PH24374A - Rapid curing,thermally stable adhesive - Google Patents

Rapid curing,thermally stable adhesive

Info

Publication number
PH24374A
PH24374A PH34924A PH34924A PH24374A PH 24374 A PH24374 A PH 24374A PH 34924 A PH34924 A PH 34924A PH 34924 A PH34924 A PH 34924A PH 24374 A PH24374 A PH 24374A
Authority
PH
Philippines
Prior art keywords
thermally stable
rapid curing
stable adhesive
adhesive
alkenylphenol
Prior art date
Application number
PH34924A
Other languages
English (en)
Inventor
Jagadish Chandra Goswami
Richard Alfred Rehder
Anthony Leonard Disalvo
Original Assignee
Nat Starch Chem Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nat Starch Chem Corp filed Critical Nat Starch Chem Corp
Publication of PH24374A publication Critical patent/PH24374A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F283/00—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C08G59/621—Phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J179/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09J161/00 - C09J177/00
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • C09J4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/2919—Material with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01011—Sodium [Na]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01015—Phosphorus [P]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01019—Potassium [K]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01047—Silver [Ag]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/0132—Binary Alloys
    • H01L2924/01327—Intermediate phases, i.e. intermetallics compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/0665—Epoxy resin
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/07802—Adhesive characteristics other than chemical not being an ohmic electrical conductor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/102—Material of the semiconductor or solid state bodies
    • H01L2924/1025—Semiconducting materials
    • H01L2924/10251—Elemental semiconductors, i.e. Group IV
    • H01L2924/10253—Silicon [Si]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12044—OLED
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
PH34924A 1986-04-14 1987-02-26 Rapid curing,thermally stable adhesive PH24374A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/851,605 US4652398A (en) 1985-09-12 1986-04-14 Rapid curing, thermally stable adhesive composition comprising epoxy resin, polyimide, reactive solvent, and crosslinker

Publications (1)

Publication Number Publication Date
PH24374A true PH24374A (en) 1990-06-13

Family

ID=25311189

Family Applications (1)

Application Number Title Priority Date Filing Date
PH34924A PH24374A (en) 1986-04-14 1987-02-26 Rapid curing,thermally stable adhesive

Country Status (9)

Country Link
US (1) US4652398A (ja)
EP (1) EP0244070A3 (ja)
JP (1) JPS62243673A (ja)
KR (1) KR870010147A (ja)
CN (1) CN87102640A (ja)
BR (1) BR8701756A (ja)
CA (1) CA1286818C (ja)
IL (1) IL81551A0 (ja)
PH (1) PH24374A (ja)

