PL2874476T3 - Płyta główna z obwodem drukowanym, płyta modułowa z obwodem drukowanym oraz układ płyt z obwodami drukowanymi z płytą główną z obwodem drukowanym i płytą modułową z obwodem drukowanym - Google Patents
Płyta główna z obwodem drukowanym, płyta modułowa z obwodem drukowanym oraz układ płyt z obwodami drukowanymi z płytą główną z obwodem drukowanym i płytą modułową z obwodem drukowanymInfo
- Publication number
- PL2874476T3 PL2874476T3 PL14187028T PL14187028T PL2874476T3 PL 2874476 T3 PL2874476 T3 PL 2874476T3 PL 14187028 T PL14187028 T PL 14187028T PL 14187028 T PL14187028 T PL 14187028T PL 2874476 T3 PL2874476 T3 PL 2874476T3
- Authority
- PL
- Poland
- Prior art keywords
- board
- circuit board
- base
- module
- circuit
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/142—Arrangements of planar printed circuit boards in the same plane, e.g. auxiliary printed circuit insert mounted in a main printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/117—Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09145—Edge details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09145—Edge details
- H05K2201/09181—Notches in edge pads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/209—Auto-mechanical connection between a component and a PCB or between two PCBs
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/403—Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Combinations Of Printed Boards (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102013223209.8A DE102013223209A1 (de) | 2013-11-14 | 2013-11-14 | Basisleiterplatte, Modulleiterplatte und Leiterplattenanordnung mit einer Basisleiterplatte und einer Modulleiterplatte |
EP14187028.7A EP2874476B1 (de) | 2013-11-14 | 2014-09-30 | Basisleiterplatte, Modulleiterplatte und Leiterplattenanordnung mit einer Basisleiterplatte und einer Modulleiterplatte |
Publications (1)
Publication Number | Publication Date |
---|---|
PL2874476T3 true PL2874476T3 (pl) | 2018-10-31 |
Family
ID=51655580
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PL14187028T PL2874476T3 (pl) | 2013-11-14 | 2014-09-30 | Płyta główna z obwodem drukowanym, płyta modułowa z obwodem drukowanym oraz układ płyt z obwodami drukowanymi z płytą główną z obwodem drukowanym i płytą modułową z obwodem drukowanym |
Country Status (4)
Country | Link |
---|---|
EP (1) | EP2874476B1 (pl) |
DE (1) | DE102013223209A1 (pl) |
ES (1) | ES2683325T3 (pl) |
PL (1) | PL2874476T3 (pl) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102016117795A1 (de) * | 2016-09-21 | 2018-03-22 | Endress+Hauser Conducta Gmbh+Co. Kg | Feldgerät der Prozessautomatisierungstechnik |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5683096A (en) * | 1979-12-10 | 1981-07-07 | Sony Corp | Hybrid integrated circuit and method of manufacturing same |
DE4017752A1 (de) * | 1990-06-01 | 1991-12-05 | Philips Patentverwaltung | Leiterplatte und verfahren zu deren herstellung |
JPH0548231A (ja) * | 1991-08-09 | 1993-02-26 | Seiko Epson Corp | 密度の異なる回路基板の実装構造 |
JPH098423A (ja) * | 1995-06-16 | 1997-01-10 | Murata Mfg Co Ltd | 回路基板およびその製造方法 |
JPH10290054A (ja) * | 1997-04-16 | 1998-10-27 | Sony Corp | プリント配線基板 |
JP2001237551A (ja) * | 2000-02-23 | 2001-08-31 | Alps Electric Co Ltd | 電子ユニットの多層基板への取付構造 |
JP2006024813A (ja) * | 2004-07-09 | 2006-01-26 | Nikon Corp | プリント基板 |
JP2008091554A (ja) * | 2006-09-29 | 2008-04-17 | Matsushita Electric Works Ltd | 音声出力装置 |
DE102011111488A1 (de) * | 2011-08-30 | 2013-02-28 | Schoeller-Electronics Gmbh | Leiterplattensystem |
AT13232U1 (de) * | 2011-12-28 | 2013-08-15 | Austria Tech & System Tech | Verfahren zum herstellen einer aus wenigstens zwei leiterplattenbereichen bestehenden leiterplatte sowie leiterplatte |
-
2013
- 2013-11-14 DE DE102013223209.8A patent/DE102013223209A1/de not_active Withdrawn
-
2014
- 2014-09-30 PL PL14187028T patent/PL2874476T3/pl unknown
- 2014-09-30 EP EP14187028.7A patent/EP2874476B1/de active Active
- 2014-09-30 ES ES14187028.7T patent/ES2683325T3/es active Active
Also Published As
Publication number | Publication date |
---|---|
EP2874476B1 (de) | 2018-05-09 |
EP2874476A1 (de) | 2015-05-20 |
ES2683325T3 (es) | 2018-09-26 |
DE102013223209A1 (de) | 2015-05-21 |
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