PL2856498T3 - Susceptor - Google Patents
SusceptorInfo
- Publication number
- PL2856498T3 PL2856498T3 PL13727130T PL13727130T PL2856498T3 PL 2856498 T3 PL2856498 T3 PL 2856498T3 PL 13727130 T PL13727130 T PL 13727130T PL 13727130 T PL13727130 T PL 13727130T PL 2856498 T3 PL2856498 T3 PL 2856498T3
- Authority
- PL
- Poland
- Prior art keywords
- susceptor
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/50—Substrate holders
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67109—Apparatus for thermal treatment mainly by convection
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
- C23C14/564—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/458—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber
- C23C16/4581—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber characterised by material of construction or surface finish of the means for supporting the substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/6719—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the processing chambers, e.g. modular processing chambers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67196—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the transfer chamber
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67386—Closed carriers characterised by the construction of the closed carrier
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C13/00—Means for manipulating or holding work, e.g. for separate articles
- B05C13/02—Means for manipulating or holding work, e.g. for separate articles for particular articles
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Mechanical Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Gasket Seals (AREA)
- Ceramic Products (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102012209278.1A DE102012209278B4 (de) | 2012-06-01 | 2012-06-01 | Suszeptor |
PCT/EP2013/061384 WO2013178824A1 (de) | 2012-06-01 | 2013-06-03 | Suszeptor |
EP13727130.0A EP2856498B1 (de) | 2012-06-01 | 2013-06-03 | Suszeptor |
Publications (1)
Publication Number | Publication Date |
---|---|
PL2856498T3 true PL2856498T3 (pl) | 2019-05-31 |
Family
ID=48577008
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PL13727130T PL2856498T3 (pl) | 2012-06-01 | 2013-06-03 | Susceptor |
Country Status (7)
Country | Link |
---|---|
US (1) | US10094016B2 (pl) |
EP (1) | EP2856498B1 (pl) |
CN (1) | CN104380451B (pl) |
DE (1) | DE102012209278B4 (pl) |
DK (1) | DK2856498T3 (pl) |
PL (1) | PL2856498T3 (pl) |
WO (1) | WO2013178824A1 (pl) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE202015103154U1 (de) | 2015-06-16 | 2016-01-14 | Graphite Materials GmbH | Suszeptor |
Family Cites Families (32)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3804060A (en) * | 1970-03-27 | 1974-04-16 | Sperry Rand Corp | Liquid epitaxy apparatus |
US4117252A (en) * | 1976-12-01 | 1978-09-26 | Mcmaster Harold | High temperature furnace |
US4152533A (en) * | 1978-04-27 | 1979-05-01 | Great Lakes Carbon Corporation | Electrode joint |
US4290709A (en) * | 1979-09-28 | 1981-09-22 | Union Carbide Corporation | High taper angle connecting pin for graphite electrode joints |
JPS56155528A (en) * | 1980-05-02 | 1981-12-01 | Toshiba Corp | Method of diffusing impurity into semiconductor substrate |
US4571910A (en) * | 1983-08-01 | 1986-02-25 | Edward Cosentino | Apparatus for laying tile |
US4523531A (en) * | 1984-02-22 | 1985-06-18 | Kennecott Corporation | Modular furnace lining having mechanically interlocking attachment means |
US4755658A (en) * | 1985-11-12 | 1988-07-05 | Ultra Carbon Corporation | Segmented heater system |
