和时间提取方法
US11239768B2 (en) Liquid droplet powered electricity generator
Chen et al. A spiking neuron circuit based on a carbon nanotube transistor
Lin et al. Water droplet energy harvesting
WO2013019814A3 (en) System and method for tissue construction using an electric field applicator
ATE541309T1 (de) System zum modifizieren kleiner strukturen
PL426531A1 (pl) Sposób wytwarzania ścieżki koralikowej na powierzchni substratu, system do wytwarzania takiej ścieżki i jej zastosowanie oraz zestaw
JP2006501370A (ja) ナノ粒子の膜の電場補助的な堆積方法
Ji et al. Effect of surface texture on the output performance of lateral sliding-mode triboelectric nanogenerator
CN106938359A (zh) 一种金属仿生微纳结构的可控制备方法
JP2019519089A (ja) 基板上に配線構造体を形成するためのボトムアップ方法
Lu et al. A new photovoltaic lunar dust removal technique based on the coplanar bipolar electrodes
CN101613872A (zh) 具有电润湿特性的超疏水表面制备方法
CN112414438B (zh) 基于神经元晶体管的柔性传感器
Yu et al. Simulation-guided plasma surface engineering for enhanced triboelectric Nanogenerator performance
Di et al. Light-Induced Electrodeposition: A novel method for additive manufacturing of copper microstructures
Tian et al. On the mechanism of contact electrification: a comprehensive review
Jarschel et al. Single-electron tunneling pbs/inp heterostructure nanoplatelets for synaptic operations
KR20200007361A (ko) 메탈울이 구비된 마찰대전 발전기 및 이의 제조방법
Xu et al. Graphene/F16CuPc synaptic transistor for the emulation of multiplexed neurotransmission
Chen et al. Ultra‐Low‐Power Vertical Organic Synaptic Phototransistors for Neuromorphic Vision Preprocessing