PL3829280T3 - Systemy chłodzenia przystosowane do termicznego łączenia ich z urządzeniami wytwarzającymi ciepło - Google Patents

Systemy chłodzenia przystosowane do termicznego łączenia ich z urządzeniami wytwarzającymi ciepło

Info

Publication number
PL3829280T3
PL3829280T3 PL19315151.1T PL19315151T PL3829280T3 PL 3829280 T3 PL3829280 T3 PL 3829280T3 PL 19315151 T PL19315151 T PL 19315151T PL 3829280 T3 PL3829280 T3 PL 3829280T3
Authority
PL
Poland
Prior art keywords
heat
cooling systems
thermally connected
generating equipment
systems adapted
Prior art date
Application number
PL19315151.1T
Other languages
English (en)
Inventor
Ali Chehade
Hadrien Bauduin
Original Assignee
Ovh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ovh filed Critical Ovh
Publication of PL3829280T3 publication Critical patent/PL3829280T3/pl

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20763—Liquid cooling without phase change
    • H05K7/20772—Liquid cooling without phase change within server blades for removing heat from heat source
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D20/00—Heat storage plants or apparatus in general; Regenerative heat-exchange apparatus not covered by groups F28D17/00 or F28D19/00
    • F28D20/02—Heat storage plants or apparatus in general; Regenerative heat-exchange apparatus not covered by groups F28D17/00 or F28D19/00 using latent heat
    • F28D20/021—Heat storage plants or apparatus in general; Regenerative heat-exchange apparatus not covered by groups F28D17/00 or F28D19/00 using latent heat the latent heat storage material and the heat-exchanging means being enclosed in one container
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/18—Packaging or power distribution
    • G06F1/181—Enclosures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/02—Details
    • H05K5/0209—Thermal insulation, e.g. for fire protection or for fire containment or for high temperature environments
    • H05K5/0211—Thermal buffers, e.g. latent heat absorbers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20327—Accessories for moving fluid, for connecting fluid conduits, for distributing fluid or for preventing leakage, e.g. pumps, tanks or manifolds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20763—Liquid cooling without phase change
    • H05K7/20781—Liquid cooling without phase change within cabinets for removing heat from server blades
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20763—Liquid cooling without phase change
    • H05K7/2079—Liquid cooling without phase change within rooms for removing heat from cabinets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/208—Liquid cooling with phase change
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/40—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
    • H10W40/47—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing liquids, e.g. forced water cooling
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/73—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control for cooling by change of state
    • H10W40/735—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control for cooling by change of state by melting or evaporation of solids
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20254—Cold plates transferring heat from heat source to coolant
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/208—Liquid cooling with phase change
    • H05K7/20809—Liquid cooling with phase change within server blades for removing heat from heat source

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Thermal Sciences (AREA)
  • Computer Hardware Design (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
PL19315151.1T 2019-11-29 2019-11-29 Systemy chłodzenia przystosowane do termicznego łączenia ich z urządzeniami wytwarzającymi ciepło PL3829280T3 (pl)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP19315151.1A EP3829280B1 (en) 2019-11-29 2019-11-29 Cooling systems adapted to be thermally connected to heat-generating equipment

Publications (1)

Publication Number Publication Date
PL3829280T3 true PL3829280T3 (pl) 2023-08-14

Family

ID=69185287

Family Applications (1)

Application Number Title Priority Date Filing Date
PL19315151.1T PL3829280T3 (pl) 2019-11-29 2019-11-29 Systemy chłodzenia przystosowane do termicznego łączenia ich z urządzeniami wytwarzającymi ciepło

Country Status (5)

Country Link
US (2) US11406047B2 (pl)
EP (2) EP3829280B1 (pl)
CN (1) CN112882556B (pl)
DK (1) DK3829280T3 (pl)
PL (1) PL3829280T3 (pl)

