PL4146848T3 - Elektrolit srebra do oddzielania warstw dyspersyjnych srebra - Google Patents
Elektrolit srebra do oddzielania warstw dyspersyjnych srebraInfo
- Publication number
- PL4146848T3 PL4146848T3 PL22755083.7T PL22755083T PL4146848T3 PL 4146848 T3 PL4146848 T3 PL 4146848T3 PL 22755083 T PL22755083 T PL 22755083T PL 4146848 T3 PL4146848 T3 PL 4146848T3
- Authority
- PL
- Poland
- Prior art keywords
- silver
- separating
- electrolyte
- dispersion layers
- layers
- Prior art date
Links
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 title 2
- 229910052709 silver Inorganic materials 0.000 title 2
- 239000004332 silver Substances 0.000 title 2
- 239000006185 dispersion Substances 0.000 title 1
- 239000003792 electrolyte Substances 0.000 title 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/46—Electroplating: Baths therefor from solutions of silver
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
- C25D7/0614—Strips or foils
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102021118820.2A DE102021118820A1 (de) | 2021-07-21 | 2021-07-21 | Silber-Elektrolyt |
| PCT/EP2022/070294 WO2023001868A1 (de) | 2021-07-21 | 2022-07-20 | Silberelektrolyt zur abscheidung von silberdispersionsschichten |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| PL4146848T3 true PL4146848T3 (pl) | 2024-07-01 |
Family
ID=82939917
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PL22755083.7T PL4146848T3 (pl) | 2021-07-21 | 2022-07-20 | Elektrolit srebra do oddzielania warstw dyspersyjnych srebra |
Country Status (7)
| Country | Link |
|---|---|
| EP (1) | EP4146848B8 (pl) |
| JP (1) | JP2024526925A (pl) |
| KR (1) | KR20240031423A (pl) |
| CN (1) | CN117677733A (pl) |
| DE (1) | DE102021118820A1 (pl) |
| PL (1) | PL4146848T3 (pl) |
| WO (1) | WO2023001868A1 (pl) |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE1228887B (de) | 1961-10-26 | 1966-11-17 | Riedel & Co | Verfahren zum galvanischen Abscheiden von Silber-Antimon- oder Silber-Wismut-Legierungen hoher Haerte |
| DE2543082C3 (de) | 1975-09-26 | 1979-06-28 | Siemens Ag, 1000 Berlin Und 8000 Muenchen | Cyanidischer Silberelektrolyt und Verfahren zur galvanischen Abscheidung von Silber-Graphit-Dispersionsüberzügen und seine Anwendung |
| DE4010346A1 (de) | 1990-03-28 | 1991-10-02 | Siemens Ag | Verfahren zum aufbringen von silber-graphit-dispersionsueberzuegen |
| CN1692182A (zh) * | 2002-11-28 | 2005-11-02 | 新光电气工业株式会社 | 银电镀液 |
| DE10346206A1 (de) | 2003-10-06 | 2005-04-28 | Bosch Gmbh Robert | Kontaktoberflächen für elektrische Kontakte |
| DE102008030988B4 (de) | 2008-06-27 | 2010-04-01 | Siemens Aktiengesellschaft | Bauteil mit einer Schicht, in die CNT (Carbon Nanotubes) eingebaut sind und Verfahren zu dessen Herstellung |
| DE102015102453A1 (de) | 2015-02-20 | 2016-08-25 | Heraeus Deutschland GmbH & Co. KG | Bandförmiges Substrat zur Herstellung von Chipkartenmodulen, Chipkartenmodul, elektronische Einrichtung mit einem derartigen Chipkartenmodul und Verfahren zur Herstellung eines Substrates |
| CN105297095A (zh) | 2015-12-14 | 2016-02-03 | 南昌航空大学 | 一种纯银层/银石墨复合层的功能性镀层及制备方法 |
| DE102018005352A1 (de) | 2018-07-05 | 2020-01-09 | Dr.-Ing. Max Schlötter GmbH & Co KG | Silberelektrolyt zur Abscheidung von Dispersions-Silberschichten und Kontaktoberflächen mit Dispersions-Silberschichten |
| CN111519232B (zh) | 2020-04-20 | 2022-03-11 | 国网江西省电力有限公司电力科学研究院 | 一种银/石墨烯复合镀液及其使用方法和银/石墨烯复合镀层 |
-
2021
- 2021-07-21 DE DE102021118820.2A patent/DE102021118820A1/de active Pending
-
2022
- 2022-07-20 KR KR1020247005978A patent/KR20240031423A/ko active Pending
- 2022-07-20 JP JP2024503744A patent/JP2024526925A/ja active Pending
- 2022-07-20 CN CN202280051010.0A patent/CN117677733A/zh active Pending
- 2022-07-20 WO PCT/EP2022/070294 patent/WO2023001868A1/de not_active Ceased
- 2022-07-20 PL PL22755083.7T patent/PL4146848T3/pl unknown
- 2022-07-20 EP EP22755083.7A patent/EP4146848B8/de active Active
Also Published As
| Publication number | Publication date |
|---|---|
| EP4146848A1 (de) | 2023-03-15 |
| KR20240031423A (ko) | 2024-03-07 |
| JP2024526925A (ja) | 2024-07-19 |
| EP4146848B1 (de) | 2024-04-10 |
| DE102021118820A1 (de) | 2023-01-26 |
| CN117677733A (zh) | 2024-03-08 |
| EP4146848B8 (de) | 2024-07-24 |
| WO2023001868A1 (de) | 2023-01-26 |
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