PL2625300T3 - Stop miedzi - Google Patents

Stop miedzi

Info

Publication number
PL2625300T3
PL2625300T3 PL11817508T PL11817508T PL2625300T3 PL 2625300 T3 PL2625300 T3 PL 2625300T3 PL 11817508 T PL11817508 T PL 11817508T PL 11817508 T PL11817508 T PL 11817508T PL 2625300 T3 PL2625300 T3 PL 2625300T3
Authority
PL
Poland
Prior art keywords
copper alloy
alloy
copper
Prior art date
Application number
PL11817508T
Other languages
English (en)
Polish (pl)
Inventor
Thomas Helmenkamp
Dirk Rode
Uwe Quadfasel
Hark Schulze
Original Assignee
Kme Germany Gmbh & Co. Kg
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kme Germany Gmbh & Co. Kg filed Critical Kme Germany Gmbh & Co. Kg
Publication of PL2625300T3 publication Critical patent/PL2625300T3/pl

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C9/00Alloys based on copper
    • C22C9/05Alloys based on copper with manganese as the next major constituent
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C9/00Alloys based on copper
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C9/00Alloys based on copper
    • C22C9/01Alloys based on copper with aluminium as the next major constituent

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Conductive Materials (AREA)
  • Forging (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
PL11817508T 2010-10-08 2011-08-16 Stop miedzi PL2625300T3 (pl)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE201010038060 DE102010038060A1 (de) 2010-10-08 2010-10-08 Kupferlegierung
EP11817508.2A EP2625300B1 (de) 2010-10-08 2011-08-16 Kupferlegierung

Publications (1)

Publication Number Publication Date
PL2625300T3 true PL2625300T3 (pl) 2017-04-28

Family

ID=45606890

Family Applications (1)

Application Number Title Priority Date Filing Date
PL11817508T PL2625300T3 (pl) 2010-10-08 2011-08-16 Stop miedzi

Country Status (8)

Country Link
US (1) US20130183194A1 (de)
EP (1) EP2625300B1 (de)
JP (1) JP2013544962A (de)
BR (1) BR112013008521A2 (de)
DE (1) DE102010038060A1 (de)
MX (1) MX2012011929A (de)
PL (1) PL2625300T3 (de)
WO (1) WO2012062248A2 (de)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SE1450094A1 (sv) 2014-01-30 2015-07-31 Arsenikfri mässing med förbättrad avzinkningshärdighet och skärbarhet
CN115786753B (zh) * 2023-02-02 2023-05-30 泰州泰锦合金材料有限公司 一种含稀土金属的碲铜合金材料及其制备方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1959509A (en) 1930-06-14 1934-05-22 Lucius Pitkin Inc Copper base alloy
US2027807A (en) 1932-05-13 1936-01-14 Chase Companies Inc Copper base alloy
DE1558707A1 (de) * 1967-09-12 1970-04-23 Ver Deutsche Metallwerke Ag Aus dem Schmelzfluss oder durch Sintern hergestellte Kupferlegierungen mit 0,005 bis 2% Schwefel
JPS5344136B2 (de) * 1974-12-23 1978-11-27
JPS5675541A (en) * 1979-11-22 1981-06-22 Sumitomo Light Metal Ind Ltd Copper alloy for water or hot water supply piping material and heat exchanger tube material
JPS5760043A (en) * 1980-09-30 1982-04-10 Furukawa Electric Co Ltd:The Electrically conductive copper alloy with corrosion and heat resistance
JPS5852453A (ja) * 1981-09-21 1983-03-28 Furukawa Electric Co Ltd:The 自動車用ラジエ−タ−のフイン用銅合金
JPH06184672A (ja) * 1992-12-18 1994-07-05 Mitsubishi Materials Corp 給水給湯用耐孔食性銅合金配管
US20040115089A1 (en) * 1999-07-02 2004-06-17 Berkenhoff Gmbh. Weld-solder filler
JP2005171311A (ja) * 2003-12-11 2005-06-30 Nissan Motor Co Ltd 熱間鍛造用非調質クランクシャフト鋼

Also Published As

Publication number Publication date
WO2012062248A2 (de) 2012-05-18
EP2625300A2 (de) 2013-08-14
BR112013008521A2 (pt) 2016-07-12
US20130183194A1 (en) 2013-07-18
MX2012011929A (es) 2013-02-07
WO2012062248A3 (de) 2013-07-25
WO2012062248A8 (de) 2012-11-29
EP2625300B1 (de) 2016-12-21
DE102010038060A1 (de) 2012-04-12
JP2013544962A (ja) 2013-12-19

Similar Documents

Publication Publication Date Title
GB2470613B (en) Alloy
SG10201506427XA (en) Etching solution for copper or copper alloy
EP2540848A4 (de) Aluminiumlegierungsleiter
IL212269A0 (en) Transition metal oxidenitrides
EP2781282A4 (de) Feste metalllegierung
IL227758A0 (en) Copper-nickel-zinc-manganese alloy
EP2644753A4 (de) Oberflächenbehandelte kupferfolie
EP2610360A4 (de) Co-basislegierung
EP2781610C0 (de) Feste silber-kupfer-legierung
GB201502723D0 (en) Solder alloy
EP2581220A4 (de) Kupferfolienkomplex
SI2678458T1 (sl) Nikelj-krom-železo-aluminijeva zlitina z dobro predelovalnostjo
EP2692880A4 (de) Aluminiumlegierungsleiter
EP2540849A4 (de) Aluminiumlegierungsleiter
EP2589459A4 (de) Bi-sn-basierte hochtemperatur-lötlegierung
GB2494847B (en) Pb-free solder alloy
EP2679341A4 (de) Kupferlegierungsplatte auf co-si-basis
HK1206803A1 (en) Tap mounting
EP2883971A4 (de) Kupferlegierung als befestiger
EP2560241A4 (de) Elektrische komponente
EP2692884A4 (de) Magnesiumlegierung
EP2554692A4 (de) Cu-co-si-legierungsmaterial
IL222418A0 (en) Novel lead-free brass alloy
EP2602336A4 (de) Nickellegierung
IL235511A0 (en) Molded parts manufactured from weld-resistant copper alloys