PL2874476T3 - Płyta główna z obwodem drukowanym, płyta modułowa z obwodem drukowanym oraz układ płyt z obwodami drukowanymi z płytą główną z obwodem drukowanym i płytą modułową z obwodem drukowanym - Google Patents

Płyta główna z obwodem drukowanym, płyta modułowa z obwodem drukowanym oraz układ płyt z obwodami drukowanymi z płytą główną z obwodem drukowanym i płytą modułową z obwodem drukowanym

Info

Publication number
PL2874476T3
PL2874476T3 PL14187028T PL14187028T PL2874476T3 PL 2874476 T3 PL2874476 T3 PL 2874476T3 PL 14187028 T PL14187028 T PL 14187028T PL 14187028 T PL14187028 T PL 14187028T PL 2874476 T3 PL2874476 T3 PL 2874476T3
Authority
PL
Poland
Prior art keywords
board
circuit board
base
module
circuit
Prior art date
Application number
PL14187028T
Other languages
English (en)
Inventor
Andre Frank
Original Assignee
Siemens Aktiengesellschaft
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Aktiengesellschaft filed Critical Siemens Aktiengesellschaft
Publication of PL2874476T3 publication Critical patent/PL2874476T3/pl

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/142—Arrangements of planar printed circuit boards in the same plane, e.g. auxiliary printed circuit insert mounted in a main printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/117—Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09145—Edge details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09145—Edge details
    • H05K2201/09181—Notches in edge pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/209—Auto-mechanical connection between a component and a PCB or between two PCBs
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/403—Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Combinations Of Printed Boards (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
PL14187028T 2013-11-14 2014-09-30 Płyta główna z obwodem drukowanym, płyta modułowa z obwodem drukowanym oraz układ płyt z obwodami drukowanymi z płytą główną z obwodem drukowanym i płytą modułową z obwodem drukowanym PL2874476T3 (pl)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102013223209.8A DE102013223209A1 (de) 2013-11-14 2013-11-14 Basisleiterplatte, Modulleiterplatte und Leiterplattenanordnung mit einer Basisleiterplatte und einer Modulleiterplatte
EP14187028.7A EP2874476B1 (de) 2013-11-14 2014-09-30 Basisleiterplatte, Modulleiterplatte und Leiterplattenanordnung mit einer Basisleiterplatte und einer Modulleiterplatte

Publications (1)

Publication Number Publication Date
PL2874476T3 true PL2874476T3 (pl) 2018-10-31

Family

ID=51655580

Family Applications (1)

Application Number Title Priority Date Filing Date
PL14187028T PL2874476T3 (pl) 2013-11-14 2014-09-30 Płyta główna z obwodem drukowanym, płyta modułowa z obwodem drukowanym oraz układ płyt z obwodami drukowanymi z płytą główną z obwodem drukowanym i płytą modułową z obwodem drukowanym

Country Status (4)

Country Link
EP (1) EP2874476B1 (pl)
DE (1) DE102013223209A1 (pl)
ES (1) ES2683325T3 (pl)
PL (1) PL2874476T3 (pl)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102016117795A1 (de) * 2016-09-21 2018-03-22 Endress+Hauser Conducta Gmbh+Co. Kg Feldgerät der Prozessautomatisierungstechnik
DE102023114593A1 (de) 2023-06-02 2024-12-05 Tridonic Gmbh & Co Kg Leiterplatte mit mehreren Bestückungskonfigurationen

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5683096A (en) * 1979-12-10 1981-07-07 Sony Corp Hybrid integrated circuit and method of manufacturing same
DE4017752A1 (de) * 1990-06-01 1991-12-05 Philips Patentverwaltung Leiterplatte und verfahren zu deren herstellung
JPH0548231A (ja) * 1991-08-09 1993-02-26 Seiko Epson Corp 密度の異なる回路基板の実装構造
JPH098423A (ja) * 1995-06-16 1997-01-10 Murata Mfg Co Ltd 回路基板およびその製造方法
JPH10290054A (ja) * 1997-04-16 1998-10-27 Sony Corp プリント配線基板
JP2001237551A (ja) * 2000-02-23 2001-08-31 Alps Electric Co Ltd 電子ユニットの多層基板への取付構造
JP2006024813A (ja) * 2004-07-09 2006-01-26 Nikon Corp プリント基板
JP2008091554A (ja) * 2006-09-29 2008-04-17 Matsushita Electric Works Ltd 音声出力装置
DE102011111488A1 (de) * 2011-08-30 2013-02-28 Schoeller-Electronics Gmbh Leiterplattensystem
AT13232U1 (de) * 2011-12-28 2013-08-15 Austria Tech & System Tech Verfahren zum herstellen einer aus wenigstens zwei leiterplattenbereichen bestehenden leiterplatte sowie leiterplatte

Also Published As

Publication number Publication date
DE102013223209A1 (de) 2015-05-21
ES2683325T3 (es) 2018-09-26
EP2874476A1 (de) 2015-05-20
EP2874476B1 (de) 2018-05-09

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