PL2953172T3 - Konstrukcja zespołu źródła światła led i sposób tworzenia zespołu źródła światła led - Google Patents

Konstrukcja zespołu źródła światła led i sposób tworzenia zespołu źródła światła led

Info

Publication number
PL2953172T3
PL2953172T3 PL14197925T PL14197925T PL2953172T3 PL 2953172 T3 PL2953172 T3 PL 2953172T3 PL 14197925 T PL14197925 T PL 14197925T PL 14197925 T PL14197925 T PL 14197925T PL 2953172 T3 PL2953172 T3 PL 2953172T3
Authority
PL
Poland
Prior art keywords
light sources
led light
create
way
unit construction
Prior art date
Application number
PL14197925T
Other languages
English (en)
Inventor
Riguang Zhang
Sheng Lin
Yaohua Zhang
Yuanbao Du
Original Assignee
Ningbo Sunpu Led Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ningbo Sunpu Led Co., Ltd. filed Critical Ningbo Sunpu Led Co., Ltd.
Publication of PL2953172T3 publication Critical patent/PL2953172T3/pl

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H10H20/8511—Wavelength conversion means characterised by their material, e.g. binder
    • H10H20/8512—Wavelength conversion materials
    • H10H20/8513—Wavelength conversion materials having two or more wavelength conversion materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H10H20/8515—Wavelength conversion means not being in contact with the bodies
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
    • F21K9/64—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction using wavelength conversion means distinct or spaced from the light-generating element, e.g. a remote phosphor layer
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H10H20/8514—Wavelength conversion means characterised by their shape, e.g. plate or foil
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07551—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting
    • H10W72/07554—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting changes in dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/547—Dispositions of multiple bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/753—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between laterally-adjacent chips
PL14197925T 2014-06-03 2014-12-15 Konstrukcja zespołu źródła światła led i sposób tworzenia zespołu źródła światła led PL2953172T3 (pl)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201410243610.4A CN103972221A (zh) 2014-06-03 2014-06-03 Led光源封装结构及led光源封装方法
EP14197925.2A EP2953172B1 (en) 2014-06-03 2014-12-15 Led light source package structure and led light source packaging method

Publications (1)

Publication Number Publication Date
PL2953172T3 true PL2953172T3 (pl) 2019-09-30

Family

ID=51241545

Family Applications (1)

Application Number Title Priority Date Filing Date
PL14197925T PL2953172T3 (pl) 2014-06-03 2014-12-15 Konstrukcja zespołu źródła światła led i sposób tworzenia zespołu źródła światła led

Country Status (3)

Country Link
EP (1) EP2953172B1 (pl)
CN (1) CN103972221A (pl)
PL (1) PL2953172T3 (pl)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105322076A (zh) * 2014-09-05 2016-02-10 姚晓宁 Led灯具远程激发式荧光转换膜的形成方法
CN107763568A (zh) * 2018-01-26 2018-03-06 北国之光（辽宁）科技有限公司 一种关于led远程激发荧光粉层的制备方法
CN115274639B (zh) * 2022-08-17 2023-04-07 珠海市宏科光电子有限公司 一种调光调色集成cob光源及其加工工艺

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JPS61280626A (ja) * 1985-05-08 1986-12-11 Sanyo Electric Co Ltd ワイヤボンデイング方法
JPH01297834A (ja) * 1988-05-25 1989-11-30 Nec Corp ワイヤボンデイング方法
US6621211B1 (en) * 2000-05-15 2003-09-16 General Electric Company White light emitting phosphor blends for LED devices
JP2003298120A (ja) * 2002-04-03 2003-10-17 Idec Izumi Corp 光源装置および蛍光パターンシート、それらの製造方法、ならびにそれを用いた液晶ディスプレイ装置、照明装置、掲示灯、表示灯および押しボタンスイッチ
CN100369533C (zh) * 2004-01-18 2008-02-13 敦南科技股份有限公司 电路板封装的焊线方法
CN100399589C (zh) * 2004-12-17 2008-07-02 杨秋忠 具高效率散热及亮度的晶片
KR100833187B1 (ko) * 2006-11-02 2008-05-28 삼성전자주식회사 반도체 패키지의 와이어 본딩방법
US8921876B2 (en) * 2009-06-02 2014-12-30 Cree, Inc. Lighting devices with discrete lumiphor-bearing regions within or on a surface of remote elements
CN102270732B (zh) * 2010-06-03 2015-06-10 展晶科技(深圳)有限公司 荧光层结构及其形成方法以及发光二极管封装结构
TWI441361B (zh) * 2010-12-31 2014-06-11 英特明光能股份有限公司 發光二極體封裝結構及其製造方法
US9324924B2 (en) * 2011-03-03 2016-04-26 Cree, Inc. Tunable remote phosphor constructs
US20120250320A1 (en) * 2011-03-31 2012-10-04 Xicato, Inc. Color conversion cavities for led-based illumination modules
CN102800782B (zh) * 2011-05-25 2015-03-11 展晶科技(深圳)有限公司 发光二极管光源装置
KR101805118B1 (ko) * 2011-05-30 2017-12-05 엘지이노텍 주식회사 발광소자패키지
CN202474016U (zh) * 2011-12-20 2012-10-03 中山市世耀光电科技有限公司 一种led 光源的封装结构
CN102522382A (zh) * 2012-01-11 2012-06-27 日月光半导体制造股份有限公司 芯片构装
CN202549918U (zh) * 2012-01-19 2012-11-21 福州瑞晟电子有限公司 一种荧光粉涂敷封装结构
CN104303324B (zh) * 2012-04-05 2018-07-10 亮锐控股有限公司 全谱发光装置
CN202546429U (zh) * 2012-05-04 2012-11-21 四川新力光源有限公司 Led灯泡
CN102709280A (zh) * 2012-05-29 2012-10-03 宁波升谱光电半导体有限公司 一种cob集成光源模块
CN203023838U (zh) * 2012-09-29 2013-06-26 四川新力光源股份有限公司 一种led par灯
CN202791546U (zh) * 2012-09-29 2013-03-13 四川新力光源股份有限公司 内置透镜结构的led灯管
CN202791545U (zh) * 2012-09-29 2013-03-13 四川新力光源股份有限公司 一种led面板灯
CN103000791B (zh) * 2012-12-24 2015-06-24 佛山市香港科技大学Led-Fpd工程技术研究开发中心 点胶涂布远距式荧光粉层的led封装结构及制备方法
CN103500787A (zh) 2013-10-16 2014-01-08 北京大学东莞光电研究院 一种底部可直接焊接于散热器的陶瓷cob封装led光源

Also Published As

Publication number Publication date
EP2953172B1 (en) 2019-02-06
CN103972221A (zh) 2014-08-06
EP2953172A1 (en) 2015-12-09

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