PL2953172T3 - Konstrukcja zespołu źródła światła led i sposób tworzenia zespołu źródła światła led - Google Patents

Konstrukcja zespołu źródła światła led i sposób tworzenia zespołu źródła światła led

Info

Publication number
PL2953172T3
PL2953172T3 PL14197925T PL14197925T PL2953172T3 PL 2953172 T3 PL2953172 T3 PL 2953172T3 PL 14197925 T PL14197925 T PL 14197925T PL 14197925 T PL14197925 T PL 14197925T PL 2953172 T3 PL2953172 T3 PL 2953172T3
Authority
PL
Poland
Prior art keywords
light source
led light
package structure
packaging method
source package
Prior art date
Application number
PL14197925T
Other languages
English (en)
Inventor
Riguang Zhang
Sheng Lin
Yaohua Zhang
Yuanbao Du
Original Assignee
Ningbo Sunpu Led Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ningbo Sunpu Led Co., Ltd. filed Critical Ningbo Sunpu Led Co., Ltd.
Publication of PL2953172T3 publication Critical patent/PL2953172T3/pl

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
    • H01L33/502—Wavelength conversion materials
    • H01L33/504—Elements with two or more wavelength conversion materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/507—Wavelength conversion elements the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
    • F21K9/64—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction using wavelength conversion means distinct or spaced from the light-generating element, e.g. a remote phosphor layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/49105—Connecting at different heights
    • H01L2224/49107—Connecting at different heights on the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/0132—Binary Alloys
    • H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12041—LED
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/156—Material
    • H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
    • H01L2924/15787—Ceramics, e.g. crystalline carbides, nitrides or oxides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/156—Material
    • H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
    • H01L2924/15788—Glasses, e.g. amorphous oxides, nitrides or fluorides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/505—Wavelength conversion elements characterised by the shape, e.g. plate or foil
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Led Device Packages (AREA)
PL14197925T 2014-06-03 2014-12-15 Konstrukcja zespołu źródła światła led i sposób tworzenia zespołu źródła światła led PL2953172T3 (pl)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201410243610.4A CN103972221A (zh) 2014-06-03 2014-06-03 Led光源封装结构及led光源封装方法
EP14197925.2A EP2953172B1 (en) 2014-06-03 2014-12-15 Led light source package structure and led light source packaging method

Publications (1)

Publication Number Publication Date
PL2953172T3 true PL2953172T3 (pl) 2019-09-30

Family

ID=51241545

Family Applications (1)

Application Number Title Priority Date Filing Date
PL14197925T PL2953172T3 (pl) 2014-06-03 2014-12-15 Konstrukcja zespołu źródła światła led i sposób tworzenia zespołu źródła światła led

Country Status (3)

Country Link
EP (1) EP2953172B1 (pl)
CN (1) CN103972221A (pl)
PL (1) PL2953172T3 (pl)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105322076A (zh) * 2014-09-05 2016-02-10 姚晓宁 Led灯具远程激发式荧光转换膜的形成方法
CN107763568A (zh) * 2018-01-26 2018-03-06 北国之光（辽宁）科技有限公司 一种关于led远程激发荧光粉层的制备方法
CN115274639B (zh) * 2022-08-17 2023-04-07 珠海市宏科光电子有限公司 一种调光调色集成cob光源及其加工工艺

