PL3369522T3 - Pasta lutownicza - Google Patents

Pasta lutownicza

Info

Publication number
PL3369522T3
PL3369522T3 PL16859805.0T PL16859805T PL3369522T3 PL 3369522 T3 PL3369522 T3 PL 3369522T3 PL 16859805 T PL16859805 T PL 16859805T PL 3369522 T3 PL3369522 T3 PL 3369522T3
Authority
PL
Poland
Prior art keywords
soldering paste
soldering
paste
Prior art date
Application number
PL16859805.0T
Other languages
English (en)
Inventor
Motohide SASAKI
Takeshi YAHAGI
Noriyoshi Uchida
Original Assignee
Koki Company Limited
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koki Company Limited filed Critical Koki Company Limited
Publication of PL3369522T3 publication Critical patent/PL3369522T3/pl

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B23K35/3615—N-compounds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016—Brazing of electronic components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/362—Selection of compositions of fluxes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
PL16859805.0T 2015-10-26 2016-10-25 Pasta lutownicza PL3369522T3 (pl)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015209954A JP2017080757A (ja) 2015-10-26 2015-10-26 フラックス、及び、はんだ組成物
PCT/JP2016/081621 WO2017073575A1 (ja) 2015-10-26 2016-10-25 フラックス、及び、はんだ組成物

Publications (1)

Publication Number Publication Date
PL3369522T3 true PL3369522T3 (pl) 2025-05-19

Family

ID=58630233

Family Applications (1)

Application Number Title Priority Date Filing Date
PL16859805.0T PL3369522T3 (pl) 2015-10-26 2016-10-25 Pasta lutownicza

Country Status (7)

Country Link
US (1) US10933495B2 (pl)
EP (1) EP3369522B1 (pl)
JP (1) JP2017080757A (pl)
KR (1) KR20170134776A (pl)
CN (1) CN107614190A (pl)
PL (1) PL3369522T3 (pl)
WO (1) WO2017073575A1 (pl)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6338007B1 (ja) * 2017-11-02 2018-06-06 千住金属工業株式会社 フラックス及びソルダペースト
CN109530969A (zh) * 2018-12-25 2019-03-29 重庆理工大学 一种环保无卤素水基助焊剂及其制备方法
CN109530973A (zh) * 2018-12-25 2019-03-29 重庆理工大学 一种低挥发低固含量水基助焊剂及其制备方法
CN109514129A (zh) * 2018-12-25 2019-03-26 重庆理工大学 一种低固含量环保水基助焊剂及其制备方法
CN109530970A (zh) * 2018-12-25 2019-03-29 重庆理工大学 一种电子组装用水基助焊剂及其制备方法
CN109530971A (zh) * 2018-12-25 2019-03-29 重庆理工大学 一种低碳低挥发性水基助焊剂及其制备方法
CN109530972A (zh) * 2018-12-25 2019-03-29 重庆理工大学 一种低固低碳水基助焊剂及其制备方法
JP2021065929A (ja) * 2019-10-28 2021-04-30 パナソニックＩｐマネジメント株式会社 はんだペースト及び接合構造体
CN119609460B (zh) * 2024-12-14 2025-07-29 东莞市千岛金属锡品有限公司 一种高湿润型无卤助焊剂及制备方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4820604B1 (pl) * 1970-06-19 1973-06-22
JP3499904B2 (ja) * 1993-10-22 2004-02-23 日本アルファメタルズ株式会社 はんだ付け用フラックス
JPH0952195A (ja) * 1995-08-11 1997-02-25 Aoki Metal:Kk はんだ付け用フラックス
JP4186184B2 (ja) * 2002-11-08 2008-11-26 タムラ化研株式会社 回路基板はんだ付用フラックス及びソルダーペースト
JP4820604B2 (ja) 2004-09-14 2011-11-24 株式会社東芝 Ｘ線コンピュータ断層撮影装置
JP2008110392A (ja) 2006-10-31 2008-05-15 Harima Chem Inc はんだ付け用フラックスおよびはんだペースト組成物
JP2010221260A (ja) 2009-03-24 2010-10-07 Mitsubishi Materials Corp はんだ粉末及び該粉末を用いたはんだペースト
US8070045B1 (en) 2010-12-02 2011-12-06 Rohm And Haas Electronic Materials Llc Curable amine flux composition and method of soldering
CN102357748A (zh) 2011-10-18 2012-02-22 苏州之侨新材料科技有限公司 一种无铅焊料用无卤素无松香抗菌型免清洗助焊剂

Also Published As

Publication number Publication date
JP2017080757A (ja) 2017-05-18
US10933495B2 (en) 2021-03-02
KR20170134776A (ko) 2017-12-06
EP3369522A4 (en) 2019-06-19
EP3369522B1 (en) 2025-01-22
CN107614190A (zh) 2018-01-19
EP3369522A1 (en) 2018-09-05
WO2017073575A1 (ja) 2017-05-04
US20180147675A1 (en) 2018-05-31

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