Families Citing this family (39)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4826927A (en) * 1986-01-13 1989-05-02 Ciba-Geigy Corporation Mixtures containing polymides alkenyphenols and either epoxide group-free adducts or another polyimide
US4948449A (en) * 1986-05-07 1990-08-14 Minnesota Mining And Manufacturing Company Epoxy resin composition
US4808676A (en) * 1986-10-11 1989-02-28 Nippon Telegraph And Telephone Corporation Polyetherimide/epoxyimide resin composition
US4874548A (en) * 1988-03-14 1989-10-17 Ameron, Inc. Conductive adhesive
US5156772A (en) * 1988-05-11 1992-10-20 Ariel Electronics, Inc. Circuit writer materials
EP0418313A4 (en) * 1988-05-11 1992-01-15 Ariel Electronics, Inc. Circuit writer
US5099090A (en) * 1988-05-11 1992-03-24 Ariel Electronics, Inc. Circuit writer
US5037689A (en) * 1989-02-17 1991-08-06 Basf Aktiengesellschaft Toughened thermosetting structural materials
US5225023A (en) * 1989-02-21 1993-07-06 General Electric Company High density interconnect thermoplastic die attach material and solvent die attach processing
EP0384704A3 (en) * 1989-02-21 1991-05-08 General Electric Company Die attach material and die attach process
US4994207A (en) * 1989-03-09 1991-02-19 National Starch And Chemical Investment Holding Corporation Thermoplastic film die attach adhesives
US4975221A (en) * 1989-05-12 1990-12-04 National Starch And Chemical Investment Holding Corporation High purity epoxy formulations for use as die attach adhesives
US5159034A (en) * 1989-09-01 1992-10-27 Isp Investments Inc. Polymerization process using tertiary-amylperoxy pivalate as the free radical initiator
US5002818A (en) * 1989-09-05 1991-03-26 Hughes Aircraft Company Reworkable epoxy die-attach adhesive
JP2893782B2 (ja) * 1990-01-19 1999-05-24 日立化成工業株式会社 導電性接着剤および半導体装置
US5853622A (en) * 1990-02-09 1998-12-29 Ormet Corporation Transient liquid phase sintering conductive adhesives
US5376403A (en) * 1990-02-09 1994-12-27 Capote; Miguel A. Electrically conductive compositions and methods for the preparation and use thereof
US5258139A (en) * 1990-04-20 1993-11-02 Hitachi Chemical Company, Ltd. Epoxy resin and adhesive composition containing the same
JPH0412595A (ja) * 1990-05-02 1992-01-17 Mitsubishi Petrochem Co Ltd 導電性ペースト組成物
US5652042A (en) 1993-10-29 1997-07-29 Matsushita Electric Industrial Co., Ltd. Conductive paste compound for via hole filling, printed circuit board which uses the conductive paste
US5683627A (en) * 1995-03-15 1997-11-04 Tokuyama Corporation Curable electroconductive composition
JP5280597B2 (ja) * 2001-03-30 2013-09-04 サンスター技研株式会社 一液加熱硬化型エポキシ樹脂組成物および半導体実装用アンダーフィル材
US6482335B1 (en) 2001-05-16 2002-11-19 Conley Corporation Conductive adhesive and method
US20040158008A1 (en) * 2003-02-06 2004-08-12 Xiping He Room temperature printable adhesive paste
EP1613680B1 (en) * 2003-04-16 2006-11-29 Huntsman Advanced Materials (Switzerland) GmbH Accelerator systems for low-temperature curing of epoxy resin compositions
MY142246A (en) * 2003-06-10 2010-11-15 Hitachi Chemical Co Ltd Adhesive film and process for preparing the same as well as adhesive sheet and semiconductor device
JP4839670B2 (ja) * 2005-04-28 2011-12-21 日立化成工業株式会社 接着フィルム、接着シート及び半導体装置
JP4942338B2 (ja) * 2005-12-14 2012-05-30 旭化成イーマテリアルズ株式会社 ポリアミド酸ワニス組成物及び金属ポリイミド複合体
US20070226995A1 (en) * 2006-03-30 2007-10-04 Gregory Alan Bone System and method for adhering large semiconductor applications to pcb
JP2010059387A (ja) * 2008-08-04 2010-03-18 Hitachi Chem Co Ltd 接着剤組成物、フィルム状接着剤、接着シート及び半導体装置
US20110218272A1 (en) * 2008-11-13 2011-09-08 Toho Tenax Co., Ltd. Thermosetting resin composition and prepreg using the same
CN102925062A (zh) 2011-08-12 2013-02-13 汉高股份有限公司 光学透明的双固化粘合剂
CN102417808A (zh) * 2011-09-29 2012-04-18 西北工业大学 一种耐高温胶粘剂及其制备方法
CN103160232A (zh) * 2013-03-31 2013-06-19 广东普赛特电子科技股份有限公司 一种含改性镁粉的灌封胶及其制备方法
TWI756181B (zh) * 2015-08-28 2022-03-01 日商昭和電工材料股份有限公司 緩衝片用組成物及緩衝片
CN105462514A (zh) * 2015-11-24 2016-04-06 苏州盖德精细材料有限公司 一种高性能聚酰亚胺改性环氧树脂导电胶及其制备方法
WO2018225773A1 (ja) * 2017-06-07 2018-12-13 田中貴金属工業株式会社 熱伝導性導電性接着剤組成物
CN108219730A (zh) * 2018-01-16 2018-06-29 黑龙江省科学院石油化学研究院 一种导电胶粘剂的制备方法及其导电胶黏剂
CN113429890B (zh) * 2021-07-14 2023-06-02 嘉兴蓉阳电子科技有限公司 复合型固化剂、胶黏剂、导电胶及其制备方法、应用

