PL137972B1 - Agent for polishing copper and its alloys - Google Patents

Agent for polishing copper and its alloys

Info

Publication number
PL137972B1
PL137972B1 PL24204883A PL24204883A PL137972B1 PL 137972 B1 PL137972 B1 PL 137972B1 PL 24204883 A PL24204883 A PL 24204883A PL 24204883 A PL24204883 A PL 24204883A PL 137972 B1 PL137972 B1 PL 137972B1
Authority
PL
Poland
Prior art keywords
weight
alloys
polishing
amount
agent
Prior art date
Application number
PL24204883A
Other languages
Polish (pl)
Other versions
PL242048A1 (en
Inventor
Edward Zacny
Original Assignee
Akad Gorniczo Hutnicza
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Akad Gorniczo Hutnicza filed Critical Akad Gorniczo Hutnicza
Priority to PL24204883A priority Critical patent/PL137972B1/en
Priority to GB08412497A priority patent/GB2140039B/en
Priority to DE19843418574 priority patent/DE3418574C2/en
Publication of PL242048A1 publication Critical patent/PL242048A1/en
Publication of PL137972B1 publication Critical patent/PL137972B1/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F3/00—Brightening metals by chemical means
    • C23F3/04—Heavy metals
    • C23F3/06—Heavy metals with acidic solutions

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • ing And Chemical Polishing (AREA)
  • Surface Treatment Of Glass (AREA)

Description

Przedmiotem wynalazku jest srodek do polero¬ wania miedzi i jej stopów, zwlaszcza mosiadzów nisko- i wysokostopowych.Znane roztwory do polerowania miedzi i jej sto¬ pów oparte sa na kwasie azotowym, wzglednie na mieszaninie kwasu azotowego z kwasem fosforo¬ wym, siarkowym i octowym. Mimo wielu zalet szersze zastosowanie powyzszych roztworów jest ograniczone z powodu zjawiska emisji toksycznych tlenków azotu, który wydziela sie w procesie po¬ lerowania.Do polerowania miedzi i jej stopów stosuje sie równiez znany z polskiego opisu patentowego nr 133 213 wodny roztwór, zawierajacy stezony kwas siarkowy w ilosci 35—45% wagowych, stezony kwas azotowy w ilosci 15—40% wagowych, azotan amonowy w ilosci 10—30% wagowych, chlorek ka¬ dmowy w ilosci 0,05—5,0% wagowych oraz fos¬ foran sodowy lub potasowy lub amonowy w ilosci 2—15% wagowych.Srodek do polerowania miedzi i jej stopów, wed¬ lug wynalazku, stanowi wodny roztwór zawiera¬ jacy kwas siarkowy w ilosci 45—70% wagowych, azotan amonu w ilosci 6,1—8,0% wagowych, szklo wodne sodowe w ilosci 0,05—1,0% wagowych oraz chlorek amonu w ilosci 0,01—0,3% wagowych.Zaleta srodka, wedlug wynalazku, jest wyeli¬ minowanie emisji tlenków azotu w procesie pole¬ rowania. Dodatek szkla wodnego zmniejsza kilka- 10 30 krotnie szybkosc polerowania, co umozliwia dok¬ ladniejsze ustalenie i utrzymanie optymalnego cza¬ su polerowania. Pozwala to na wprowadzenie me¬ chanizacji procesu i przedluza zywotnosc roztworu.Powstajace scieki sa latwe w neutralizacji, ze wzgledu na to, ze zawieraja one glównie siarczany miedzi i cynku. Polerowanie w roztworze, wed¬ lug wynalazku, nie wymaga wstepnego odtlusz¬ czania i wytrawiania powierzchni elementów.Przyklad. Wodny roztwór do polerowania zawiera wagowo: 61% kwasu siarkowego, 7,2% azo¬ tanu amonu, 0,75% szkla wodnego sodowego o mo¬ dule 2,8, 0,13% chlorku amonu.W powyzszym roztworze polerowano czesci ar¬ matury medycznej, wytloczone z mosiadzu o za¬ wartosci 63% wagowych miedzi. W czasie polero¬ wania nie zaobserwowano emisji gazów toksycz¬ nych, jak tlenki azotu, dwutlenek siarki i inne.Obrobione elementy charakteryzowaly sie wysokim polyskiem, bez sladów plam, wzerów i innych wad powierzchniowych.Zastrzezenie patentowe Srodek do polerowania miedzi i jej stopów, za¬ wierajacy kwas siarkowy, znamienny tym, ze sta¬ nowi go wodny roztwór, zawierajacy kwas siar¬ kowy w ilosci 45—70% wagowych, azotan amonu w ilosci 6,0—8,0% wagowych, szklo wodne sodowe w ilosci 0,5—1,0% wagowych oraz chlorek amonu w ilosci 0,01—0,30% wagowych. 137 972 PLThe subject of the invention is an agent for polishing copper and its alloys, especially low- and high-alloy brass. Known solutions for polishing copper and its alloys are based on nitric acid, or on a mixture of nitric acid with phosphoric, sulfuric and acetic acid. . Despite many advantages, the wider use of the above solutions is limited due to the phenomenon of emission of toxic nitrogen oxides, which are released in the polishing process. For polishing copper and its alloys, an aqueous solution containing concentrated sulfuric acid is also used. 35-45% by weight, concentrated nitric acid 15-40% by weight, ammonium nitrate 10-30% by weight, cadmium chloride 0.05-5.0% by weight and sodium phosphate or Potassium or ammonium in an amount of 2-15% by weight. The polishing agent for copper and its alloys, according to the invention, is an aqueous solution containing sulfuric acid in an amount of 45-70% by weight, ammonium nitrate in an amount of 6.1-8, 0% by weight, sodium water glass in the amount of 0.05-1.0% by weight and ammonium chloride in the amount of 0.01-0.3% by weight. The advantage of the measure, according to the invention, is the elimination of nitrogen oxide emissions in the process of rowania. The addition of water glass reduces the polishing speed by several times, which enables a more accurate setting and maintenance of the optimal polishing time. This allows the introduction of mechanization of the process and extends the life of the solution. The resulting sewage is easy to neutralize due to the fact that they contain mainly copper and zinc sulphates. Polishing in a solution, according to the invention, does not require preliminary degreasing and etching of the surface of the elements. The aqueous polishing solution contains by weight: 61% sulfuric acid, 7.2% ammonium nitrate, 0.75% sodium water glass with a modulus of 2.8, 0.13% ammonium chloride. medical grade, extruded from brass containing 63% by weight of copper. During polishing, no emission of toxic gases, such as nitrogen oxides, sulfur dioxide, etc., was observed. The treated elements were characterized by a high gloss, without traces of stains, patterns and other surface defects. Patent disclaimer Polishing agent for copper and its alloys, Containing sulfuric acid, characterized in that it is an aqueous solution containing sulfuric acid in the amount of 45-70% by weight, ammonium nitrate in the amount of 6.0-8.0% by weight, sodium water glass in the amount of 0, 5-1.0% by weight and ammonium chloride in an amount of 0.01-0.30% by weight. 137 972 PL