US4703556A (en) * | 1985-11-12 | 1987-11-03 | Ultra Carbon Corporation | Method of making a segmented heater system |
DE3719045A1 (de) * | 1987-06-06 | 1988-12-15 | Degussa | Halterungselemente aus graphit fuer heizstaebe in industrieoefen |
JPH01123991A (ja) * | 1987-11-09 | 1989-05-16 | Nikkiso Co Ltd | 内熱式高温高圧装置の断熱構造体 |
US5014478A (en) * | 1989-09-22 | 1991-05-14 | Insulated Panel Systems, Inc. | Panels and panel interlocking means |
RU94042411A (ru) * | 1992-04-03 | 1996-10-20 | Сименс АГ (DE) | Стена |
JPH0682634B2 (ja) | 1992-07-27 | 1994-10-19 | 東京エレクトロン東北株式会社 | バッチプラズマ装置 |
US5414927A (en) * | 1993-03-30 | 1995-05-16 | Union Oil Co | Furnace elements made from graphite sheets |
JP2566529B2 (ja) | 1994-01-31 | 1996-12-25 | 日本ピラー工業株式会社 | シート状ガスケット |
US6582178B2 (en) | 2000-08-14 | 2003-06-24 | Daniel G. Petruccelli | Mini-modual manufacturing environmental |
DE10243196B4 (de) * | 2002-09-18 | 2007-03-22 | Kaindl Flooring Gmbh | Paneele mit Verbindungsklammer |
ITMI20022225A1 (it) * | 2002-10-18 | 2004-04-19 | Terzi Stampi Di Terzi Dario & C S N C | Struttura modulare per il contenimento di oggetti fluidi o persone in stato di quiete o movimento |
DE10302653A1 (de) * | 2003-01-20 | 2004-08-19 | Htm Reetz Gmbh | Vorrichtung zur Thermomigration |
JP3940095B2 (ja) * | 2003-05-08 | 2007-07-04 | 忠弘 大見 | 基板処理装置 |
US7789660B2 (en) * | 2005-12-07 | 2010-09-07 | Ajax Tocco Magnethermic Corporation | Furnace alignment system |
FR2909799A1 (fr) | 2006-12-12 | 2008-06-13 | Commissariat Energie Atomique | Procede et fabrication d'elements de combustible nucleaire et contenant pour la mise en oeuvre d'un tel procede |
US20080232424A1 (en) * | 2007-03-23 | 2008-09-25 | Honeywell International Inc. | Hearth plate including side walls defining a processing volume |
WO2008142747A1 (ja) * | 2007-05-16 | 2008-11-27 | Canon Anelva Corporation | 加熱処理装置 |
DE102009043848A1 (de) * | 2009-08-25 | 2011-03-03 | Aixtron Ag | CVD-Verfahren und CVD-Reaktor |
US8429870B2 (en) * | 2009-12-04 | 2013-04-30 | Mannington Mills, Inc. | Connecting system for surface coverings |
US8683697B2 (en) * | 2010-04-26 | 2014-04-01 | Lockheed Martin Corporation | Large scale structures |
US9010067B2 (en) * | 2011-04-14 | 2015-04-21 | Geoffrey Alan Baker | Fabricating the locking steps in the groove element of spring-loaded split-tongue locking connector system |
CA2759147A1 (en) * | 2011-11-16 | 2012-05-17 | Magnetic Energy Services Inc. | Fluid storage tank assembly |
JP2013220954A (ja) * | 2012-04-13 | 2013-10-28 | Ibiden Co Ltd | 黒鉛ヒータ |
TWI613412B (zh) * | 2013-03-11 | 2018-02-01 | 應用材料股份有限公司 | 高溫處理室蓋體 |
-
2012
- 2012-06-01 DE DE102012209278.1A patent/DE102012209278B4/de not_active Expired - Fee Related
-
2013
- 2013-06-03 PL PL13727130T patent/PL2856498T3/pl unknown
- 2013-06-03 WO PCT/EP2013/061384 patent/WO2013178824A1/de active Application Filing
- 2013-06-03 US US14/404,948 patent/US10094016B2/en active Active
- 2013-06-03 DK DK13727130.0T patent/DK2856498T3/en active
- 2013-06-03 EP EP13727130.0A patent/EP2856498B1/de active Active
- 2013-06-03 CN CN201380028573.9A patent/CN104380451B/zh active Active
Also Published As
Publication number | Publication date |
---|---|
EP2856498A1 (de) | 2015-04-08 |
US10094016B2 (en) | 2018-10-09 |
CN104380451B (zh) | 2017-06-06 |
WO2013178824A1 (de) | 2013-12-05 |
DK2856498T3 (en) | 2019-03-18 |
DE102012209278B4 (de) | 2018-04-12 |
US20150144057A1 (en) | 2015-05-28 |
CN104380451A (zh) | 2015-02-25 |
EP2856498B1 (de) | 2018-11-14 |
DE102012209278A1 (de) | 2013-12-05 |
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