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH615935A5 (ja) * 1975-06-19 1980-02-29 Ciba Geigy Ag
CH621810A5 (ja) * 1976-06-17 1981-02-27 Ciba Geigy Ag
JPS5341398A (en) * 1976-09-28 1978-04-14 Toshiba Corp Heat resistant resin composition
JPS53134087A (en) * 1977-04-28 1978-11-22 Toshiba Corp Heat-resistant resin composition
JPS54155297A (en) * 1978-05-30 1979-12-07 Toshiba Corp Resin composition
US4401777A (en) * 1981-10-20 1983-08-30 Mitsui Toatsu Chemicals, Inc. Curable resin composition comprising N-(alkenylphenyl)maleimide and epoxy composition
CH647249A5 (de) * 1981-12-23 1985-01-15 Ciba Geigy Ag Lagerstabile, waermehaertbare, einen polymerisationskatalysator enthaltende mischungen auf polyimidbasis.
US4557860A (en) * 1984-07-06 1985-12-10 Stauffer Chemical Company Solventless, polyimide-modified epoxy composition
US4692272A (en) * 1984-10-15 1987-09-08 Stauffer Chemical Company Thermally stable adhesive comprising soluble polyimide resin and epoxy resin

Also Published As

Publication number Publication date
EP0244070A3 (en) 1989-04-12
JPS62243673A (ja) 1987-10-24
CA1286818C (en) 1991-07-23
EP0244070A2 (en) 1987-11-04
IL81551A0 (en) 1987-09-16
CN87102640A (zh) 1987-11-04
US4652398A (en) 1987-03-24
KR870010147A (ko) 1987-11-30
BR8701756A (pt) 1988-01-12

Similar Documents

Publication Publication Date Title
PH24374A (en) Rapid curing,thermally stable adhesive
AU499421B2 (en) Curable silicone epoxy composition
JPS5314800A (en) Curable resin composition
ES535251A0 (es) Procedimiento de obtencion de una composicion curable a base de compuestos conteniendo grupos hidroxilo
JPS53127551A (en) Resin composition
JPS5437184A (en) Novel diallylphthalate curable compound, its preparation, and adhesive and paint containing resin therefrom
JPS52139199A (en) Novel epoxy resin compositions
JPS53125475A (en) Prepreg
JPS5254798A (en) Thermosetting resin compositions
JPS543135A (en) Adhesive composition
JPS5375299A (en) Epoxy resin composition
JPS51119798A (en) A thermosetting resin composition
JPS5331761A (en) Thermosetting silicone resin composition
EP0010489A3 (en) Heat curable compositions based on prepolymers containing imide groups and on epoxy resins
NO900170D0 (no) Lavtemperaturherdbare blandinger basert paa aromataldehyd-holdige forbindelser og ketiminiserte polyaminoforbindelser
JPS51148800A (en) Thermosetting resin composition
AU528841B2 (en) U.v. curable epoxy resin composition
JPS5425939A (en) Novel antifoling coating composition
EP0304174A3 (en) Bismaleimide compositions
JPS52146498A (en) Epoxy resin composition
JPS543201A (en) Burning protection device for resin-molded mini-motor
JPS5331798A (en) Heat-curable resin composition
AU505613B2 (en) Curable epoxy resin composition
JPS52137500A (en) Resin compositions
JPS51119799A (en) A thermosetting resin composition