Claims (1)

1. Zastrzezenie patentowe Srodek do polerowania miedzi i jej stopów, za¬ wierajacy kwas siarkowy, znamienny tym, ze sta¬ nowi go wodny roztwór, zawierajacy kwas siar¬ kowy w ilosci 45—70% wagowych, azotan amonu w ilosci 6,0—8,0% wagowych, szklo wodne sodowe w ilosci 0,5—1,0% wagowych oraz chlorek amonu w ilosci 0,01—0,30% wagowych. 137 972 PL1. Patent claim A polishing agent for copper and its alloys, containing sulfuric acid, characterized by being an aqueous solution containing sulfuric acid in an amount of 45-70% by weight, ammonium nitrate in an amount of 6.0-6. 8.0% by weight, sodium water glass at 0.5-1.0% by weight and ammonium chloride at 0.01-0.30% by weight. 137 972 PL
PL24204883A 1983-05-19 1983-05-19 Agent for polishing copper and its alloys PL137972B1 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
PL24204883A PL137972B1 (en) 1983-05-19 1983-05-19 Agent for polishing copper and its alloys
GB08412497A GB2140039B (en) 1983-05-19 1984-05-16 Solution suitable for polishing copper and its alloys
DE19843418574 DE3418574C2 (en) 1983-05-19 1984-05-18 Preparations for polishing copper and its alloys

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PL24204883A PL137972B1 (en) 1983-05-19 1983-05-19 Agent for polishing copper and its alloys

Publications (2)

Publication Number Publication Date
PL242048A1 PL242048A1 (en) 1984-12-03
PL137972B1 true PL137972B1 (en) 1986-08-30

Family

ID=20017100

Family Applications (1)

Application Number Title Priority Date Filing Date
PL24204883A PL137972B1 (en) 1983-05-19 1983-05-19 Agent for polishing copper and its alloys

Country Status (3)

Country Link
DE (1) DE3418574C2 (en)
GB (1) GB2140039B (en)
PL (1) PL137972B1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6530824B2 (en) 2001-03-09 2003-03-11 Rodel Holdings, Inc. Method and composition for polishing by CMP
EP1380048A1 (en) * 2001-03-12 2004-01-14 Rodel Holdings, Inc. Method and composition for polishing by cmp

Also Published As

Publication number Publication date
GB8412497D0 (en) 1984-06-20
GB2140039B (en) 1986-09-03
DE3418574C2 (en) 1986-06-19
GB2140039A (en) 1984-11-21
DE3418574A1 (en) 1984-11-22
PL242048A1 (en) 1984-12-03

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