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US11547022B2 (en) * 2021-05-13 2023-01-03 Baidu Usa Llc Thermal management plate for critical processors
US12341082B2 (en) * 2021-08-06 2025-06-24 Baidu Usa Llc Chip cooling package with multiple fluid paths
US11985800B2 (en) * 2022-03-21 2024-05-14 Microsoft Tech nology Licensing, LLC Systems and methods for multiphase thermal management
US12048127B2 (en) * 2022-03-21 2024-07-23 Baidu Usa Llc Distribution hardware for two phase system recirculation
US20250321061A1 (en) * 2022-07-15 2025-10-16 Barry Richard Brooks Modular thermal energy storage and transfer in a pcm hosting system
CN115420054B (zh) * 2022-08-12 2024-07-30 清华大学合肥公共安全研究院 冷却水系统的开环控制方法、系统以及存储介质
CA3265979A1 (en) * 2022-09-02 2024-03-07 Sun-Ice Energy Pte. Ltd Device for cooling a datacenter computer server by using a phase-change material
CN116137374A (zh) * 2023-03-15 2023-05-19 航天恒星科技有限公司 一种星载有源相控阵天线热控装置及方法
CN116581093B (zh) * 2023-05-08 2024-08-02 东南大学 一种储热型大功率器件冷却装置
EP4489535A1 (en) * 2023-07-05 2025-01-08 Harman Becker Automotive Systems GmbH Emergency cooling for liquid-cooled systems
WO2025129103A1 (en) * 2023-12-14 2025-06-19 Digital Porpoise, Llc Phase change cooling system
WO2025245081A1 (en) * 2024-05-20 2025-11-27 Baltimore Aircoil Company, Inc. Coolant distribution unit and method
DE102024208811A1 (de) * 2024-09-16 2026-03-19 Robert Bosch Gesellschaft mit beschränkter Haftung Verfahren zum Notentwärmen eines Steuergeräts

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US5765389A (en) * 1997-04-24 1998-06-16 Ival O. Salyer Cooling unit with integral thermal energy storage
US6397618B1 (en) * 2001-05-30 2002-06-04 International Business Machines Corporation Cooling system with auxiliary thermal buffer unit for cooling an electronics module
US7086247B2 (en) * 2004-08-31 2006-08-08 International Business Machines Corporation Cooling system and method employing auxiliary thermal capacitor unit for facilitating continuous operation of an electronics rack
US7274566B2 (en) * 2004-12-09 2007-09-25 International Business Machines Corporation Cooling apparatus for an electronics subsystem employing a coolant flow drive apparatus between coolant flow paths
US7882888B1 (en) * 2005-02-23 2011-02-08 Swales & Associates, Inc. Two-phase heat transfer system including a thermal capacitance device
US20070227710A1 (en) * 2006-04-03 2007-10-04 Belady Christian L Cooling system for electrical devices
US7433190B2 (en) * 2006-10-06 2008-10-07 Honeywell International Inc. Liquid cooled electronic chassis having a plurality of phase change material reservoirs
US7681404B2 (en) * 2006-12-18 2010-03-23 American Power Conversion Corporation Modular ice storage for uninterruptible chilled water
DE102008004053A1 (de) * 2008-01-11 2009-07-23 Airbus Deutschland Gmbh Spitzenlast-Kühlung von elektronischen Bauteilen durch phasenwechselnde Materialien
WO2011025487A1 (en) * 2009-08-27 2011-03-03 Hewlett-Packard Development Company, L.P. Heat storage by phase-change material
TWI394033B (zh) * 2009-10-30 2013-04-21 Ibm 用於不同高度之電腦系統的風扇控制系統與方法
US8783052B2 (en) * 2010-11-04 2014-07-22 International Business Machines Corporation Coolant-buffered, vapor-compression refrigeration with thermal storage and compressor cycling
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Also Published As

Publication number Publication date
EP3829280A1 (en) 2021-06-02
US11406047B2 (en) 2022-08-02
EP3829280B1 (en) 2023-06-07
CN112882556B (zh) 2024-09-20
US20210168970A1 (en) 2021-06-03
US11937406B2 (en) 2024-03-19
CN112882556A (zh) 2021-06-01
DK3829280T3 (da) 2023-06-26
EP3829282A1 (en) 2021-06-02
US20220304194A1 (en) 2022-09-22

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