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61280626A (ja) * 1985-05-08 1986-12-11 Sanyo Electric Co Ltd ワイヤボンデイング方法
JPH01297834A (ja) * 1988-05-25 1989-11-30 Nec Corp ワイヤボンデイング方法
US6621211B1 (en) * 2000-05-15 2003-09-16 General Electric Company White light emitting phosphor blends for LED devices
JP2003298120A (ja) * 2002-04-03 2003-10-17 Idec Izumi Corp 光源装置および蛍光パターンシート、それらの製造方法、ならびにそれを用いた液晶ディスプレイ装置、照明装置、掲示灯、表示灯および押しボタンスイッチ
CN100369533C (zh) * 2004-01-18 2008-02-13 敦南科技股份有限公司 电路板封装的焊线方法
CN100399589C (zh) * 2004-12-17 2008-07-02 杨秋忠 具高效率散热及亮度的晶片
KR100833187B1 (ko) * 2006-11-02 2008-05-28 삼성전자주식회사 반도체 패키지의 와이어 본딩방법
US8921876B2 (en) * 2009-06-02 2014-12-30 Cree, Inc. Lighting devices with discrete lumiphor-bearing regions within or on a surface of remote elements
CN102270732B (zh) * 2010-06-03 2015-06-10 展晶科技(深圳)有限公司 荧光层结构及其形成方法以及发光二极管封装结构
TWI441361B (zh) * 2010-12-31 2014-06-11 Interlight Optotech Corp 發光二極體封裝結構及其製造方法
US9324924B2 (en) * 2011-03-03 2016-04-26 Cree, Inc. Tunable remote phosphor constructs
US20120250320A1 (en) * 2011-03-31 2012-10-04 Xicato, Inc. Color conversion cavities for led-based illumination modules
CN102800782B (zh) * 2011-05-25 2015-03-11 展晶科技(深圳)有限公司 发光二极管光源装置
KR101805118B1 (ko) * 2011-05-30 2017-12-05 엘지이노텍 주식회사 발광소자패키지
CN202474016U (zh) * 2011-12-20 2012-10-03 中山市世耀光电科技有限公司 一种led 光源的封装结构
CN102522382A (zh) * 2012-01-11 2012-06-27 日月光半导体制造股份有限公司 芯片构装
CN202549918U (zh) * 2012-01-19 2012-11-21 福州瑞晟电子有限公司 一种荧光粉涂敷封装结构
WO2013150455A1 (en) * 2012-04-05 2013-10-10 Koninklijke Philips N.V. Full spectrum light emitting arrangement
CN202546429U (zh) * 2012-05-04 2012-11-21 四川新力光源有限公司 Led灯泡
CN102709280A (zh) * 2012-05-29 2012-10-03 宁波升谱光电半导体有限公司 一种cob集成光源模块
CN202791545U (zh) * 2012-09-29 2013-03-13 四川新力光源股份有限公司 一种led面板灯
CN202791546U (zh) * 2012-09-29 2013-03-13 四川新力光源股份有限公司 内置透镜结构的led灯管
CN203023838U (zh) * 2012-09-29 2013-06-26 四川新力光源股份有限公司 一种led par灯
CN103000791B (zh) * 2012-12-24 2015-06-24 佛山市香港科技大学Led-Fpd工程技术研究开发中心 点胶涂布远距式荧光粉层的led封装结构及制备方法
CN103500787A (zh) 2013-10-16 2014-01-08 北京大学东莞光电研究院 一种底部可直接焊接于散热器的陶瓷cob封装led光源

Also Published As

Publication number Publication date
EP2953172A1 (en) 2015-12-09
CN103972221A (zh) 2014-08-06
EP2953172B1 (en) 2019-02-06

Similar Documents

Publication Publication Date Title
HK1245799A1 (zh) 發光裝置和化合物
HK1212506A1 (en) Semiconductor light emitting device
KR102245993B9 (ko) 불화물 형광체 및 그 제조 방법 및 발광 장치
HK1220807A1 (zh) 發光裝置
HK1207250A2 (en) Substrate for led package, a tridimensional led package having the substrate, a light bulb having the tridimensional led package and methods for producing the same led led led
HK1200005A2 (en) Light bulb with three-dimensional led packages led
KR102305711B9 (ko) 유기 발광 표시장치 및 그 밀봉방법
AU356688S (en) Light emitting device
EP3116037A4 (en) Light emitting device package, backlight unit, lighting device, and method for manufacturing light emitting device package
TWI561898B (en) Light source module and lamp
EP2849237B8 (en) Light emitting device package
EP3063459A4 (en) Led illumination device and method
EP3306182A4 (en) Light-emitting device package and vehicular light comprising same
SG11201700624WA (en) Packaging system and packaging method for laser-sealed glass package
HK1243040A1 (zh) 底部帶有撐板的包裝和熱封方法
TWI560914B (en) Improvement structure for light emitting diode package
EP3333908A4 (en) LUMINOUS DIODE AND HOUSING FOR LUMINAIRE DIODE
GB201705231D0 (en) Organic light-emitting diode packaging structure and display apparatus
TWI562408B (en) Light source module
PL2953172T3 (pl) Konstrukcja zespołu źródła światła led i sposób tworzenia zespołu źródła światła led
HK1212370A1 (en) Light emitting device
EP3101337A4 (en) LED LIGHTING APPARATUS
TWI563218B (en) Light emitting device
TWI560816B (en) Embedded package and packaging method
EP2982905A4 (en) LED LIGHTING DEVICE