PH12021551247A1 - High density coil design and process - Google Patents

High density coil design and process

Info

Publication number
PH12021551247A1
PH12021551247A1 PH12021551247A PH12021551247A PH12021551247A1 PH 12021551247 A1 PH12021551247 A1 PH 12021551247A1 PH 12021551247 A PH12021551247 A PH 12021551247A PH 12021551247 A PH12021551247 A PH 12021551247A PH 12021551247 A1 PH12021551247 A1 PH 12021551247A1
Authority
PH
Philippines
Prior art keywords
high density
coil design
density coil
substrate
coil
Prior art date
Application number
PH12021551247A
Other languages
English (en)
Inventor
John L Schumann
Nole D German
Trent A Johnson
Duane M Jelkin
Matthew S Lang
Ryan N Ruzicka
Forrest A Cravens
Todd A Peter
Zachary A Pokornowski
Original Assignee
Hutchinson Technology
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US16/693,125 external-priority patent/US11521785B2/en
Application filed by Hutchinson Technology filed Critical Hutchinson Technology
Publication of PH12021551247A1 publication Critical patent/PH12021551247A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F5/00—Coils
    • H01F5/003—Printed circuit coils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/165—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed inductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10265—Metallic coils or springs, e.g. as part of a connection element

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
PH12021551247A 2018-11-30 2021-05-28 High density coil design and process PH12021551247A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201862774027P 2018-11-30 2018-11-30
US16/693,125 US11521785B2 (en) 2016-11-18 2019-11-22 High density coil design and process
PCT/US2019/062883 WO2020112569A1 (en) 2018-11-30 2019-11-23 High density coil design and process

Publications (1)

Publication Number Publication Date
PH12021551247A1 true PH12021551247A1 (en) 2022-02-14

Family

ID=70853536

Family Applications (1)

Application Number Title Priority Date Filing Date
PH12021551247A PH12021551247A1 (en) 2018-11-30 2021-05-28 High density coil design and process

Country Status (6)

Country Link
JP (1) JP2022510302A (zh)
KR (1) KR20210096196A (zh)
CN (1) CN113330524A (zh)
PH (1) PH12021551247A1 (zh)
TW (2) TW202405253A (zh)
WO (1) WO2020112569A1 (zh)

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5867347A (en) * 1997-06-13 1999-02-02 Hutchinson Technology Incorporated Head suspension with stacked coil microactuator for tracking axis adjustment of a read/write head
US6239979B1 (en) * 1998-11-04 2001-05-29 Intel Corporation Printed circuit board bracket assembly and system
US7447037B2 (en) * 1999-08-04 2008-11-04 Super Talent Electronics, Inc. Single chip USB packages by various assembly methods
FR2825228B1 (fr) * 2001-05-25 2003-09-19 Framatome Connectors Int Procede de fabrication d'un circuit imprime et antenne planaire fabriquee avec celui-ci
JP4191506B2 (ja) * 2003-02-21 2008-12-03 Ｔｄｋ株式会社 高密度インダクタおよびその製造方法
US6924777B2 (en) * 2003-03-17 2005-08-02 Hewlett-Packard Development Company, L.P. Enhanced antenna using flexible circuitry
US20050173152A1 (en) * 2004-02-10 2005-08-11 Post Scott E. Circuit board surface mount package
JP3957000B1 (ja) * 2006-07-07 2007-08-08 株式会社村田製作所 基板実装用アンテナコイル及びアンテナ装置
JP4483869B2 (ja) * 2007-02-01 2010-06-16 ソニー株式会社 像ぶれ補正装置、レンズ鏡筒及び撮像装置
US9859043B2 (en) * 2008-07-11 2018-01-02 Cooper Technologies Company Magnetic components and methods of manufacturing the same
US8344842B1 (en) * 2010-01-20 2013-01-01 Vlt, Inc. Vertical PCB surface mount inductors and power converters
DE102012203251B8 (de) * 2012-03-01 2013-11-07 Bundesdruckerei Gmbh Kontaktlose Datenübertragungseinrichtung, diese enthaltendes Sicherheits- bzw. Wertdokument
WO2015079773A1 (ja) * 2013-11-28 2015-06-04 株式会社村田製作所 電磁石、カメラレンズ駆動装置及び電磁石の製造方法
KR102004791B1 (ko) * 2014-05-21 2019-07-29 삼성전기주식회사 칩 전자부품 및 그 실장기판
JP6585912B2 (ja) * 2015-03-31 2019-10-02 旭化成エレクトロニクス株式会社 カメラモジュール
KR101762024B1 (ko) * 2015-11-19 2017-07-26 삼성전기주식회사 코일 부품 및 그 실장 기판
KR20190082295A (ko) * 2016-11-18 2019-07-09 허친슨 테크놀로지 인코포레이티드 고형상비 전기도금 구조 및 이방성 전기도금 프로세스

Also Published As

Publication number Publication date
CN113330524A (zh) 2021-08-31
KR20210096196A (ko) 2021-08-04
WO2020112569A1 (en) 2020-06-04
JP2022510302A (ja) 2022-01-26
TW202028540A (zh) 2020-08-01
TW202405253A (zh) 2024-02-01

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